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SEMI E30.5-0302 © SEMI 2001, 2002 28 RELATED INFORM A TI ON 1 SEM UNIQUE CA PABILITIES NOT E: This related infor mation is not an of ficial part of SEMI E 30.5 and w as derive d from work developed in the Metrol ogy Spec…

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SEMI E30.5-0302 © SEMI 2001, 200227
14 SEMI E30 Capabilities
14.1 The purpose of this section is to specify any SEMI
E30 Capabilities required by MSEM class equipment.
14.2 Requirement
The following SEMI E30
additional capabilities required by MSEM are:
• Dynamic Event Report Configuration
• Variable Data Collection
• Status Data Collection
• Alarm Management
• Remote Control
• Equipment Constants
• Process Program Management
• Spooling
• Trace Data Collection (optional)
• Control (Host Initiated)
15 Related Documents
Harel, D., “Statecharts: A Visual Formalism for
Complex Systems,” Science of Computer Programming
8 (1987) 231-274.
NOTICE:. SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials mentioned herein. These
standards are subject to change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
SEMI E30.5-0302 © SEMI 2001, 2002 28
RELATED INFORMATION 1
SEM UNIQUE CAPABILITIES
NOTE: This related information is not an official part of SEMI E30.5 and was derived from work developed in the Metrology
Specific Equipment Model Task Force in North America. This related information was approved for publication by full letter
ballot on April 30, 2001.
R1-1. Measurement Site Location
Metrology
equipment most often is used to make measurements
and report results at specific sites on a substrate.
Unfortunately, equipment suppliers and users have
adopted different formats for describing measurement
site location information. This has led to three
problems which increase the cost of metrology. First,
metrology equipment suppliers must provide formats
which meet conflicting requirements of their customers,
adding to equipment development costs. Second, users
must transpose information from different systems to
their own format in order to use metrology data. Third,
site location information is often an integral part of
recipe set up, often requiring that an actual product
sample be available for “training” the site location
information on the equipment. For users who
manufacture many different products on common
substrates, multiple metrology “recipes” must be
developed where the only differences are site location
information. This information is known to the user
from product design data, and should not need to be
"learned" uniquely on various metrology equipment.
R1-1.1 In order to avoid these problems, MSEM
defines specific formats for identifying and reporting
site location information on substrates. The
MSEM-required formats are intended to minimize the
number and type of site location format transformations
needing to be supported by both metrology equipment
suppliers and users. All MSEM-required site location
formats involve the use of an MSEM-defined
right-handed Cartesian coordinate system, established
on substrates in an MSEM-defined manner. This
release of MSEM defines these only for silicon wafer
substrates, based on SEMI standard M20. Additional
substrate types may be included in future revisions of
MSEM, if required.
R1-1.2 MSEM requires that equipment have the
capability to use site location information that is based
on the user's product designs, which the user must
provide in the appropriate MSEM-required format. In
other words, equipment shall not require that a sample
substrate be used to “train” site locations when users
can provide this information from product design data.
R1-1.3 MSEM-compliant equipment shall have the
capability to define, locate, measure, and report site
information using only the MSEM-defined
right-handed Cartesian coordinate system formats. This
requirement does not preclude equipment from having
additional capability for defining or reporting site
location information using other formats. One such
additional format is defined in MSEM for patterned
silicon wafer substrates, based on SEMI standard SEMI
M21. MSEM-compliant equipment is not required to
have this “M21” format capability, but must use the
MSEM “M21” format if it is provided.
R1-1.4 Specific MSEM information that defines site
location information includes ; the data items AlignList
and SiteList; the CPNAMEs CP-ALIGNLIST and
CP-SITELIST and the TABLE type named ALIGN-
DEF-LIST and SITE-DEF-LIST. Notice that multiple
sites can first be Defined using the appropriate Process
Program class named ALIGN-DEF-LIST or SITE-
DEF-LIST, then selected by using the ALIGN-NAME
or SITENAME in an MSEM defined remote command
that use CP-ALIGNLIST AND CP-SITELIST. This
information is similarly defined for the “M21”
coordinate system plus an additional CPNAME of
ELEMENTLIST which lists the ElementIDs to be
measured on the silicon wafers.
R1-2 Coordinate Systems For A Silicon Wafer
R1-2.1 Requirements
MSEM defines two
right-handed Cartesian coordinate systems for use on
silicon wafers. These are identified as the “M20” and
“M20P” coordinate systems. Both are based on SEMI
standard M20. The SEMI M20 standard describes how
to map a right-handed Cartesian coordinate system to a
wafer so that its origin is at the center of the wafer, and
its negative y-axis bisects the wafer's primary fiducial.
This coordinate system is defined by MSEM to be the
“M20” coordinate system. MSEM defines the "M20P"
coordinate systems to be one which is aligned to the
pattern on the wafer. Ideally, there is no difference
between the “M20P” and “M20” coordinate system. In
the real world, there is a difference, due to experimental
errors. This is explained further in the following
sections.
R1-2.2 Implementation
The only information
required by equipment in order to establish an “M20”
coordinate system is the wafer size and type of fiducial.
This is provided by way of the MSEM data items
named WaferSize and Fiducial. Another data item
named Orientation provides for control over how the
wafer is loaded on equipment. Note that the SEMI
SEMI E30.5-0302 © SEMI 2001, 200229
M20 standard requires that the “M20” coordinate
system is fixed on the wafer, and is not affected by how
the wafer is loaded on equipment. Also, as stated in the
SEMI M20 standard, an orientation of “0” is for a wafer
loaded on equipment with the primary fiducial towards
the operator or “down”.
R1-2.2.1 Often, no other information is required for
measurements to be made on a wafer. However, the
“M20” coordinate system may not provide sufficient
accuracy to locate measurement sites on patterned
wafers. This is a result of any of a number of possible
reasons, all of which can be described as “experimental
errors”. For instance, wafers are not perfectly round,
fiducial dimensions may vary, and equipment (both
steppers that place patterns on wafers and metrology
equipment) capabilities to determine the location of the
wafer center and fiducial vary.
R1-2.2.2 In order to deal with these errors, metrology
equipment suppliers have developed various strategies,
as discussed in the introduction section. Perhaps
because the SEMI M20 standard's reference to
“origins” of “other coordinate systems” is in the same
sentence with “reference points”, many suppliers
adopted the location of one (or more) reference point(s)
as the origin for their pattern-based coordinate
system(s). Without a common reference site, multiple
coordinate systems resulted. More nefarious strategies
were developed to compensate for “stage errors” on
equipment. These usually entail a series of reference
points required to “zero in” on the measurement site,
and this made comparison of locations determined on
different equipment next to impossible.
R1-2.2.3 MSEM defines the “M20P” coordinate
system to be one which is identical to the “M20”
coordinate system, if there were no experimental errors.
In other words, the location of the origin and axes of the
“M20P” coordinate system are offset slightly from the
origin and axes of the “M20” coordinate system
because of experimental errors. If the location of
reference points, called “alignment sites” in MSEM, is
defined to be the "M20" coordinates where they are
“expected” to be, and equipment is designed to be able
to “find” the alignment sites, given the various possible
experimental errors, the “found” and “expected” SEMI
M20 coordinates can be used to determine the
“M20-to-M20P” coordinate system transformation, as
explained in appendix 1. Alignment site information is
specified through the use of the MSEM data items
named AlignList, the CPNAME CP-ALIGNLIST and,
the table type named ALIGN-DEF-LIST.
R1-2.2.4 Most metrology equipment cannot distinguish
whether patterned wafer site location errors are due to
the wafer, the layout on the wafer, or the equipment's
ability to locate the sites. However, information that is
available through the use of patterned-wafer alignment
sites can provide a means for identifying potential
metrology equipment problems. For instance, assume
that the only pattern-layout location error on a wafer is
that due to the establishment of the location of the
wafer center and fiducial. For many users and
metrology systems, this is a good assumption. If this is
the case, then the MSEM data item named XlateData
can be used to track this error. Although the error may
result from multiple sources, being able to track it on
various metrology equipment will enable users to apply
statistical process control techniques to identify the
specific sources.
R1-2.2.5 Sites specified for measurements or
additional alignments may be found by metrology
equipment at locations which deviate from their
expected locations through either pattern layout errors
or metrology equipment “stage” errors. Again, in a
controlled manufacturing process, these combined
errors should be normally distributed, and non-normal
deviations may indicate possible metrology equipment
problems. These types of errors shall be reported
through the use of the MSEM data item named Offset.
R1-2.2.6 A minimum of two alignment sites are
necessary to establish an “M20P” coordinate system on
a wafer. Additional sites are often used, as in the
example given in appendix 1. The system supplier shall
document the requirements for ALIGNLIST
information, and detail how any “site-by-site”
alignment sites (that is, those needed to obtain better
location accuracy in the neighborhood of measurement
site) are associated with the specific SITELIST
measurement sites.
R1-2.2.7 Alignment site location information may be
either provided to or by equipment. Some equipment
have the capability to find and report the locations of
“reference sites” without prior knowledge of their
locations on the wafer. In this case, the equipment shall
report the location of both alignment and measurement
sites in “M20” coordinates. When alignment site
information is provided to equipment to establish an
“M20P” coordinate, measurement site locations shall be
reported in the “M20P” coordinate system.
R1-2.2.8 MSEM encourages users to define “M20P”
locations in reference to the user's device layout design
within an ideal SEMI M20 wafer coordinate system.
An alternative is to define “M20P” locations by
“training” on a “benchmark” system.
R1-3 Layout of Rectangular Elements on a Silicon
Wafer
Equipment shall be capable of routine,
automated operation without needing wafer layout
information (e.g., field or die maps). However, having
the capability to provide wafer layout information to