semi合集-English.pdf - 第846页
NOTICE: SEMI makes no warranties or represen tations as to the suitability o f the standards set forth herein for any particular application. The determination of the suitability of the standard is solely the responsibil…
0.994
0.995
0.996
0.997
0.998
0.999
0 20 40 60 80 100 120 140
Refection Coefficient Magnitude
Frequency (MHz)
NOTE 1: This plot is the graphical form of the data shown in Table 2.
Figure 5
Example Data of the Magnitude of the Reflection Coefficient of the Chuck Assembly Plotted as a Function of
Frequency
-200
-150
-100
-50
0
50
100
150
200
0 20 40 60 80 100 120 140
Refection Coefficient Phase (degrees)
Frequency (MHz)
NOTE 1: This plot is the graphical form of the data shown in Table 2.
Figure 6
Example Data of the Phase Angle of the Reflection Coefficient of the Chuck Assembly Plotted as a Function
of Frequency
SEMI E113-1104 © SEMI 2001, 2004 11
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
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By publications of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
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consent of SEMI.
SEMI E113-1104 © SEMI 2001, 2004 12
SEMI E114-0302
E
© SEMI 2002 1
SEMI E114-0302
E
TEST METHOD FOR RF CABLE ASSEMBLIES USED IN
SEMICONDUCTOR PROCESSING EQUIPMENT RF POWER DELIVERY
SYSTEMS
This test method was technically approved by the Global Metrics Committee and is the direct responsibility
of the North American Metrics Committee. Current edition approved by the North American Regional
Standards Committee on March 20, 2002. Initially available at www.semi.org June 2002; to be published
July 2002.
E
This document was editorially modified in May 2002. A change was made to Section 1.1.
1 Purpose
1.1 The purpose of this document is to define a test
method used to determine the electrical length, power
losses, and characteristic impedance variation of RF
cable assemblies used in RF power delivery systems for
semiconductor processing equipment.
2 Scope
2.1 This document specifies the testing procedures and
test equipment required for the following:
• Determining the electrical length of RF cable
assemblies at the nominal operating frequency in
terms of degrees of phase shift.
• Determining the power dissipation (loss) in the RF
cable assembly at the nominal operating frequency.
• Verifying the characteristic impedance of the RF
cable assembly.
2.2 The primary focus for this specification is
semiconductor processing equipment including, but not
limited to, the following tool types:
• Dry etch equipment,
• Film deposition equipment (CVD and PVD).
2.3 This standard does not address any safety or
performance issues related to RF emissions or electrical
codes (e.g., Underwriter’s Laboratory, Inc. (UL), the
National Electrical Code (NEC
), Federal
Communications Commission (FCC)). It is the
responsibility of the users of this standard to conform to
the appropriate local codes and regulations as applied to
this type of equipment, some of which are covered by
referenced documents.
2.4 This standard does not purport to address safety
issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
3 Limitations
3.1 This standard is meant to address RF Cable
Assemblies used in RF systems that primarily operate
in the frequency range of 0.2–100 MHz. It does not
address higher frequency RF systems or microwave
systems.
3.2 This standard assumes that the cable assemblies to
be tested have a nominal characteristic impedance of 50
ohms. This standard can be used with cable assemblies
with a different characteristic impedance if the
appropriate standard termination loads are used.
3.3 International, national, and local codes, regulations
and laws should be consulted to ensure that the
equipment and procedures meet regulatory
requirements in each location.
4 Referenced Standards
4.1 SEMI Standards
SEMI E113 — Specification for Semiconductor
Processing Equipment RF Power Delivery Systems
4.2 IEEE Standards
1
IEEE-STD-383 — IEEE Standard for Type Test of
Class 1E Electrical Cables, Field Splices, and
Connections for Nuclear Power Generating Stations
4.3 Military Standards
2
MIL-C-17G — General Specification for Cables, Radio
Frequency, Flexible and Semirigid
MIL-PRF-39012D — General Specification for
Connectors, Coaxial, Radio Frequency
1 Institute of Electrical and Electronics Engineers, IEEE Operations
Center, 445 Hoes Lane, P.O. Box 1331, Piscataway, New Jersey
08855-1331, USA. Telephone: 732.981.0060; Fax: 732.981.1721
2 Available through the Naval Publications and Forms Center, 5801
Tabor Avenue, Philadelphia, PA 19120-5099, USA. Telephone:
215.697.3321