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SEMI G81-0703 © SEMI 2000, 2003 2 6.2 Also this document does not define com municati on protoc ol at all. If an im plementation requi res transfer data items defined i n the following cha pter, it is necessary to prepar…

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SEMI G81-0703 © SEMI 2000, 2003 1
SEMI G81-0703
SPECIFICATION FOR MAP DATA ITEMS
This specification was technically approved by the Global Automated Test Equipment Committee and is the
direct responsibility of the North American Automated Test Equipment Committee. Current edition approved
by the North American Regional Standards Committee on March 12, 2003. Initially available at
www.semi.org May 2003; to be published July 2003. Originally published October 2000; previously
published March 2003.
1 Purpose
1.1 This document describes the data items that relate
to electronic substrate mapping.
2 Scope
2.1 This document applies only to substrate map data
items.
2.2 This document does not address the transmission,
file naming conventions, storage or archiving of
substrate maps.
2.3 The specification of which data items are optional
and which are required is not specified in this
document.
2.4 The size of each data item described in this
document is maximum size. The actual size may be
further restricted by an application document.
2.5 The order of the data items is not restricted in this
document. The order of the data items may be restricted
by an application document.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Limitations
3.1 There are no known limitations within the defined
scope.
4 Referenced Standards
4.1 SEMI Standards
SEMI E5 — SEMI Equipment Communications
Standard 2 Message Content (SECS-II)
SEMI T9 — Specification for Marking of Metal Lead-
Frame Strips with a Two-Dimensional Data Matrix
Code Symbol
4.2 IEEE Standards
1
IEEE 754-1985 — IEEE Standard for Binary Floating–
Point Arithmetic
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
5 Terminology
5.1 Definitions
5.1.1 bottom side — the bottom side of the substrate as
defined in the corresponding Appendix (Appendix 1, 2,
or 3).
5.1.2 device — the unit to which the device status code
in the map is assigned including, but not limited to: die,
multi-chip modules and packages.
5.1.3 map — a two-dimensional array of bin codes
derived from electrical test data of a substrate
including, but not limited to: wafer, tray, strip, or tape.
5.1.4 substrate — any carrier of a two-dimensional
array of devices including, but not limited to: wafers,
trays, strips, tape, panels, or boards.
5.1.5 top side — the top side of the substrate as defined
in the corresponding Appendix for that substrate
(Appendix 1, 2, or 3).
6 Requirements
6.1 This document does not define format of each data
item specified in the following chapter. In order to
implement this specification, it requires standardized
and/or specific format definition documents.
Standardized format definition documents are those
generic, application specific or equipment specific
specification, supplied by SEMI. They may be format
specification, static file specification or communication
specification, e.g. SEMI E5. Specific format definition
documents may de defined by supplier and user.
1 Institute of Electrical and Electronics Engineers, IEEE Operations
Center, 445 Hoes Lane, P.O. Box 1331, Piscataway, New Jersey
08855-1331, USA. Telephone: 732.981.0060; Fax: 732.981.1721.
Website www.ieee.org.
SEMI G81-0703 © SEMI 2000, 2003 2
6.2 Also this document does not define communication protocol at all. If an implementation requires transfer data
items defined in the following chapter, it is necessary to prepare a custom communication protocol document or to
comply with the appropriate SEMI communication standards.
6.3 This document places no special requirements on the transmission, file naming conventions, storage, or
archiving of substrate maps.
7 Description
7.1 The substrate map data item specifications defined in this document are shown in Table 2. The columns in this
table are described in the following sections.
7.1.1 Item Name Column — the name by which the data item is referenced.
7.1.2 Data Type Column — the type of the data as defined in Table 1.
Table 1 Data Types and Sizes
Type Size Definition
String 0–32767 A string of ASCII characters from zero to “Size” characters in length.
Integer 1,2,4 An integer value that may be represented by “Size” bytes. E.g., if Size = 2 then the value may
be –32768 to 32767.
Float 4 IEEE single-precision 32-bit floating point type [IEEE 754-1985]
7.1.2.1 Generic data type definitions are used so that the data item definitions may be shared by several other
standards, which may have their own distinct data type representations.
7.1.3 Size Column — the maximum number of characters that may be used to represent the data.
7.1.4 Description Column — describes what the data item is and what value restrictions it has.
7.2 Coordinate System Conventions
7.2.1 Whenever reference is made to rows, columns, X or Y they are defined as follows.
7.2.2 The X axis is the horizontal axis from left to right when the substrate is rotated according to [Orientation] in
Table 2. Columns increase along the X axis. Column zero is the column just before the left (or right, depending on
OriginLocation) column containing measured devices.
7.2.3 The Y axis is the vertical axis from bottom to top when the substrate is rotated according to [Orientation] in
Table 2. Rows increase along the Y axis. Row zero is the row just before the extreme top (or bottom depending on
OriginLocation) row containing measured devices.
7.2.4 Columns increase along the X-axis. Rows increase along the Y-axis.
Table 2 Substrate Map Data Items
Item Name Data Type Size Description
FormatRevision String 256 Specifies the exact name and revision of the format used to represent substrate map
data. This field can be used by a parser to automatically determine the format of the
remaining substrate map data.
ProductId String 256 Product identifier
LotId String 32 Production lot identifier for this data.
Orientation Integer 2 The orientation of the substrate in relation to the map data.
This variable will increase in the right (clockwise) direction from 0° .
This item may be used to specify that the map data be rotated. Since the map data is
rectangular, only the values 0, 90, 180, and 270 are allowed in that case.
WaferSize Integer 2 Diameter of Wafer in millimeters.
DeviceSizeX Float 4 Device size on X axis in microns
DeviceSizeY Float 4 Device size on Y axis in microns
SEMI G81-0703 © SEMI 2000, 2003 3
Item Name Data Type Size Description
StepSizeX Float 4 The distance in microns from a reference point on one device to the same reference
point on the adjacent device in the X direction. StepSizeX – DeviceSizeX is equal to
the “street” width between device in the X direction.
StepSizeY Float 4 The distance in microns from a reference point on one device to the same reference
point on the adjacent device in the Y direction. StepSizeY – DeviceSizeY is equal to
the “street” width between device in the Y direction.
FrameId String 32 A character code that may be printed or encoded on the substrate, which uniquely
identifies the substrate, and can be used to correlate the map with physical substrate.
Rows Integer 2 The number of rows of (measured) device matrix on substrate, that is the number of
devices on the Y-axis of the map data. It is required if the type of the map data is
simple array structure.
Columns Integer 2 The number of columns of (measured) device matrix on substrate, that is the number
of devices on the X-axis of the map data. It is required if the type of the map data is
simple array structure.
MapType String 16 Possible variations of data structure, one of which is to be chosen for passing map
data.
This document allows formats of the three types shown below.
[MapType] = ‘Row’: Row/Column Format
Expression using the coordinate showing the head of a row as well as the number of
devices in the row and the bin data of the relevant row.
Each bin data is attached in succession to each row.
Example: X, Y, N, BIN, BIN, BIN, ..., BIN
(N: Number of devices)
[MapType] = ‘Array’: Array Format
All of a substrate’s bin data is expressed in a one-dimensional array form.
Left to right and top down substrate map data will be set in a one-dimensional array.
Example: BIN, BIN, BIN, ...
[MapType] = ‘Device’: Coordinate Format
Expressed by XY coordinates of each device on a substrate as well as bin data.
Even when using this format, to prevent omission of data, it is best to set bin data for
all devices tested in front end processing.
Example: X, Y, BIN, ..., X, Y, BIN
The MAP coordinates set here are values for the state with the substrate orientation
flat rotated to the angle given by [Orientation].
Appendix 1 contains diagrams that illustrate each [MapType].
NOTE: MAP coordinates can also be negative values.
HeadingDeviceX Integer 2 X coordinate of the heading device of a row in the map data.
This item is used when [MapType] = ‘Row’.
HeadingDeviceY Integer 2 Y coordinate of the heading device of a row in the map data.
This item is used when [MapType] = ‘Row’.
DeviceRow Integer 2 Number of the devices on a row in the map data.
This item is used when [MapType] = ‘Row’.
DeviceX Integer 2 X coordinate of the device in the map data.
This item is used when [MapType] = ‘Device’.
DeviceY Integer 2 Y coordinate of the device in the map data.
This item is used when [MapType] = ‘Device’.