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SEMI G75.8-069 8 © SEMI 1998 1 SEMI G75.8-0698 TEST METHOD FOR MEA SUREM ENT OF THE COEFFICIENT OF THERM A L EXP A NSION AND GLA SS TR AN SITION TEMPERA TURE OF LEADFRAME TAPE 1 Summary of Method 1.1 A ther mal mechanica…

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SEMI G75.7-0698 © SEMI 1998 2
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI G75.8-0698 © SEMI 19981
SEMI G75.8-0698
TEST METHOD FOR MEASUREMENT OF THE COEFFICIENT OF
THERMAL EXPANSION AND GLASS TRANSITION TEMPERATURE OF
LEADFRAME TAPE
1 Summary of Method
1.1 A thermal mechanical analyzer is used to monitor
the dimension of a tape sample with temperature
increases to 400°C. It can be made to measure the base
film, adhesive, and the leadframe tape. The results are
obtained as a plot of expansion versus temperature,
from which Coefficient of Thermal Expansion (CTE)
and Glass Transition Temperature (Tg) may be
obtained. CTE above the Tg cannot be measured
because of softening and elongation of the sample.
2 Equipment
2.1 Thermal mechanical analyzer (TMA) with chart
recorder.
2.2 Thermohygrostat
2.3 Cutting die for sample preparation
2.4 Calipers — 0.1 mm accuracy
3 Sampling
3.1 The sampling is one sample per one lot. The
vendor must report the definition of lot, if customer
requires it.
4 Preparation of Specimens
4.1 Cut specimens out of the samples using the cutting
die. The specimens shall be 20 ± 0.1 mm long and 5.0 ±
0.1 mm wide.
4.2 Allow the samples to be stabilized at 23 ± 5°C and
50 ± 5% RH for 16 hours minimum. This may be
carried out in a climate controlled room or in a
thermohygrostat.
5 Equipment Setup and Cal ibration
5.1 Refer to the thermal mechanical analyzer
manufacturer’s manual for setup and calibration
procedures.
Procedure
6.1 Set the specimen to the chuck so that the length of
the specimen under test is 10 ± 0.1 mm. Measure the
specimen length using calipers.
6.2 Attach the chuck to the TMA.
6.3 Zero the recorder.
6.4 Set the Thermal Ramp to 10°C/minute, the
maximum temperature to 400°C, and the load to 2.0 ±
0.2 grams.
6.5 Initiate the test sequence and obtain a chart record
of Elongation of the specimen versus Temperature (see
Figure 1).
6.6 Repeat for all specimens.
6.7 Calculation of Results
6.7.1 Coefficient of Thermal Expansion (k) —
Calculate the CTE using the following equation:
k
=
L
L
×∆
T
where
:
L is the length (mm) of the
specimen at room temperature.
L is the elongation of the
specimen (mm) for a given
temperature difference, T (=C). °
These values are taken from the
chart as shown in Figure 1.
6.7.2 Glass Transition Temperature (Tg)
6.7.2.1 On the chart, draw a best-fit tangent line to the
curve between Point (A) and (B) and a second tangent
between Point (C) and (D) (see Figure 1).
SEMI G75.8-0698 © SEMI 1998 2
Figure 1
Coefficient of Thermal Expansion (CTE)
6.7.2.2 Extend the lower tangent line above its highest
temperature and the higher tangent line below its lowest
temperature until they intersect. The temperature at the
intersection point is the Glass Transition Temperature.
6 Related Documents
NOTE: As listed or revised, all documents cited shall be the
latest publications of adopted standards.
6.1 SEMI Standard
SEMI G13 — Standard Test Method for Expansion
Characteristics of Molding Compounds
6.2 ASTM Specification
1
ASTM D 669 — Standard Test Method for Coefficient
of Linear Thermal Expansion of Plastics
6.3 JIS Specification
2
JIS K 6911Testing Methods for Thermosetting of
Plastics
1 American Society of Testing and Materials, 100 Barr Harbor Drive,
West Conshohoken, PA 19428-2959 (all cited standards may be
found in Volume 10.05 of the Annual Book of ASTM Standards)
2 Japanese Standards Association, 1-24, Akasaka 4 Chome, Minato-
ku, Tokyo, Japan
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.