semi合集-English.pdf - 第7721页

SEMI T11-0703 © SEMI 2002, 2003 6 RELATED INFORMATION 1 OTHER CONSIDERATIONS NOTICE : This rel ated inform ation is not an official part of SEM I T11. It was derived fr om task forc e discussions and is provi ded for ref…

SEMI T11-0703 © SEMI 2002, 2003 5

Pellicle

Frame

Pellicle misalignment (±0.5)

}

Area of

Unpatterned

Chrome Film

6.0

(

End Effector

)

Reticle

misalignment

(

1.5

)

0.7

8.8

14.0 (nominal)

(Edge Exclusion)

Quiet Zone

139.6 ± 0.5 to

Substrate

Reference Corner

(see Figure 2)

110.4 ± 0.5 to

Substrate Reference

Corner (see Figure 2)

1.6

0.7

4.0

3.2

0.4

Data Matrix

Symbol Code

Reference

Corner

0.4

3.2

0.4

NOTE: All dimensions in millimeters.

Figure 3

Detail of Location of Data Matrix Code Symbol with Allowed Clearances to Related Elements

(see Related Information 1, Other Considerations, for Description of these Elements)

NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any

particular application. The determination of the suitability of the standard is solely the responsibility of the user.

Users are cautioned to refer to manufacturer' s instructions, product labels, product data sheets, and other relevant

literature respecting any materials mentioned herein. These standards are subject to change without notice.

The user’s attention is called to the possibility that compliance with this standard may require the use of copyrighted

material or of an invention covered by patent rights. RVSI Acuity CiMatrix has filed a statement with SEMI

asserting that the patented or copyrighted item can be used by the public for the purpose of implementing this

standard without specific license and without payment of royalty or other charge. Attention is also drawn to the

possibility that some elements of this standard may be subject to patented technology or copyrighted items other

than those identified above. Semiconductor Equipment and Materials International (SEMI) shall not be held

responsible for identifying any or all such patented technology or copyrighted items. By publication of this

standard, SEMI takes no position respecting the validity of any patent rights or copyrights asserted in connection

with any item mentioned in this standard. Users of this standard are expressly advised that determination of any

such patent rights or copyrights and the risk of infringement of such rights are entirely their own responsibility.

SEMI T11-0703 © SEMI 2002, 2003 6

RELATED INFORMATION 1

OTHER CONSIDERATIONS

NOTICE: This related information is not an official part of SEMI T11. It was derived from task force discussions

and is provided for reference and information only. This related information was approved for publication by full

letter ballot on August 29, 2002.

R1-1 Other Considerations

R1-1.1 This specification defines only the location of

the ID mark on the reticle surface. However, issues

relating to substrate edge length tolerances, pellicles,

reticle positioning, robotic end effectors and alignment

marks were considered in development of the

specification. These are summarized below and in

Figure R1-1.

R1-1.2 Substrate Edge Length — Table 1 of SEMI P1

specifies that edge length for 6” reticle substrates shall

be ≥ 151.6 mm and ≤ 152.4 mm. Figure 2 represents

this as 152.0 ± 0.4 mm.

R1-1.3 Pellicles — It is assumed that the pellicle is a

square with a nominal size of 124 mm that is centered

on the mask substrate. A pellicle misalignment

allowance of ± 0.5 mm has been suggested by reticle

suppliers and users; this is reflected in Figure 3. An

unpatterened chrome film is specified between the quiet

zone and pellicle frame to eliminate influence on the

reader of light scattered from the pellicle frame when

mark reading illumination and the reader camera are on

opposite sides of the reticle as shown in Figure R1-1.

Effector End

Illuminator

CCD

Camera

Symbol

Pellicle

Reticle

Controller &

Decoder

Figure R1-1

Example of Top-Side ID Illumination with Pattern-

Side Reader and End Effector

R1-1.4 Reticle Positioning — Misalignment in a tool

can result from several factors, e.g. position in the

cassette, position on the end effector, substrate

squareness and others. A reticle misaligment allowance

of ± 1.5 mm has been suggested by stepper and other

tool suppliers and users. This is reflected in Figure 3.

R1-1.5 Robotic End Effectors — End effector grips are

typically ≤ 6.0 mm wide, in the reticle contact area. A

6.0 mm end effector width is shown in Figure 3.

NOTICE: SEMI makes no warranties or

representations as to the suitability of the standards set

forth herein for any particular application. The

determination of the suitability of the standard is solely

the responsibility of the user. Users are cautioned to

refer to manufacturer' s instructions, product labels,

product data sheets, and other relevant literature

respecting any materials mentioned herein. These

standards are subject to change without notice.

The user’s attention is called to the possibility that

compliance with this standard may require the use of

copyrighted material or of an invention covered by

patent rights. RVSI Acuity CiMatrix has filed a

statement with SEMI asserting that the patented or

copyrighted item can be used by the public for the

purpose of implementing this standard without specific

license and without payment of royalty or other charge.

Attention is also drawn to the possibility that some

elements of this standard may be subject to patented

technology or copyrighted items other than those

identified above. Semiconductor Equipment and

Materials International (SEMI) shall not be held

responsible for identifying any or all such patented

technology or copyrighted items. By publication of this

standard, SEMI takes no position respecting the validity

of any patent rights or copyrights asserted in connection

with any item mentioned in this standard. Users of this

standard are expressly advised that determination of

any such patent rights or copyrights and the risk of

infringement of such rights are entirely their own

responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI T12-0305

SPECIFICATION FOR TRACING JIGS AND IMPLEMENTS

This specification was technically approved by the Global Traceability Committee and is the direct

responsibility of the Japanese Traceability Committee. Current edition approved by the Japanese Regional

Standards Committee on November 24, 2004. Initially available at www.semi.org January 2005; to be

published March 2005. Originally published in 2004; previously published July 2004.

1 Purpose

1.1 Semiconductor production equipment may use jigs and/or implements to produce semiconductor devices. Some

case such important conditions as quality of products and tool performance may depend on jigs or implements. This

difference often comes from such historical events as processing cycles, processing products, stocking environment.

To make sure correlation between the conditions and the events tracing jigs and implements is required.

1.2 Purpose of this document is to establish concept to trace jigs and/or implements used on equipment for

processing material and make sure required information, communications and services to realize the concept.

2 Scope

2.1 Scope of this specification includes management of required information on equipment. Because a specific

piece of jig may be used on other equipment, usually same type and/or same supplier, information transfer between

equipment and factory host computer is also in the scope of this specification.

2.2 Such physical issues mark position and mark readers are out of scope, for this specification treats just tracing

information, communication of it and logical management. The physical specification may be standardized

separately.

2.3 As long as management on this specification and above requirement is expected on an equipment, the

equipment is in the scope regardless of the type of process or type of equipment.

2.4 But if jigs and/or implements for certain type of equipment have been already traced or managed complying

with existing standard or along with some specification conventionally, they are out of scope of this specification.

But this specification can be applied even to such jigs and tools if user and/or suppliers want.

2.5 Because this specification describes just base functionalities to realize the traceability, applications of the

functionalities including checking or management of counterfeits are out of scope.

NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish appropriate safety and health practices and determine the

applicability of regulatory or other limitations prior to use.

3 Limitations

3.1 This specification defines and makes sure concept and information transfer basics. Specification about physical

ID marking on jigs and tools including readers/writers, and such application of this tracking as security and

operations are dependent to standard users. They are responsible for their application and related regal issues.

4 Referenced Standards

4.1 SEMI Standards

SEMI E5 — SEMI Equipment Communications Standard 2 Message Content (SECS-II)

SEMI E30 — Generic Model for Communications and Control of Manufacturing Equipment (GEM)

SEMI E39 — Object Service Standard: Concepts, Behavior, and Services

NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.