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SEMI T13-1104 © SEMI 2004 12 co l la b o ra te Xy z Da ta bas e D i e T r a c e Da t a ( DTD) WIP Com put e r Ma c h in e Di e Tr a c e D a ta Tr ace r Ab c An al y sis Sy s te m Tr ac e r Tr ace r Die T ra c e Da t a (D…

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SEMI T13-1104 © SEMI 2004 11
has not mounted any other Circuit Modules yet or it is
on the way of fabrication.
9.5.3.1 Mother Substrate Class Definition — Mother
Substrate inherits Circuit Module. Class definition of
the Mother Substrate is completely same as one for
Circuit Module. This class is redefined to separate class
Die from the other Circuit Module classes for
convenience.
9.5.4 Wafer — This is a type of Mother Substrates
which represents thin disc shape semiconductor
material to fabricate semiconductor devices on it.
Examples are 300 mm diameter silicon wafers and 3
inches diameter gallium arsenide wafers. Some case a
few hundreds of microprocessor dice may be fabricated
on it.
9.5.5 Glass Plate — This is a type of Mother Substrats
which represents thin transparent rectangular glass plate
to fabricate flat panel display devices on it. However it
is usually rectangle, sometimes it may be such other
shape as circle. Some case length of one of ridge is
beyond one meter.
9.5.6 Dicing Frame — This is a type of Mother
Substrates which represents thin rectangular flame
which centers a piece of elastic sticky film to keep a
wafer for dicing. Dicing frame is usually reusable.
9.5.7 Cassette — This is a type of Mother Substrates
which represents one of reusable container to store and
carry Circuit Modules. Contained Circuit Modules are
positioned. Examples are wafer carriers, wafer shipping
boxes, dicing frame magazines and IC trays.
9.5.8 Tray — This is a type of Mother Substrates
which represents a kind of cassettes which holds dice
on two dimensional surface of it. It is often used to
move dice to next process, ship or test.
9.5.9 Lead Frame — This is a type of Mother
Substrates which represents base of a die to package as
a semiconductor device. It has many electrodes to
connect with electrode pads of the die. A few Lead
Frames are often physically linked together before
packaging is completed for convenience of production.
In this sense Lead Frames are a kind of Strip described
later.
9.5.10 Tape — This is a type of Mother Substrates
which represents very long narrow strip flexible
substrate made of plastic film, cloth, paper or hybrid
material to hold electronics elements or small parts for
carrying, feeding or shipping. Usually it is rolled on a
magazine for handling.
9.5.11 PCB — Print Circuit Board. Hard or flexible
substrate with one or multiple layered circuit wiring
conductor patterns an active/passive electronics
elements on one of or both surfaces. This is also a type
of Mother Substrates.
9.5.12 Strip — Usually rectangular or tape shaped
substrate to mount electronics parts. This is also a type
of Mother Substrates.
9.5.13 Cabinet — An enclosure for electronics to keep
from exposure of electrode and/or subcomponents,
and/or to give some means of human operation. Often it
contains PCBs and power supply module with switches
and such display devices as light emission diodes and
flat display panel on it. This is also a type of Mother
Substrates.
10 Detail Concepts
10.1 System Wide Concept — Previous section
describes basic concepts of Die Tracing. Based on
these, this section describes more detailed concepts to
trace dice practically.
10.2
Die Trace System — A system for die tracing
ranges over any entity related to Die Trace Data of the
target Die. From the system point view, there must be
some managing objects to coordinate ensembles in the
system to achieve expected responsibility.
10.3 Die Trace System Linkage — Also it is difficult to
manage a lot of objects and data by just one manager. It
is expected to have more than one manager to
coordinate and manage data and such objects as
Machines and Tracers. They link together to organize a
kind of network as illustrated in the following figure.
SEMI T13-1104 © SEMI 2004 12
collaborate
Xyz
Database
Die Tr ace
Data (DTD)
WIP
Computer
Machine
Die Trace Data
Tracer
Abc Analysis System
Tracer
Tracer
Die Trace
Data (DTD)
Die Trace
Data (DTD)
Machine
Die Trace
Manager
Machine
Machine
Die Trace
Manager
DTD
DTD
DTD
Figure 9
An Example of Die Tracing Manager Network
10.4 Upgraded Ensemble Model — The following
diagram shows practical ensemble model with
managing objects. A Die Trace Manager (DTM)
coordinates, configures and does other managing
responsibility to make whole the system work. For the
other practical update is extensibility of Die Trace
Systems. This model allows consolidation or
connectivity of separated Die Trace Systems easily.
Network of Die Trace Managers makes it possible to
exchange die trace information widely and it gives
scalability of Die Trace System.
collects
1..*
1
..*
asks
Die Trace
Manager (DTM)
Die Tracer
(Tracer)
1..*
manages
Die Trace Machine
(Machine)
Die Trace Client
(Client)
0..*
reports
0..*
networks
Figure 10
Die Trace System Model
10.5 Class Definitions in the Model — Classes appears
in the Die Trace System Model are defined in the
following subsections. Most classes have inheritance
associations and inheriting classes has services of
inherited classes.
10.5.1 Die Trace Client (Client) — This class
represents client to ask something related to Die
Tracing. Also this class represent system user so that
the system may know problematic phenomena or notify
alert about specific Circuit Modules.
10.5.1.1 Responsibility of Die Trace Client — Because
this represents user end of Die Tracing System, it uses
the other part of the system and it is also interface to the
user. This class realizes the following things to
complete the responsibility.
DieTraceClient
showPhenomena
setAlert
Figure 11
Die Trace Client Class
10.5.1.2 Services of Die Trace Client — This class
provides the following services to complete its
responsibility.
10.5.1.2.1 showPhenomena — This optional service
returns problematic phenomena possibly happen on
suspicious Circuit Modules registered on users system.
The phenomena could be a part of Die Trace Data for a
Die Tracer. The phenomena is given by any property to
specify the suspicious Circuit Module or group of those
and the other information about the phenomena.
10.5.1.2.2 setAlert — This optional service sets alert
for a group of Circuit modules. The phenomena must be
a kind of Die Trace Data and it may give information
for the other part of Die Tracing System.
10.5.1.3 Behavior of Die Trace Client — Behavior is
defined to complete responsibility of the Die Trace
Client. The behavior is often specified through
collaboration with outside of this class and state model.
SEMI T13-1104 © SEMI 2004 13
Collaboration is reflected on some association of this
class with others. The collaboration may happen when
some service on this class is requested if the service
needs some related service on any associating class to
complete the original service. They are described in a
part of service definitions above. State model is the
other part of representation of the behavior of this class.
Because this class is stateless, this class defines no state
model.
10.5.2 Die Tracer (Tracer) — This class represents
data collector for die tracing. The data come from Die
Trace Machine or some other entities in the system.
10.5.2.1 Responsibility of Die Tracer — It keeps
collected data somewhere in the system by any means.
However it may have shared database with some other
colleagues to keep the data, this document doesn’t
specify anything about that. How collected data are
managed is out of the scope of this specification and
this document define as much as possible for the case it
has independent data management.
DieTracer
collectDTD
planDTD
showDTD
setForward
catchDTD
enroll
takeDTD
Figure 12
Die Tracer Class
10.5.2.2 Services of Die Tracer — Die Tracer provides
the following services to accomplish its responsibility.
10.5.2.2.1 collectDTD — This optional service collects
further Die Trace Data from data sources, if
subordinates Die Trace Data source has the data, and
replies. If something takes time to collect, it replies
immediate data as much as it has and reports later when
the data is available.
10.5.2.2.2 planDTD — This optional service provides
a capability to set which data are required to be
acquired. If anticipated data cannot be acquired because
such data may not be supplied on specific equipment, it
doesn’t accept this request. It may take time if it needs
to ask process machines whether it has the capability to
provide specified data. Die Tracer replies information
that the service request is acknowledged but detail
possibility is notified later in such cases. This is an
optional service and the means how to specify specific
data item is out of scope of this document because it is
dependent to equipment. If reported data are fixed by
implementation, this service has no effect at all.
10.5.2.2.3 showDTD — This service replies requested
Die Trace Data. Tracer may ask requested data to its
data source before it replies when enough data is not
there. If requested data is not on the tracer and it is
difficult to acquire, it replies no data. If the data item is
strange for the Tracer, it may ask peer Tracer
acquainted or DieTraceManager.
10.5.2.2.4 setForward — This optional service
forwards a part of or all Die Trace Data to specific URI.
Forwarding data should be selectable by category, data
type or originating machine. Also whether the
forwarded data is left on the object or removed should
be selectable. This service is optional and typically used
for specific application or at the time data buffer is
almost full. Interface to receive the data on the URI,
means to send (e.g. SMTP and file transfer) from this
object and application of the data on the URI are out of
the scope of this document. If specified transferring
means is not familiar with this service, an error will be
returned.
10.5.2.2.5 catchDTD — This optional service receives
forwarded Die Trace Data. Die Tracer shall handle the
data without confusion with regular Die Trace Data
coming from subordinate Machines. Usage, purpose
and application of the data are out of the scope of this
document.
10.5.2.2.6 enroll — This optional service registers
specified Die Trace Manager as its supervisory
Manager. Because the manager is only one for the
tracer, this service is used to take over the role of the
Die Trace Manager for the Tracer. This service doesn’t
affect if implementation fixes the Manager.
10.5.2.2.7 takeDTD — This service receives Die Trace
Data from its subordinate Machines. This service is a
notification service and it may be realized by event
subscription of a kind of event channel facility for
particular implementation.
10.5.2.3 Behavior of Die Tracer — Behavior is defined
to complete responsibility of the Die Tracer. The
behavior is often specified through collaboration with
outside of this class and state model. Collaboration is
reflected on some association of this class with others.
The collaboration may happen when some service on
this class is requested if the service needs some related
service on any associating class to complete the original
service. They are described in a part of service
definitions above. State model is the other part of
representation of the behavior of this class. Because this
class is stateless, this class defines no state model.