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SEMI E22.1-1296 © SEMI 1992, 2002 1 SEMI E22.1-1296 (Reapproved 1102) CLUSTER TOOL MODULE IN TERFACE 300 mm: TRANSPORT MODULE END EFFECTOR EX CLUSION VOLUME STANDARD This standard was technically rea pproved by the Globa…

SEMI E22-0697 © SEMI 1991, 2002 6

Figure R1-1

Vertical Plane Exclusion Zone (Elevation View)

(Restricted Case for SEMI Standard Cassette Access)

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SEMI E22.1-1296 © SEMI 1992, 2002 1

SEMI E22.1-1296 (Reapproved 1102)

CLUSTER TOOL MODULE INTERFACE 300 mm: TRANSPORT

MODULE END EFFECTOR EXCLUSION VOLUME STANDARD

This standard was technically reapproved by the Global Physical Interfaces & Carriers Committee and is the

direct responsibility of the North American Physical Interfaces & Carriers Committee. Current edition

reapproved by the North American Regional Standards Committee on July 21, 2002. Initially available at

www.semi.org October 2002; to be published November 2002. Originally published in 1992; previously

published December 1996.

1 Introduction

1.1 The standard provides the requirements to change

the limits of applicability of SEMI E22 from 100 mm to

200 mm diameter wafers to 300 mm diameter wafers.

2 Referenced Standards

2.1 SEMI Standards

SEMI E1.9 — Mechanical Specification for Cassettes

Used to Transport and Store 300 mm Wafers

SEMI E22 — Cluster Tool Module Interface: Transport

Module End Effector Exclusion Volume Standard

3 Requirements

3.1 Wafer Transport Plane Exclusion Zone — All

fixed dimensions remain the same as for SEMI E22

with the following exception. The 25 mm and 10 mm

dimenions for the rectangular space excluded from the

front of the Paddle Exclusion Zone are expanded and

defined by Variables I and H respectively. These

variables are shown in Figure 1. Variables for 250 mm

and 300 mm diameter wafers are specified in Table 1.

Table 1 Wafer Transport Plane Exclusion Zone

Dimensions for 250 mm and 300 mm Diameter

Wafers

Wafer Size

Vbl

250 mm (10 in. nom.) 300 mm (12 in. nom.)

A 270 mm (10.63 in.) 320 mm (12.60 in.)

B 215 mm (8.46 in.) 250 mm (9.84 in.)

C 130 mm (5.12 in.) 225 mm (8.86 in.)

D 122 mm (4.80 in.) 147 mm (5.79 in.)

E 135 mm (5.31 in.) 160 mm (6.30 in.)

F 145 mm (5.71 in.) 170 mm (6.69 in.)

G 122 mm (4.80 in.) 147 mm (5.79 in.)

H 75 mm (2.95 in.) 154 mm (6.06 in.)

I 117 mm (4.61 in.)

G I

Wafer

Transport

Position

Wafer

Transport

xis

Fork Exclusion Zone

Paddle Exclusion Zone

Pedestal or Pin

Exclusion Zone

Transport

Module

10 (0.39)

Figure 1

New Wafer Transport Plane Exclusion Zone Dimensions

3.2 Vertical Plane Exclusion Zone — This zone is illustrated in Figure 2, which defines dimensional values.

Figure 2

Proposed 300 mm Vertical Plane Exclusion Zone (Elevation View)