semi合集-English.pdf - 第6063页
SEMI G9-89 © SEMI 1 980, 199 6 4 8.2 Marking — The outer containe r s s hall be clearly marked identifying th e user stock num ber, user purchas e order number, drawing number, and v e ndor lot numbers within the carton.…
SEMI G9-89 © SEMI 1980, 19963
6.4 Lead and Die Attach Pad Planarity
6.4.1 Lead Planarity — (See SEMI G10, Section 8)
6.4.1.1 Allowable tolerance is given b y the following:
Strip Width
Material Gage,
0.010" (0.25 mm)
Material Gage,
0.008" (0.20 mm)
less than 1.000"
(25.4 mm)
± 0.004"
(0.10 mm)
± 0.003"
(0.08 mm)
1.00" (25.4 mm) to
2.00" (50.8 mm)
± 0.005"
(0.13 mm)
± 0.004"
(0.10 mm)
greater than 2.00"
(50.8 mm)
± 0.010"
(0.25 mm)
± 0.008"
(0.20 mm)
(See SEMI G10, Section 8.)
6.4.2 Die attach pad planarity (see SEMI G10, Section
11).
6.4.2.1 Allowable pad planarity tolerance, downset
pad condition is given by the following:
Strip Width Tolerance
Less than 0.75" (18.75 mm) ± 0.002" (0.05 mm)
0.75" (18.75 mm ) to 1.00" (25.4 mm) +0.003" (0.08 mm)
to
–0.005" (0.13 mm)
Greater than 1.00" (25.4 mm) +0.006" (0.15 mm)
to
–0.003" (0.08 mm)
(See SEMI G10, Section 11.)
6.4.2.2 Allowable pad planarity tolera nce,
undepressed pad condition will not be specified in this
document and is subject to vendor/customer
negotiation.
6.5 Material Tolerance
6.5.1 Material dimensional tolerance s are to be given
by SEMI G4.
6.6 Coil Set
6.6.1 Coil set shall not exceed 0.020" over nominal
length of the cut strip (see SEMI G10, Section 10).
6.7 Crossbow
6.7.1 Crossbow shall not exceed 0.5% of nominal strip
width (see SEMI G10, Section 7).
6.8 Camber
6.8.1 Camber shall not exceed 0.002" (0.05 mm) over
gage length of 6.00" (150 mm) (see SEMI G10, Section
6).
6.9 Strip Pitch
6.9.1 Strip pitch tolerance shall be ± 0.002" (0.05 mm)
over the maximum measurable progression within the
nominal strip length (see SEMI G10, Section 4).
6.10 Burrs
6.10.1 Burrs shall be firmly attached and able to
withstand a probe force of 10 grams. Vertical burrs
inside the dambar shall not exceed 0.001" (0.025 mm).
Vertical burrs outside the dambar and horizontal burrs
in any location shall not exceed 0.002" (0.051 mm) (see
SEMI G10, Section 12).
6.11 Pits (Indentations)
6.11.1 Within function area and on external leads,
there shall be no measurable slug marks. Pits shall not
exceed 0.0003" (0.008 mm) in depth and 0.0005"
(0.013 mm) in largest surface dimension in these areas
(see SEMI G10, Section 13).
APPLICATION NOTE: There is a question regarding the
ability of material suppliers to meet this specification.
Revision of this specification is under review.
6.11.2 In other areas, pits and imperfections shall not
affect leadframe strength regardless of size and shall
not exceed 0.002" (0.051 mm) in depth and 0.005"
(0.127 mm) in largest surface dimensions (see SEMI
G10, Section 13).
6.12 Plating
6.12.1 All plating related characteristics shall be
specified by SEMI G21.
6.13 Strip Length and Cutoff — (See SEMI G10,
Section 14.)
6.13.1 Strip cutoff location shall be ± 0.003" (0.08
mm) of specified nominal location.
6.13.2 Overall strip length shall be ± 0.003" (0.08
mm) of specified nominal length.
6.14 Lead Fatigue — Number of cycles to be
determined between customer and supplier. (See SEMI
G10, Section 16.)
7 Sampling
Sampling will be determined between supplier and
purchaser.
8 Packaging and Marking
8.1 Packaging — Leadframes mus t be packaged in
containers designed and constructed to prevent damage
and/or contamination. Specific protection must be
provided against foreseeable mechanical and
environmental hazards.
SEMI G9-89 © SEMI 1980, 1996 4
8.2 Marking — The outer containers shall be clearly
marked identifying the user stock number, user
purchase order number, drawing number, and vendor
lot numbers within the carton.
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI G10-96 © SEMI 1986, 19961
SEMI G10-96
STANDARD METHOD FOR MECHANICAL MEASUREMENT OF
PLASTIC PACKAGE LEADFRAMES
1 Purpose
This method outlines standard mechanical measurement
techniques for cut strip leadframes.
2 Scope
This method applies to all facilities that perform
mechanical measurements on leadframes. Information
is provided herein to enable the use of the following
specifications: SEMI G9, SEMI G27, and SEMI G28.
3 Referenced Documents
None.
4 Terminology
None.
5 Equipment
1. Surface illuminated optical comparator with x-y
grid
2. Toolmaker’s microscope with depth (“z”) reading
capability, 100×, 400×, obtained with 10× objective,
and 40× objective lens with 0.0002" resolution.
a. Digital readout 0.0002" resolution on x-axis
(optional)
b. Closed circuit TV and camera (optional)
3. Surface plate
4. Gage pins
5. Universal leadframe fixture (see Figure 16)
a. Fixture shall be perpendicular to optics within
the resolution of the instrument and parallel to x
and y travel axes.
b. Leadframe strip shall be placed lead-flat surface
up and clamped at rails to fixture base.
c. The reference plane for measurement,
hereinafter called the “z” plane, is the average of
the height of the two dambars when measured at
their geometric center.
d. Z-plane cannot be established by this method if
the dambar height measurement difference is
greater than 0.003". Therefore, units that exhibit
greater than 0.003" difference are not acceptable
for z-axis measurement.
6. Leadframe camber fixture
a. Nominal strip orientation defined in Figure 8.
7. Lead fatigue tester
8. Metal-to-metal clearance step gage (see Figure 13)
9. 0-1", 0.0001" reading micrometer
10.Overlay (see Figure 17)
a. Overlay reference point shall be based on strip
pilot holes. If pilot holes are off screen, x-y
offsets of overlay pilot position to actual pilot
position shall be specified.
b. True position targets shall be placed on nominal
lead center line 0.0065" (0.163 mm) back from
nominal lead tip.
c. Overlay will contain nominal pad location
outline.
d. Overlay will contain nominal strip cutoff
position and required x-axis traverse for
alignment.
6 Procedure for Lead Twist (Z-Axis) (See
Figure 1)
Equipment — Toolmaker’s microscope (400×
magnification), leadframe fixture.
6.1 Fixture leadframe and establish z-plane as
described in Section 5, items 5a and 5b.
6.2 Focus microscope on the edge of the coined
surface 0.010" back from the end of the lead tip on the
lead to be measured. Ensure that the focus is done on
the flat-coined surface and not on the rolled edge. Zero
the focal height (z-axis).
6.3 Using the micrometer drum, move the stage the
specified distance and refocus the microscope. Ensure
that both focus points are on the flat-coined surface, and
not on the rolled edge. Focal height difference is the
lead twist measurement.