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SEMI M38-1104 © SEMI 1999, 2004 2 NOTICE: Unless otherwise indi cated, all documents cited shall be the latest published versions. 4 Terminology 4.1 Definitions of terms related to silicon wafer technology are gi ven in …

SEMI M38-1104 © SEMI 1999, 2004 1

SEMI M38-1104

SPECIFICATION FOR POLISHED RECLAIMED SILICON WAFERS

This specification was technically approved by the Global Silicon Wafer Committee and is the direct

responsibility of the North American Silicon Wafer Committee. Current edition approved by the North

American Regional Standards Committee on August 16, 2004. Initially available at www.semi.org

September 2004; to be published November 2004. Originally published September 1999; previously

published November 2001.

NOTICE: This document was completely rewritten in

2004.

1 Purpose

1.1 Silicon wafers are often subjected to reclaim

processes in order to improve manufacturing efficiency

in device production. A reclaimed wafer is one that has

been re-conditioned for subsequent utilization.

1.2 This specification covers requirements for

reclaimed silicon wafers to be used for testing and

process monitoring in semiconductor manufacturing.

1.3 In some instances for 300 mm wafers with supplier

marked back surfaces, it is necessary to re-inscribe the

mark after one or more reclaim cycles. Consequently,

this specification also includes an appendix that covers

the re-inscription of such wafers.

NOTE 1: Issues related to the re-inscription of such 300 mm

wafers are discussed in Related Information 1.

2 Scope

2.1 This specification divides reclaimed wafers into

four application categories: Mechanical, Furnace,

Particle, and Lithography and provides tables of the

specification requirements for each category. Thus, a

prospective purchaser of reclaimed silicon wafers needs

to know which application matches his or her

requirements.

2.2 Only requirements for some attributes are specified

in Tables 1 and 2. Other requirements are indicated to

be “customer specified” which means that the customer

may specify a requirement for that particular attribute,

“as-supplied” which means that the attribute has

whatever value was supplied in the wafer delivered (or

used) for reclaim, and “unspecified” which means that

the attribute is not specified and for which the wafer

does not need to be tested.

2.3 In addition to the general categories listed in

Section 2.1, this specification provides requirements for

reclaimed wafers intended for use in advanced device

production, including devices in the 180 and 130 nm

technology generations in a third table.

2.4 This specification is directed specifically to silicon

wafers with one or both polished surfaces. If the wafers

have epitaxial deposits, the attributes of the epitaxial

layer are not included the specification requirements.

2.5 This specification covers reclaim wafers that are

either customer-supplied or third party-sourced. The

user should exercise caution when sourcing materials

with unknown thermal histories, unknown bulk

contamination, or unknown deposits, such as gold (Au)

films.

2.6 For applications placing higher demands on silicon

wafers such as particle counting, measuring pattern

resolution in a photolithography process, or surface ion

contamination monitoring, the customer may want to

reference SEMI M1, SEMI M8, or SEMI M24.

2.7 For referee purposes, U.S. customary units shall be

used for wafers of 2- and 3-inch nominal diameter and

SI (System International), commonly called metric,

units for 100 mm and larger diameter wafers.

NOTICE: This standard does not purport to address

safety issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory or other limitations prior

to use.

3 Referenced Standards

3.1 SEMI Standards

SEMI M1 — Specifications for Polished

Monocrystalline Silicon Wafers

SEMI M8 — Specification for Polished

Monocrystalline Silicon Test Wafers

SEMI M18 — Format for Silicon Wafer Specification

Form for Order Entry

SEMI M24 — Specification for Polished

Monocrystalline Silicon Premium Wafers

SEMI M31 — Provisional Mechanical Specification for

Front Opening Shipping Box Used to Transport and

Ship 300 mm Wafers

SEMI M45 — Provisional Shipping System for 300

mm Wafer Shipping System

SEMI MF1241 — Terminology of Silicon Technology

SEMI M38-1104 © SEMI 1999, 2004 2

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

4 Terminology

4.1 Definitions of terms related to silicon wafer

technology are given in SEMI M1 and in SEMI

MF1241.

4.2 The following definitions apply in the context of

this specification:

4.2.1 furnace wafer — a silicon wafer suitable for

monitoring thermal processes or as an implant monitor,

usually used only in a cleanroom environment.

4.2.2 lithography wafer — a silicon wafer used

specifically for testing lithography equipment wherein

surface flatness is the key attribute, usually used only in

a cleanroom environment.

4.2.3 mechanical wafer — a silicon wafer suitable for

equipment or process testing, usually outside of a

cleanroom environment.

4.2.4 particle wafer — a silicon wafer suitable for

monitoring area or process cleanliness, used only in a

cleanroom environment.

4.2.5 reclaimed wafer — a silicon wafer that has been

reconditioned for subsequent utilization.

5 Ordering Information

5.1 Purchase orders for reclaimed silicon wafers

furnished to this specification shall minimally include

the following items:

5.1.1 Nominal diameter,

5.1.2 Type of application (mechanical, furnace,

particle, lithography, 180 nm, or 130 nm),

5.1.3 A statement that the wafers are customer-

supplied or third-party sourced,

5.1.4 Resistivity,

5.1.5 Any other requirement specified by the customer

(indicated as “customer specified” in the tables),

5.1.6 Any requirements that differ from the tables, and

5.1.7 Methods of testing specified attributes for which

either no or multiple test methods exist (see Sections

7.2 and 7.3.

5.2 Customer specified requirements other than

resistivity may include:

5.2.1 Nominal edge exclusion for FQA,

5.2.2 Wafer ID marking,

5.2.2.1 For 300 mm wafers, whether the wafers are to

be re-inscribed as specified in Appendix 1 or not,

5.2.3 Pits, haze, and/or back surface roughness

(particle or lithography wafers),

5.2.4

Localized light scatterers, and

5.2.5 Edge condition (for 200 and 300 mm wafers

only),

5.3 In addition the following optional criteria may be

included in a purchase order:

5.3.1 Minimum removal requirements (if any),

5.3.2 Lot traceability and lot integrity maintenance

requirements,

5.3.3 Lot acceptance criteria,

5.3.4 Certification, and

5.3.5 Packing and Marking.

5.3.5.1 Note that for packing and marking of 300 mm

wafers, the requirements of SEMI M31 and SEMI M45

shall be observed.

6 Requirements

6.1 The wafers shall conform to the parameters as

specified in the appropriate column of Table 1, Table 2,

or Table 3, as augmented and amended by the purchase

order.

6.2 The wafers shall be capable of being reconditioned

for use.

7 Test Methods

7.1 Values of attributes specified in the tables or

purchase order shall be tested in accordance with the

test methods indicated for the attribute in SEMI M1 or

SEMI M18. Sampling for the test shall be done in

accordance with the requirements of SEMI M1.

7.2 If multiple tests are described for any attribute, the

purchase order shall indicate which test shall be used,

unless the supplier of the reclaimed wafers can make

the choice.

7.3 If no standardized test is available for any attribute,

the test method to be used shall be agreed upon between

purchaser and supplier.

8 Certification

8.1 Upon request of the purchaser in the contract or

order, a manufacturer’s or supplier’s certification that

the material was manufactured and tested in accordance

with this specification, together with a report of the test

results, shall be furnished at the time of shipment.

8.2 In the interest of controlling inspection costs, the

supplier and the purchaser may agree that the material

shall be certified as “capable of meeting” certain

requirements. In this context, “capable of meeting”

shall signify that the supplier is not required to perform

the appropriate tests in Section 9. However, if the

purchaser performs the test and the material fails to

meet the requirement, the material may be subject to

rejection.

9 Packing and Marking

9.1 Special packing requirements shall be subject to

agreement between the supplier and the purchaser.

Otherwise all wafers shall be handled, inspected, and

packed in such a manner as to avoid chipping,

scratches, and contamination, and in accordance with

the best industry practices, to provide ample protection

against damage during shipment.

9.2 The wafers supplied under this specification shall

be identified by appropriately labeling the outside of

each box or other container and each subdivision

thereof in which it may reasonably be expected that the

wafers will be stored prior to further processing.

9.3 For 300 mm wafers, the packing and marking

requirements of SEMI M31 and SEMI M45 shall be

met.

Table 1 Specifications for 150 mm, 200 mm, and 300 mm Silicon Reclaim Wafers

Item Mechanical Furnace Particle Lithography

1.0

General Characteristics

1.1 Growth Method As-supplied

1.2 Crystal Orientation As-supplied

1.3 Conductivity Type As-supplied

1.4 Dopant As-supplied

1.5 Nominal Edge Exclusion for FQA Unspecified Customer specified

2.0

Electrical Characteristics

2.1 Resistivity Customer specified

2.2 Radial Resistivity Variation (RRG) Unspecified

2.3 Resistivity Striations Unspecified

2.4 Minority Carrier Lifetime Unspecified

3.0

Chemical Characteristics

3.1 Oxygen Concentration Unspecified As-supplied Unspecified

3.2 Radial Oxygen Variation Unspecified As-supplied Unspecified

3.3 Carbon Concentration Unspecified As-supplied Unspecified

4.0

Structural Characteristics

4.1 Dislocation Etch Pit Density Unspecified None

4.2 Slip Unspecified None

4.3 Lineage Unspecified None

4.4 Twins Unspecified None

4.5 Swirl Unspecified

4.6 Shallow Pits Unspecified

4.7 OISF Unspecified

4.8 Oxide Precipitates Unspecified

5.0

Wafer Preparation Characteristics

5.1 Wafer ID Marking Customer specified

5.2 Front Surface Thin Films Unspecified None Unspecified None

5.3 Denuded Zone Unspecified

5.4 Extrinsic Gettering Unspecified None Unspecified None

5.5 Backseal Unspecified None Unspecified None

5.6 Annealing Unspecified