semi合集-English.pdf - 第6319页

SEMI G62-95 © SEMI 1995, 2002 4 forth herein for any particular applicatio n. The determination of the suitability of the standard is solely the responsibility of the user. Users are cautioned to refer to manufactu r er’…

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SEMI G62-95 © SEMI 1995, 2002 3
11.3.1 Plating brightness shall be measured at the
center point of the die pad.
NOTE 5: If leadframes do not have a plated die pad, the
location of the brightness test shall be agreed between user
and supplier.
Plating brightness shall be measured using a GAM
densitometer or equivalent per SEMI G55.
11.4 Visual Inspection
11.4.1 Visual inspection may be performed with the
naked eye or a microscope with up to 40× maximum
magnification, as required to confirm results.
11.4.2 Visual inspection shall be performed before and
after functional testing.
11.4.3 Inspection items are listed below.
1. attached silver particles
2. blister
3. bleed-out
4. burnt deposit
5. contamination
6. corrosion
7. discoloration
8. excessive plating
9. foreign material
10. incomplete plating
11. nodule
12. plating nonuniformity
13. peeling
14. pit
15. scratch
16. spot-sparing
17. step plating
18. whisker
11.5 Heat Test
11.5.1 Conditions — The conditions in Table 2 shall be
used to heat test silver plated leadframes.
Table 2 Heat Test Condition
Leadframe Material Bake Temperature Bake Time (min.)
Iron-Nickel Alloy
per MIL-STD-
38510, Type B
400° C ± 5° C 3 min. + 10 (-0) sec.
Cu Alloy 300° C ± 5° C 3 min. + 10 (-0) sec.
Taped Leadframe 275° C ± 5° C 3 min. + 10 (-0) sec.
11.5.2 The test may be carried out on a heater block or
hot plate, or in an oven (furnace). The heat capacity of
the test equipment must be sufficient to avoid
temperature swings outside the specified limits when
the test is started.
NOTE 6: When using a heater block or hot plate, ensure that
air flow does not affect the bake temperature.
11.6 Functional Test
11.6.1 Epoxy Die Bonding — Processes and test
procedures shall be agreed upon between user and
supplier.
11.6.2 Gold Wire Bonding — Processes and test
procedures shall be agreed upon between user and
supplier.
11.6.3 Solderability — Processes and test procedures
shall be agreed upon between user and supplier.
12 Related Documents
12.1 SEMI Specifications
SEMI G8 — Test Method for Gold Plating Quality
SEMI G21 — Specification Plating Integrated Circuit
Leadframes
12.2 JIS Specifications
2
JIS H8501 — Methods of Thickness Test for Metallic
Coatings
JIS H8621 — Electroplated Coatings of Silver for
Engineering Purpose
JIS Z8722 — Methods of Measurement for Color of
Reflecting or Transmitting Objects
JIS Z8741 — Method of Measurement for Specular
Glossiness
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
2 Japanese Industrial Standards, Available through the Japanese
Standards Association, 1-24, Akasaka 4-Chome, Minato-ku, Tokyo
107-8440, Japan. Telephone: 81.3.3583.8005; Fax: 81.3.3586.2014
Website: www.jsa.or.jp
SEMI G62-95 © SEMI 1995, 2002 4
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials mentioned herein. These
standards are subject to change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express writte
n
consent of SEMI.
SEMI G63-95 © SEMI 1995, 2002 1
SEMI G63-95 (Reapproved 0302)
TEST METHOD FOR MEASUREMENT OF DIE SHEAR STRENGTH
This test method was technically approved by the Global Assembly and Packaging Committee and is the
direct responsibility of the Japanese Assembly and Packaging Committee. Current edition approved by the
Japanese Regional Standards Committee on November 26, 2001. Initially available at www.semi.org
December 2001; to be published March 2002. Originally published in 1995.
1 Purpose
1.1 The purpose of this test method is to determine
procedures for die shear strength testing.
2 Scope
2.1 This test method shall be used for the measurement
of the die shear strength when die attach paste is used to
bond a die to a leadframe bond pad.
2.2 This test method shall be used for quality control
and development at die attach paste suppliers and for
incoming inspection and selection of the die attach
paste at die attach paste users.
2.3 This test method can be applicable to die attach
material besides paste material and may be used to
evaluate leadframe bond pad quality.
2.4 This standard does not purport to address safety
issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety health practices and determine the
applicability or regulatory limitations prior to use.
3 Referenced Standards
3.1 Military Specification
1
MIL-STD-883 — Method 2019, Die Shear Strength
4 Terminology
4.1 die — Semiconductor device or an imitation.
4.2 die attach — Bond die and substrate such as
leadframe pad.
4.3 die contact tool — Tool for applying load to the die
for shearing.
4.4 dispense — Deal out paste.
4.5 fillet — Height and shape of die attach paste in
contact with or surrounding the die kerf.
4.6 shear — Have forced completely in X-Y direction.
1 Available through the Naval Publications and Forms Center, 5801
Tabor Avenue, Philadelphia, PA 19120-5099, USA. Telephone:
215.697.3321
5 Summary of Method
5.1 This method is based on measuring the shear
strength between die and leadframe pad bonded by die
attach paste using die shear tester.
6 Equipment
6.1 Die Shear Tester
6.1.1 ± 5% accuracy of full scale
6.1.2 Die contact tool can be in contact with die edge
from end-to-end.
6.2 Hot Plate — optional
6.3 Microscope — optional
7 Material
7.1 Silicon Die — 2 mm × 2 mm × 0.3 to 0.5 mm
7.2 Leadframe
7.3 Die Attach Paste
8 Test Specimen
8.1 Dispense die attach paste by dispensing, stamping,
or screen printing.
8.2 Bond die and leadframe pad.
8.3 Cure the paste per recommendation and allow to
cool to ambient.
NOTE 1: Height of fillet shall be less than half of the
thickness of the die.
NOTE 2: Thickness of die attach paste shall be within the
range of 5 to 30 µ m before or after cure.
NOTE 3: Assembled parts shall not be exposed to a curing
temperature higher than the peak recommended temperature
for more than 30 seconds.
9 Sampling Plan
9.1 Number of specimens tested shall be 5 or more.