semi合集-English.pdf - 第753页

SEMI E101-1104 © SEMI 2000, 2004 2 SEMI E47.1  Provisional Mechanical Specification for Boxes and Po ds Used to Transp ort and Store 300 mm Wafers SEMI E57  Mechanical Specification for Kinematic Couplings Used to Alig…

100%1 / 7923
SEMI E101-1104 © SEMI 2000, 2004 1
SEMI E101-1104
GUIDE FOR EFEM FUNCTIONAL STRUCTURE MODEL
This guide was technically approved by the Global Physical Interfaces and Carriers Committee and is the
direct responsibility of the North American Physical Interfaces and Carriers Committee. Current edition
approved by the North American Regional Standards Committee on August 16, 2004. Initially available at
www.semi.org September 2004, to be published November. Originally published February 2000; previously
published October 2000.
1 Purpose
1.1 Productivity improvement is the task with the
highest priority in semiconductor factories of the 300
mm generation, and computer-integrated manufact-
uring or factory automation (CIM/FA) technologies
become more and more important to accomplish it. The
standardization of these technologies is also necessary
to provide the CIM/FA infrastructure in a short period
of time at a low cost. Since the standards will have to
cover a wide range of production equipment, communi-
cation hardware, and software tools, it is very important
that the standards have a high degree of compatibility.
In order to improve the compatibility, this guide
provides a functional structure model of an Equipment
Front End Module (EFEM) that handles carriers and
substrates at the interface between the factory material
handling system and the process equipment.
1.2 The major purposes of this guide are as follows:
1) provide a common understanding of functions of
EFEM (Equipment Front End Module) and associated
interfaces between functional elements (components
with particular function roles),
2) provide a common understanding of the hierarchical
structure of functions and their interfaces in an EFEM,
3) provide a common understanding of possible units
used for maintenance, adjustment, and control, and
4) provide a map between EFEM functional elements
and existing standards.
2 Scope
2.1 Model Structure and Functions
2.1.1 This document recognizes EFEM as a component
of semiconductor manufacturing equipment. It creates
an EFEM functional structure model to clearly describe
EFEM, its functional elements, and the functions of
each functional element. The functional structure model
includes the following:
1) definition of functional elements that constitute
EFEM,
2) definition of functions of functional elements, and
3) hierarchical description of functional elements.
2.1.2 For clarity, Fixed Buffer Type EFEM and
Internal Buffer Type EFEM (see Terminology) are
represented as independent functional structure models
in this document.
2.2 Preconditions for Modeling
2.2.1 The models are created under the following
conditions:
1) Modeling should be restricted to SEMI E15.1,
Option 1, Options 2 and 3, and Option 3 types. (See
SEMI E15.1, Figure 2 (Load Port Options)).
2) The model supports handling of open cassette (OC),
and Front Opening Unified Pod (FOUP) (see
Terminology).
3) The model is created for the maximum structure
including options.
4) Functional elements that have interfaces with EFEM
are also included in the model.
NOTE 1: Functional elements that don’t belong to EFEM, but
are important in defining interfaces among the functional
elements, are represented in this model to clarify their
functional positions and attributes in the entire equipment.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI E1.9 Mechanical Specification for Cassettes
Used to Transport and Store 300 mm Wafers
SEMI E15 Specification for Tool Load Port
SEMI E15.1 Specification for 300 mm Tool Load
Port
SEMI E19 Standard Mechanical Interface (SMIF)
SEMI E23 Specification for Cassette Transfer
Parallel I/O Interface
SEMI E101-1104 © SEMI 2000, 2004 2
SEMI E47.1 Provisional Mechanical Specification
for Boxes and Pods Used to Transport and Store 300
mm Wafers
SEMI E57 Mechanical Specification for Kinematic
Couplings Used to Align and Support 300 mm Wafer
Carriers
SEMI E64 Specification for 300 mm Cart to SEMI
E15.1 Docking Interface Port
SEMI E84 Specification for Enhanced Carrier
Handoff Parallel I/O Interface
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
4.1 Abbreviations and Acronyms
4.1.1 AGV — automatic guided vehicle (cart)
4.1.2 OHT — overhead transport system with hoist for
lifting carriers between load port level and transport
level.
4.1.3 PGV — person guided vehicle (cart).
4.1.4 PI/O — parallel input/output interface, for
example, as specified in SEMI E23.
4.1.5 RGV — rail guided vehicle (moving on the
floor).
4.2 Definitions
4.2.1 BOLTS plane — a plane parallel to the facial
datum plane near the front of the tool where the box
opener/loader is attached (as defined in SEMI E63).
4.2.2 box — a protective portable container for a
cassette and/or substrate(s).
4.2.3 box opener/loader — the equipment component
that opens wafer carriers (if needed) and presents the
carriers to the equipment’s Substrate Handler for
unloading and loading wafers.
4.2.4 carrier — any cassette, box, or pod that are used
to transport substrates (as defined in SEMI E15).
4.2.5 cart — a floor-based carrier transfer vehicle.
4.2.6 cassette — an open structure that holds one or
more wafer substrates.
4.2.7 docking — the act of locating a floor-based
carrier transport vehicle for carrier transfer to/from
equipment.
4.2.8 equipment front end module (EFEM) — it
consists of the carrier handler that receives carriers
from the factory material handling system on one or
more load ports (as specified in SEMI E15.1), opens the
carriers (if needed), and may include a Substrate
Handler for unloading and loading wafers from the
carrier to the process part of equipment.
4.2.9 fixed buffer — EFEM configuration with carrier
places only on load port units arranged in a load port
group.
4.2.10 front opening unified pod (FOUP) — front
opening type box/pod with non-removable cassettes (as
defined in SEMI E47.1).
4.2.11 internal buffer — EFEM configuration with
carrier places different from load port units.
4.2.12 kinematic coupling — the physical alignment
mechanism on the bottom of the wafer carrier that
consists of features that mate with three vertical pins on
the load port (as defined in SEMI E57).
4.2.13 load port — the interface location on a tool
where carriers are placed to allow the tool to process
wafers (as defined in SEMI E15).
4.2.14 open cassette (OC) — a cassette (as defined in
SEMI E1.9) without a protective barrier around it.
4.2.15 transfer — to either load or unload (as defined
in SEMI E15).
5 Modeling Methodology (General Rules)
5.1 Notation
5.1.1 A functional element to be defined is represented
by a rectangle.
5.1.2 The name of a functional element is written in the
rectangle representing the element.
5.1.3 Numbers preceding the functional element name
indicate the number of elements.
[0, 1] indicates the element may exist or may not exist.
[1+] indicates the element may exist one or more times.
5.2 Rules of Notation Usage
5.2.1 A functional element that is written on the border
between adjacent layers indicates the element may
belong to either of two functional elements in the
adjacent layers.
5.2.2 Functional elements whose position in the
Functional Structure Model diagram are similar in the
two models of Fixed Buffer Type EFEM and Internal
Buffer Type EFEM have the same name.
5.2.3 A functional element whose location is still
undecided between two adjacent layers is located in
between them.
SEMI E101-1104 © SEMI 2000, 2004 3
6 Definition of Functional Elements
6.1 Overall Structure
6.1.1 Figures 1, 2 and Figures 3, 4 show conceptual
structures of two types of Fixed Buffer Type EFEM
model and two types of Internal Buffer Type EFEM
model in overall structure of equipment. Two types of
EFEM exist, when Substrate Handler is installed
outside the Process Part, and when the Substrate
Handler is included inside the Process Part.
6.1.2 EFEM [1] — This is a major module whose
functions are to transfer carriers to and from the factory
material handling system, to provide all carrier handling
and storage functions for production equipment, and to
load and unload substrates from the carrier for
processing. It consists of a Carrier Handler and may
contain a Substrate Handler.
6.1.3 Carrier Handler [1] — A Carrier Handler
receives and passes the carriers from and/or to the
external system (such as the factory material handling
system). A Carrier Handler of the Internal Buffer Type
has the functions of handling and storing the carriers.
A carrier handler for FOUPs has the opener(s) for
opening and closing FOUPs.
6.1.4 Substrate Handler [0,1] — A Substrate Handler
transfers substrates between the carriers and the process
part of the equipment.
6.1.5 Load Port Group [1+] — The load port group is
where carriers are received and passed from or to the
external system (such as the factory material handling
system). Each equipment has at least one load port
group. A load port group consists of one or more load
ports.
1.1.5 Internal Buffer [1+] — This is a buffer that stores
carriers inside equipment. It moves carriers from Load
Port Group to Buffer and moves carriers from Buffer to
Internal Substrate Port. It consists of a Carrier Transfer
Robot that transfers the carriers to or from a Carrier
Storage and a Carrier Storage where carriers are stored.
6.1.6 Internal Substrate Port [0,1+] — This is where
substrates are loaded and unloaded from a carrier, and it
contains any functionality required to present the carrier
for substrate access.
6.2 Definition of Functional Elements for EFEM
Models
6.2.1 Model of Fixed Buffer Type EFEM (see Figure 5)
6.2.1.1 Load Port [1+] — A load port is where an
individual carrier is held for pickup and delivery with
the factory material handling system. It consists of a
Load Port Unit and may contain PI/O for
OHT/AGV/RGV, Cart-to-Tool Docking Port Interface,
and a Load Port Door.
6.2.1.2 Load Port Unit [1] — This physically receives
carriers from/to external systems. It consists of a
Carrier Opener/Loader, and it may contain a Carrier
Operation Panel, a Carrier ID Reader/Writer, and a
Carrier Slot Mapper.
6.2.1.3 PI/O for AGV/RGV/OHT [0,1] — This is a
means of low-level communications that synchronizes
the hand-off between Automated Material Handling
equipment (such as AGV, RGV, OHT) and production
equipment. One Parallel I/O may exist for each stop
position of the AGV, RGV, or OHT. It may be a part
of a Load Port or a Load Port Group depending on the
number of ports that can be accessed from a single stop
position.
6.2.1.4 Cart-to-Tool Docking Port Interface [0,1] —
This is the mechanical interface allocated for installing
the module to be used as a docking means for a person-
guided vehicle (PGV) at the Load Port Group. One
Cart-to-Tool Docking Port Interface may exists per
Load Port Group or per Load Port.
6.2.1.5 Load Port Door [0,1] — This is the door that
may be used to separate the space on a load port from
the external environment, or to prevent the operator
from interfering with the load port mechanism or OHT.
This may be a part of a Load Port or a Load Port Group
depending on the number of ports that can be accessed
through a single Port Door.
6.2.1.6 Carrier Operation Panel [0,1] — This is an
operation panel that may be used when manually
loading or unloading a carrier to or from a Load Port.
One operation panel may exist for each of SEMI
E15.1’s Load Port Option 1 and Option 3 types. No
operation panel may exist for a Load Port of SEMI
E15.1, Option 2 type.
6.2.1.7 Manual Switches [0,1] — These are the
switches that may be used by an operator when
manually loading or unloading a carrier. They are
located on the Carrier Operation Panel.
6.2.1.8 Carrier Indicators [0,1] — These consist of a
Carrier Presence Indicator (that indicates the presence
of a carrier) and a Carrier Placement Indicator (that
indicates whether the carrier is correctly seated). One
set of Carrier Indicators may exist for each Load Port
Unit. They are located on the Carrier Operation Panel.
6.2.1.9 Carrier Opener/Loader [1] — This is the unit
that prepares a carrier for access for loading and
unloading substrates and includes all mechanisms
required for docking and undocking, purging, opening
and closing FOUPs. In the case of an OC, it consists
only of the Load Plate.