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SEMI E119-1104 © SEMI 2002, 2004 3 5 Requirements The FOBIT has t he following c omponent s and sub- component s: Key:  Required feature  Optional feature  Door o n fron t  Holes for latch keys that lock the door to …

SEMI E119-1104 © SEMI 2002, 2004 2

SEMI M1.15 — Standard for 300 mm Polished

Monocrystalline Silicon Wafers (Notched)

SEMI M31 — Provisional Mechanical Specification for

Front-Opening Shipping Box Used to Transport and

Ship 300 mm Wafers

SEMI S8 — Safety Guidelines for Ergonomics

Engineering of Semiconductor Manufacturing

Equipment

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

4 Terminology

4.1 Definitions

4.1.1 bilateral datum plane — a vertical plane that

bisects the wafers and that is perpendicular to both the

horizontal and facial datum planes (as defined in SEMI

E57).

4.1.2 box — a protective portable container for a

carrier and/or substrate(s).

4.1.3 carrier — an open structure that holds one or

more substrates.

4.1.4 carrier bottom domain — volume (below z6

above the horizontal datum plane) that contains the

bottom of the carrier (as defined in SEMI E1.9).

4.1.5 carrier capacity — the number of substrates that

a carrier holds (as defined in SEMI E1.9).

4.1.6 carrier sensing pads — surfaces on the bottom of

the carrier for triggering optical or mechanical sensors

(as defined in SEMI E1.9).

4.1.7 carrier side domains — volumes (from z6 above

the horizontal datum plane to z15 above the top

nominal wafer seating plane) that contain the mizo teeth

or slots that support the wafer and the supporting

columns on the sides and rear of the carrier (as defined

in SEMI E1.9).

4.1.8 carrier top domain — volume (higher than z15

above the top wafer) that contains the top of the carrier

(as defined in SEMI E1.9).

4.1.9 facial datum plane — a vertical plane that bisects

the wafers and that is parallel to the front side of the

carrier (where wafers are removed or inserted). On tool

load ports, it is also parallel to the load face plane

specified in SEMI E15 on the side of the tool where the

carrier is loaded and unloaded (as defined in SEMI

E57).

4.1.10 front-opening box for interfactory transport

(FOBIT) — a transportation box with a front-opening

interface (that mates with a FIMS port that complies

with SEMI E62).

4.1.11 front-opening shipping box (FOSB) — a

shipping box (that complies with SEMI M31) with a

front-opening interface.

4.1.12

front-opening unified pod (FOUP) — a box

(that complies with SEMI E47.1) with a non-removable

cassette (so that its interior complies with SEMI E1.9)

and with a front-opening interface (that mates with a

FIMS port that complies with SEMI E62).

4.1.13 horizontal datum plane — a horizontal plane

from which projects the kinematic-coupling pins on

which the carrier sits. On tool load ports, it is at the load

height specified in SEMI E15 and might not be

physically realized as a surface (as defined in SEMI

E57).

4.1.14 minienvironment — a localized environment

created by an enclosure to isolate the product from

contamination and people.

4.1.15 nominal wafer centerline — the line that is

defined by the intersection of the two vertical datum

planes (facial and bilateral) and that passes through the

nominal centers of the seated wafers (which must be

horizontal when the carrier is placed on the coupling)

(as defined in SEMI E57).

4.1.16 optical wafer sensing paths — lines of sight for

optically sensing the positions of the wafers. Several

horizontal optical wafer sensing paths are present in

between the carrier side domains. In addition, two

vertical optical wafer sensing paths are created by

rectangular exclusion zones in the front of the carrier

top and bottom (as defined in SEMI E1.9).

4.1.17 shipping box — a protective portable container

for a carrier and/or wafer(s) that is used to ship wafers

from the wafer suppliers to their customers.

4.1.18 virtual tracking unit — an entity (which could

be a number of substrates or an individual die or mask

group) that the factory floor control system treats as a

single unit for tracking purposes (as defined in SEMI

E1.9).

4.1.19 wafer carrier — any cassette, box, pod, or boat

that contains wafers (as defined in SEMI E15).

4.1.20 wafer extraction volume — the open space for

extracting a wafer from the carrier (as defined in SEMI

E1.9).

4.1.21 wafer pick-up volume — the space that contains

entire bottom of a wafer if the wafer has been pushed to

the rear of the carrier (as defined in SEMI E1.9).

4.1.22 wafer set-down volume — the open space for

inserting and setting down a wafer in the carrier (as

defined in SEMI E1.9).

SEMI E119-1104 © SEMI 2002, 2004 3

5 Requirements

The FOBIT has the following components and sub-

components:

Key:

 Required feature

 Optional feature

 Door on front

 Holes for latch keys that lock the door to the

FIMS interface when the door is unlatched

from the box

 Holes for registration pins

 Door presence sensing areas

 Top

 Top robotic handling flange (optional)

 Interior

 Non-removable cassette with supports for 25

wafers

 Wafer capture mechanism

 2 end-effector exclusion zones

 Sides

 Ergonomic manual handles (optional)

 Bottom

 5 carrier sensing pads

 Center retaining feature

 Front retaining feature

 4 info pads

 2 advancing box sensing pads

 3 features that mate with kinematic coupling

pins and provide a 10 mm lead-in

 3 features that mate with kinematic coupling

pins and provide a 15 mm lead-in (optional)

 2 bottom side rails for use with roller conveyor

or forklifts (optional)

5.1 Kinematic Couplings — The physical alignment

mechanism from the FOBIT to the tool load-port (or a

nest on a vehicle or in a stocker) consists of features

(not specified in this standard) on the top entity that

mate with three or six pins underneath as defined in

SEMI E57. The three features that mate with the

kinematic coupling pins must provide a lead-in

capability that corrects a FOBIT misalignment of up to

r69 in any horizontal direction.

5.2 Inner and Outer Radii — All required concave

features may have a radius of up to r65 to allow

cleaning and to prevent contaminant build-up. All

required convex features may also have a radius of up

to r66 to prevent small contact patches with large

stresses that might cause wear and particles. Note that

these limits on the radius of all required features are

specified as a maximum (not a minimum) to ensure that

the required features are not rounded off too much. The

lower bound on the radius is up to the FOBIT supplier.

Note also that this radius applies to every required

feature unless another radius is called out specifically.

A required feature is an area on the surface of the

FOBIT specified by a dimension (or intersections of

dimensions) that has a tolerance and not just a

maximum or minimum (such as the edges of the robotic

handling flange).

5.3 Door

— It is recommended that the FOBIT be in a

horizontal orientation when it is opened or closed

(corresponding to the front side of the cassette where

wafers are accessed so the door is perpendicular to the

wafers and parallel to the facial datum plane). The door

and its frame must be designed to mate with a port that

conforms to SEMI E62. Specifically, the FOBIT door

and its frame must have surfaces that mate with the seal

zones and the reserved spaces for vacuum application

(which includes all of the circles bounded by r38 except

for the holes for the registration pins at the center of

each circle) defined in Sections 5.3 and 5.6 of SEMI

E62 (which specifies r38). These FOBIT door and

frame surfaces must be a distance of y52 from the facial

datum plane and must have a flatness of y42. No

surface on the FOBIT door may project further from the

facial datum plan than the door seal zone and the

reserved spaces for vacuum application. The door of the

FOBIT must also be designed so that when the FOBIT

is pressed against the FIMS port, both latch keys on the

port are inserted to their full length. Furthermore, when

the latch keys are turned more than 45 toward the

position that unlocks the FOBIT door, the latch key

holes on the door must be such that the door is not

removable from the latch keys.

5.4 Wafer Capture and Centering — When the FOBIT

is closed, the wafers must be captured in the FOBIT to

prevent movement during subsequent handling,

including transportation. It should be noted that wafers

are typically transported in a vertical orientation and

generally require support from a secondary package. It

is recommended that this secondary package be

designed to allow for easy removal of the FOBIT from

the secondary package.

5.5 Wafer Orientation and Numbering — The wafers

must be horizontal when the FOBIT is placed on the

kinematic coupling, and the wafers slots are numbered

in increasing order from bottom to top (so the bottom

wafer is wafer number 1, the next wafer up is wafer

number 2, etc.).

5.6 Internal Horizontal Dimensions — Figure 1 shows

a cross-section of the horizontal boundaries of the

FOBIT side domains (which contain the parts of the

FOBIT higher than z6 above the horizontal datum plane

and lower than z15 above the top wafer). In this and

following figures, the heaviest lines are used for

surfaces that have tolerances (not surfaces that have

only maximum or minimum dimensions). Table 1

defines the dimensions shown in this figure.

5.7 Internal Vertical Dimensions — Figures 2 through

5 show the vertical dimensions of the internal FOBIT.

Note that z8 (the height of the bottom nominal wafer-

seating plane above the horizontal datum plane) and z12

(the distance between adjacent nominal wafer seating

planes) are given as absolute distances with no

tolerance. This means that the sum of actual height

variations in the FOBIT from the kinematic coupling to

the supporting features holding each wafer must be

contained within the tolerance of z10 with no further

stack-up at each higher wafer. The method for meeting

this requirement is left up to the FOBIT supplier. Table

1 defines all dimensions for Figures 2 through 5.



facial

datum

lane







bilateral

datum

lane



170

ht rear

side domain

left rea

side domain

front side of the FOBIT where wafers are accessed

left front

side domain

wafer

ick-u

area

ht front

side domain

wafer set-

down and

extraction

volumes

2 = 152





2 + 1

–



140



170



140



125



166



134





120



151

Figure 1

Top View of FOBIT Internal Dimensions