semi合集-English.pdf - 第7625页
SEMI T3-0302 © SEMI 1995, 2002 7 by dash es. For shipping boxes contain ing 100 to 200 m m diam eter w afers, slot 01 i s at th e bar end of the box. F or 300 mm FOSBs, slot 1 is specified by SEMI M31 to be at the bottom…
SEMI T3-0302 © SEMI 1995, 2002 6
b. the concatenation character (“+ ”) and Data Identifier for the ID of the wafer in that slot (“32T”) and the ten-
character wafer ID including the two-character vendor identification code. The wafer ID number is comprised
of
i) the first ten characters of the marking codes specified in SEMI M12, SEMI M13, or SEMI T2, or
ii) all ten characters of the marking code specified in SEMI T7.
NOTE 4: The content of the marking code specified in SEMI T1 is not specified. This standard may not be suitable for use with
wafers marked with the marking code specified in SEMI T1.
6.3.4.2 The cassette/box slot sequence assumes slot 01 at the bar end and slot 25 at the other end of the box. Data
matrix code symbols on labels on boxes or cassettes with less than 25 slots shall have one field for each slot.
Table 4 Message Character Content of Matrix Code Symbols
Character
Location Count
Symbol Content Notes
General Information
1–6 6 Message Header <d237>
7 1 Data Identifier “P”
8–41 34 Customer Information (see Table 2) (Customer-assigned)
42–44 3 Concatenation Symbol and Data Identifier “+ 1T”
45–60 16 Lot Number (Supplier-assigned)
61–63 3 Concatenation Symbol and Data Identifier “+ 1V”
64–65 2 Vendor Identification Code (SEMI)
66–67 2 Concatenation Symbol and Data Identifier “+ D”
68–73 6 Labeling Date (YYMMDD) (See Related Information 1)
74–75 2 Concatenation Symbol and Data Identifier “+ Q”
76–7 2 Quantity (unit, EA, implied) (numeric)
77 Subtotal for general information
Wafer Information (Optional, see 6.3.4 and 6.3.4.1)
78–81 4 Concatenation Symbol and Data Identifier “+ 31T”
(See Note 8)
82–83 2 Slot Number (numeric, 01-25)
84–87 4 Concatenation Symbol and Data Identifier “+ 32T”
88–97 10 Wafer Identification Number
20 Subtotal for one wafer
98–577 480 Subtotal for next 24 wafers
500 Subtotal for wafer information
577 Total for General + Wafer Information
Encrypted or Customer-specific Data (Optional)
577–682 up to 105 As needed Otherwise unused character locations (See
Note 9)
NOTE 1: If wafer identification data are not available or are not desired for a particular application, additional supplier-specified and/or
customer-specified data fields may be included in these character locations as agreed upon between customer and supplier. Begin each supplier-
specified field with a data identifier from the series 31T to 34T and each customer-specified field with a data identifier from the series 20T to
24T. Separate adjacent fields with the concatenation symbol (+ ).
NOTE 2: These unused character locations are available for encrypted or unencrypted supplier-specified information or for customer-specified
information. These characters do not appear in the bar code symbol, but only in the Data Matrix Code Symbol. Begin the field with the
concatenation symbol (“+ ”) followed by an appropriate data identifier as defined in Note 1; in the unlikely event that more than one field is
included, begin each field with an appropriate identifier and separate adjacent fields with the concatenation symbol. If the field is not filled
completely with characters it is not necessary to pad with dashes; the encoding software will pad it automatically.
6.3.4.3 All slots shall be represented in the Data Matrix code. The first identification number shall be that of the
wafer in slot 01 at the bar end; the second, that of the wafer in slot 02; and so on. An empty slot shall be designated
SEMI T3-0302 © SEMI 1995, 2002 7
by dashes. For shipping boxes containing 100 to 200 mm diameter wafers, slot 01 is at the bar end of the box. For
300 mm FOSBs, slot 1 is specified by SEMI M31 to be at the bottom of the FOSB.
6.3.5 Any character locations not otherwise used may contain information whose content shall be agreed to between
supplier and customer. These characters may consist of customer-specified data or supplier-specified data (which
may be encrypted) or both.
6.3.6 The data matrix code shall be a square field, constructed in accordance with ISO/IEC 16022, using error
correction code ECC200.
6.3.7 Dot Size — The nominal shape of the dot produced in the matrix may be circular or square, depending on the
printing technique. It is recommended that each " cell" of the data matrix symbol be composed of at least four dots
(a cell with two dots per edge). When printed at 203 dpi, the dot diameter or edge length is 0.125 mm (0.00985 in.).
6.3.8 Symbol Dimensions — Each matrix code symbol shall be composed of 80 rows and 80 columns of cells
spaced equally with cell spacing S (see Figure 3). The nominal outside dimensions of the matrix (C2 and R2 in
Figure 4), printed with 4 dots per cell at 203 dpi is 20 mm.
6.3.9 Border Rows and Columns (see Figure 4)
6.3.9.1 The leftmost border row and the bottom border column shall contain dots in each cell. These are identified
as the primary border row and the primary border column.
6.3.9.2 The opposing (secondary) border row and column shall contain dots in every other cell.
6.3.9.3 These border rows and columns are used by the code reader to determine the origin, size, and orientation of
the matrix.
6.3.9.4 The origin of the matrix code symbol shall be the physical center point of the cell common to the primary
border row and the primary border column.
NOTE 5: This origin location differs from that used in SEMI T2.
6.3.10 Message Characters — The matrix code symbol contains 682 8-bit message characters.
Table 5 Nominal Dimensions of Wafer Box Labels and All Data Fields
Dimension Metric (SI) Value U.S. Customary Value
A (see Note 11) 25 mm 1 in.
B (see Note 11) 0.75 mm 0.04 in.
C (see Note 11) 1.0 mm 0.04 in.
D (see Note 11) 0.50 mm 0.02 in.
E (see Note 11) 2.0 mm 0.08 in.
F (see Note 11) 24.24 mm 0.95 in.
H (see Note 11) 9.0 mm 0.35 in.
J 2.0 mm 0.08 in.
K (see Note 12)
20.0 mm 0.788 in.
L´ 60.06 mm 2.365 in.
L 72.76 mm 2.865 in.
P 119.0 mm 4.69 in.
Q 6.35 mm 0.25 in.
S (see Note 11) 30.0 mm 1.19 in.
T (see Note 11) 24.0 mm 0.95 in.
U (see Note 11) 2.5 mm 0.106 in.
NOTE 1: The Metric (SI) and U.S. Customary values of this dimension are not exact equivalents; the dimension has been rounded to obtain
rational values in both systems.
NOTE 2: Printed at 4 dots/cell and 203 dpi.
SEMI T3-0302 © SEMI 1995, 2002 8
6.3.10.1 The initial six characters are a non-printed
message header. The next 570 characters are restricted
to the Code 39 Character Set (see 6.1.6) using the six-
bit EDIFACT encodation scheme described in Annexe
J3 of ISO/IEC 16022. The remaining 105 message
characters may be any character in the EDIFACT
Encodation Character Set, including unprinted ones.
These 105 characters are available for encrypted or
unencrypted information, as negotiated between
supplier and customer.
6.3.11 Print Quality — To assure reading efficiency, a
minimum contrast of 30% is required between the
reflectance value of a dot and the surrounding label
surface. Various densitometers can provide such
measurements nondestructively.
7 Label Types, Label Dimensions, and
Placement of Data Fields on Labels
7.1 Label Types (see Figure 5 for examples)
7.1.1 Type 1 — Company Field + Data Matrix Field
with hri fields
7.1.2 Type 2 — Company Field + Bar Code Field with
hri fields
7.1.3 Type 3 — Company Field + Data Matrix Field +
Bar Code Field with hri fields. Two of this type of
label are required for use on 300 mm FOSBs.
NOTE 6: The space reserved on the FOSB rear surface
accepts labels as large as 120 mm by 120 mm. This permits
the use of labels wider than is specified in this standard. Such
labels may contain additional information as arranged by
agreement between customer and supplier.
7.1.4 Type 4 — Company Field + Data Matrix Field1 +
Bar Code Field with hri fields + Data Matrix Field2
with hri fields
7.1.5 Type 5 — Company Field + two Data Matrix
Fields, both with hri fields
7.2 Each label shall contain an area containing
Company Information and one or more areas containing
bar codes, data matrix codes, and related human-
readable information.
7.2.1 The Company Information area may contain
supplier-related information in human-readable alpha-
numeric format and other information as agreed to
between customer and supplier.
7.2.2 The other fields that contain bar code, human-
readable, and two-dimensional matrix code data fields,
may be arranged as indicated in the examples shown in
Figure 5.
7.2.3 The human-readable (hri) data fields can be
placed either above or below their associated bar code
data fields. The examples in Figure 5 show the
configuration with the hri fields above the bar code data
fields.
7.3 Approximate overall dimensions of the five label
types shown in Figure 5 are tabulated in Table 6.
7.4 Dimensions of individual fields, label height, and
label length for a type 4 label are given in Table 5 and
Figure 6. Label types 4 and 5 may use perforated label
material so that the sections may be separated after
printing.
Table 6 Overall Dimensions of Box Labels
Length Width
Label
Type
Symbol mm in. Symbol mm in.
1 F+ S 54.2 2.1 A 25.0 1.0
2 F+ L 97.0 3.8 A 25.0 1.0
3 P=F+ T+
L
119.
0
4.7 A 25.0 1.0
4 P+ S 149.
0
5.9 A 25.0 1.0
5 F+ 2S 84.2 3.3 A 25.0 1.0
NOTE 1: For meaning of the symbols, see Table 5.
8 Label Locations on Wafer Box
8.1 For boxes containing wafers from 100 to 200 mm
in diameter, the following recommendations apply.
8.1.1 It is recommended that label type 4 or label type
5 be used for these boxes. These label types may be
printed on perforated label material so that the sections
may be separated after printing.
8.1.2 The recommended location for the larger label is
the center (both vertically and horizontally) of the side
of the cover of the wafer box facing the operator with
the bar end to the left and the wall end to the right (see
Figure 7). Alternatively, this label may be placed in the
center of the same side of the base of the wafer box.
8.1.3 The recommended location for the smaller label
is the center (both vertically and horizontally) of the
wall end of the base of the wafer box (see Figure 7).
Alternatively, this label may be placed at the center of
the wall end of the cover of the wafer box.
8.1.4 It is recommended that the wafer box cover and
the wafer box base each contain a label, so that each
will have a label after they have been separated.
However, in some cases, space limitations may require
that both labels be placed on the same part of the wafer
box.
8.2 For FOSBs containing 300 mm wafers, the
following requirements apply.
8.2.1 Use two identical Type 3 labels.