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SEMI F49-0200 © SEMI 2000 1 SEMI F49-0200 GUIDE FOR SEMICONDUCTOR FACTORY SYSTEMS VOLTA GE S AG IMMUNI TY This g u ide w as technica ll y a pproved by the Global Facilitie s Committee and is t he direct responsibility of…
SEMI F48-0600 © SEMI 20009
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SEMI F49-0200 © SEMI 20001
SEMI F49-0200
GUIDE FOR SEMICONDUCTOR FACTORY SYSTEMS VOLTAGE SAG
IMMUNITY
This guide was technically approved by the Global Facilities Committee and is the direct responsibility of the
North American Facilities Committee. Current edition approved by the North American Regional Standards
Committee on December 15, 1999. Initially available on www.semi.org February 2000; to be published
February 2000.
1 Purpose
1.1 A guide defining a systems approach to power
conditioning is needed for semiconductor and flat panel
display (FPD) facilities. Semiconductor and FPD
factories require high levels of power quality due to the
sensitivity of equipment and process controls.
Semiconductor and FPD processing equipment is
especially vulnerable to voltage sags. The facility
electrical system distributes power to process
equipment, support equipment, and facility
infrastructure equipment. Facility electrical distribution
systems should be designed to integrate the voltage sag
susceptibility of all the equipment with the power
quality supplied by the utility. Installing effective and
efficient facilities power conditioning requires
identification of appropriate conditioning technologies
and properly applying the conditioning equipment.
1.2 Utilizing recommendations in this guide should
result in effective power conditioning of the facility
electrical distribution system such that the process
equipment, associated support equipment and facilities
infrastructure equipment function within acceptable
ranges.
2 Scope
2.1 This guide is intended for facilities engineers,
equipment engineers, and facilities managers who
specify compatibility requirements for equipment and
utility services, and in particular for electrical power
requirements such as those found in SEMI E51.
2.2 This document provides recommendations for
implementing a systems approach to identification and
resolution of voltage sag events that disturb the
performance of semiconductor process equipment. A
program recommending facilities electrical distribution
system monitoring and control strategies for both the
direct and indirect effect of voltage sags on wafer
processing is outlined as follows:
• Reasons for monitoring and conditioning (see
Section 7.1).
• Facilities electrical distribution system power
monitoring and conditioning (see Section 7.2).
• Quantifying process equipment performance (see
Section 7.3).
• Quantifying support equipment and facilities
infrastructure equipment performance (see Section
7.4).
• Utility power monitoring strategies (see Section
7.5).
• Measurement and modeling strategies (see Section
7.6).
• Power enhancing and conditioning strategies for
use in the facilities electrical distribution system
(see Section 7.7).
2.3 This guide does not purport to address safety
issues, if any, associated with its use. It is the
responsibility of the users of this guide to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
3 Limitations
3.1 This guide addresses power quality monitoring and
conditioning solutions primarily within the facilities
electrical distribution system. Process equipment and
utility performance are covered in other related
standards.
3.2 This guide does not address the impact of voltage
sags on equipment beyond the effect to the electrical
components. Effects on interdependent equipment
interlocks are not examined in detail in this document.
3.3 This guide is not intended to address design or
materials issues related to safety which are addressed
elsewhere in the SEMI guidelines (see SEMI S2).
3.4 This document is not intended to supersede
international, national or local codes, regulations and
laws. Each should be consulted to ensure that the
equipment meets regulatory requirements in each
location.
4 Referenced Standards
4.1 SEMI Standards
SEMI S2 — Environmental, Health, and Safety
Guideline for Semiconductor Manufacturing Equipment
SEMI F49-0200 © SEMI 2000 2
SEMI E51 — Guide for Typical Facilities Services and
Termination Matrix
4.2 IEEE Standards
1
IEEE 1100 — IEEE Recommended Practice for
Powering and Grounding Sensitive Electronic
Equipment
IEEE 1159 — IEEE Recommended Practice on
Monitoring Electrical Power Quality
IEEE 1346 — IEEE Recommended Practice for
Evaluating Electric Power System Compatibility with
Electronic Process Equipment
NOTE 1: As listed or revised, all documents cited shall be the
latest publications of adopted standards.
5 Terminology
5.1 facilities infrastructure equipment — component,
modules, and systems used to transport materials like
chemicals, power, water, effluent, and exhaust in
semiconductor factories.
5.2 process equipment — fabrication equipment,
inspection equipment, and cassette stage equipment
used in semiconductor manufacturing.
5.3 support equipment — ancillary equipment not part
of the process equipment main chassis.
5.4 voltage sag — an rms reduction in the ac voltage,
at power frequency, for durations from half-cycle to a
few seconds.
6 Impact
6.1 The primary goal of this guide is mitigation of the
effects of utility voltage sags on semiconductor
processing equipment, support equipment, and facilities
infrastructure equipment. A voltage sag event
adversely affecting only one of these pieces of
equipment can cause processing equipment to
malfunction. Both the direct and indirect effect of
voltage sags on process equipment should be managed.
Voltage sags can effect process equipment directly
through the electrical power points of connection.
Voltage sags can also indirectly effect process
equipment through fluctuations in air, gas, liquid, and
other utility streams caused when voltage sags effect
support equipment and facility infrastructure
equipment.
6.2 Examples of processing equipment, support
equipment, and facilities infrastructure equipment are
1 The Institute of Electrical and Electronic Engineers, Inc. (IEEE),
345 East 47th Street, New York, NY 10017-2394, USA
listed below. The interaction of these three types of
equipment is shown in Figure 1.
6.2.1 Process Equipment
• Etch (dry & wet)
• Film deposition (CVD & PVD)
• Thermal
• Surface prep and clean
• Photolithography (exposure & coater/developer)
• Chemical Mechanical Polishing
• Ion Implant
• Metrology
• Automated test
6.2.2 Support Equipment
• Vacuum system (roughing, turbo, and cryogenic
pumps)
• RF generator
• Residual gas analyzer (RGA)
• Water heater
• Chiller
• Photolithography stepper laser light source power
supplies
• Photolithography coat/developer temperature/
humidity controllers
• Emission control (burn boxes)