semi合集-English.pdf - 第1418页
SEMI E30-1103 © SEMI 1992, 2003 92 GEM Host CMP Equipment (GEM Compliant) Thickness Metrology Post-process Thickness Measurement Equipmen t Constant Send: Time Recip e Parameter Figure A.8.1 CMP Single Wafer “Polishing” …

SEMI E30-1103 © SEMI 1992, 2003
91
A8.2 Equipment Constants
A8.2.1 Incremental process parameter modification for
process and equipment control can be supported over a
GEM interface by using the Equipment Constants GEM
capability (see Section 4.5). With this capability, each
process parameter (or process parameter at a step) that
can be modified, e.g., for purposes of process control,
is associated with an equipment constant. Using the
Equipment Constant GEM scenarios (see Section 4.5.5)
the host can (1), send process parameters or parameter
modifications, (2), request current values of modifiable
recipe parameters, (3), retrieve name lists of equipment
constants associated with modifiable parameters, and
(4), be informed by the equipment when an operator
changes one of the modifiable process parameters.
A8.2.2 The equipment constants should represent the
actual values of the process parameters with which they
are associated. Depending on the equipment operation
and control application, the equipment constant could
represent the actual value of a process parameter at a
recipe step, or over the entire recipe. The equipment
constants could also be utilized to represent the
differentials of process parameters from nominal
values. However it is important to note that, when
using differential values to relate process parameter
modifications, any loss of synchronization between
equipment and host could result in an incorrect
assessment of the value of a process setpoint by the
host. Note also that, upon system startup, and whenever
the appropriate process parameters are modified, the
equipment constants should also be modified as
necessary to always reflect the (absolute or relative)
values of the associated process parameters.
A8.2.3 In order to maintain synchronization between
equipment and host, it is recommended that equipment
constants associated with recipe parameters be applied
to only override the currently selected and active recipe.
A selected recipe is considered to be active whenever
the equipment is in the “PROCESSING” state and the
recipe is the currently selected recipe (process
program). If multiple recipes are utilized during one
process event, e.g., cluster tool scenario, it is
recommended that separate equipment constants be
utilized for each recipe/process parameter pair.
A8.2.4 Note that timing and traceability issues
associated with utilizing the equipment constants
capability (for process control) are application specific
and beyond the scope of this application note.
Equipment that provides for recipe parameter overrides
though setting of Equipment Contstants should also
provide additional Equipment Constants for the set that
includes the name of the associated process program
and a Boolean variable to enable and disable the
override feature. In addition, the supplier should
document for each parameter: (1), the associated
Equipment Constant, and (2), any restrictions on the
state (active or not) or the recipe in which the parameter
may be modified. Also, since override of the process
setpoints may be provided by a Host controller
application element, it is recommended that the
equipment provide an event report whenever the
associated recipe has been modified.
A8.3 Example
A8.3.1 In the example of Figure A.8.1, a Chemical-
Mechanical Planarizer (CMP) single wafer “polishing”
system includes a GEM compliant planarizer
(equipment), a thickness metrology unit and a (host)
controller. The tool polishes a wafer to a target
thickness. The post-process thickness is measured by
the metrology unit and reported to the host controller.
The controller utilizes a feedback control algorithm to
determine the appropriate polish “time” recipe
parameter for the next wafer. This time should be
reported to the CMP equipment utilizing the
equipment’s GEM interface so that the information can
be utilized for the next wafer processing event.
A8.3.2 The mechanism described in this application
note could be utilized to implement process control as
follows. A settable equipment constant is associated or
“linked” with the “time” parameter on the equipment.
Equipment system documentation indicates the linkage
and the conditions under which the linkage is valid.
When the controller determines an appropriate “time”
parameter value for the next wafer to be polished, it sets
the equipment constant to this value (see Section 4.5).
The equipment is configured to accept this equipment
constant change and, if the equipment is in (or possibly
when the equipment reaches) the appropriate state, the
recipe parameter is modified.

SEMI E30-1103 © SEMI 1992, 2003
92
GEM Host
CMP
Equipment
(GEM Compliant)
Thickness
Metrology
Post-process Thickness
Measurement
Equipment Constant
Send: Time Recipe Parameter
Figure A.8.1
CMP Single Wafer “Polishing” System with Host Recipe Parameter Modification Capability
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.

SEMI E30-1103 © SEMI 1992, 2003
93
Index
A
ABORT .........................................................................................................................................................14, 17, 36
AbortLevel.................................................................................................................................................................36
alarm................................................................................................................5, 17, 21, 31, 32, 33, 34, 35, 50, 62, 73
ALARM CLEAR.................................................................................................................................................32, 33
Alarm Management.......................................................................................................................1, 17, 31, 63, 67, 69
Alarm Report...........................................................................................................................................31, 34, 35, 65
ALARM SET.................................................................................................................................................31, 32, 33
alarm text...................................................................................................................................................................34
Alarm Text.................................................................................................................................................................34
AlarmID...............................................................................................................................................................62, 63
AlarmsEnabled ........................................................................................................................................31, 34, 62, 67
AlarmsSet ....................................................................................................................................31, 33, 34, 62, 63, 67
ALCD ............................................................................................................................................................31, 34, 62
ALCD
n
......................................................................................................................................................................33
ALID .......................................................................................................................................................32, 34, 62, 73
ALIDn ...................................................................................................................................................................1, 32
ALTX ..................................................................................................................................................................32, 34
Anytime Capabilities .............................................................................................................................................2, 71
B
button...................................................................................................................................................................45, 72
Button ........................................................................................................................................................................72
buttons ...................................................................................................................................................................5, 72
Buttons...................................................................................................................................................................2, 72
C
CEID..........................................................................................................................21, 26, 27, 28, 39, 41, 62, 63, 78
clock ..............................................................................................................................................................24, 50, 71
Clock .......................................................................................................................................1, 18, 50, 62, 63, 67, 69
COMMACK..................................................................................................................................8, 10, 11, 18, 19, 20
CommDelay.....................................................................................................................................................8, 10, 11
COMMUNICATING ......................................................................................9, 10, 11, 12, 18, 19, 20, 52, 53, 55, 72
communication failure.........................................................................................................5, 8, 10, 11, 15, 47, 52, 54
Communication failure..............................................................................................................................................11
communication fault........................................................................................................................................5, 10, 47
Communication Fault ..........................................................................................................................................47, 49
communication link.....................................................................................................................................................8
communications failure .........................................................................................................................................8, 55
compliance.............................................................................................................................................5, 6, 67, 68, 78
Compliance................................................................................................................................1, 2, 4, 5, 6, 67, 68, 69
Compliance Statement...............................................................................................................................................68
COMPLIANCE STATEMENT ................................................................................................................................69
compliant.............................................................................................................................................................68, 69
Compliant ..................................................................................................................................................................68
COMPLIANT............................................................................................................................................................69
connection transaction failure......................................................................................................................8, 9, 10, 18
Connection transaction failure...................................................................................................................................11
control......................................................................................4, 5, 6, 7, 12, 14, 25, 31, 35, 39, 54, 58, 59, 62, 76, 77
Control.........................................................................1, 2, 3, 5, 12, 15, 18, 26, 58, 59, 60, 61, 63, 64, 67, 68, 69, 76
CONTROL ....................................................................................................................1, 3, 12, 13, 14, 15, 58, 59, 76