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SEMI G1-96 © SEMI 1 980, 199 6 9 10.2.1 Die Attach 10.2.1.1 Vi sual Inspection • Eutectic Bonding — Visua lly inspect the alloy we t- out after die attach . The minimum wet out requirem ent shall be 100% of t he die peri…

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SEMI G1-96 © SEMI 1980, 1996 8
Figure 8
SEMI G1-96 © SEMI 1980, 19969
10.2.1 Die Attach
10.2.1.1 Visual Inspection
• Eutectic Bonding — Visually inspect the alloy wet-
out after die attach. The minimum wet out
requirement shall be 100% of the die perimeter.
• Silver Glass or Resin Bonding — 100% die
perimeter coverage shall be required.
NOTE 10: 100% coverage for silver glass or resin bonding is
not a function of base acceptability but is required to
standardize die shear testing. The inability of the resins to wet
the surface of the die attach area due to contamination is
cause for rejection.
10.2.1.2 Die Shear Test — Perform destructive testing
in accordance with MIL-STD-883, Method 2019.
NOTE 11: Test may also be performed after environmental
testing. In the case of very large die, this test may not be
appropriate to fully evaluate the package. In these cases, die
sizes agreed upon between user and supplier shall be used.
Alternatively, die pull testing may be used by agreement
between user and supplier. Inspection for die attach voids may
be performed radiographically in accordance with Section
10.2.1.3 in order to ensure that the die attach process does not
contribute to an incorrect evaluation of the shear or pull test
results. In the case of eutectic die attach, the results from
these methods may also be indicative of poor functionality of
the gold die-attach metallization.
10.2.1.3 Void Inspection — Inspection for die-attach
voids may be performed radiographically in accordance
with MIL-STD-883. Method 2012 or ultrasonically in
accordance with MIL-STD 883, Method 2030.
10.2.2 Wire Bond — On wire bonds which meet the
requirements of MIL-STD-883, Method 2010, perform
destructive pull testing in accordance with MIL-STD-
883, Method 2011, Test Condition D.
NOTE 12: Bonds which cause lifted metallization from the
lead fingers shall also be cause for rejection.
NOTE 13: This test may be performed at pre seal and post-
seal.
10.2.3 Seal
10.2.3.1 Visual Inspection — The glass sealant
appearance and flow shall be visually inspected for
conformance to criteria agreed upon between user and
supplier.
10.2.3.2 Hermeticity — Performed in accordance with
MIL-STD-883, Method 1014, Test Condition A or B
and C, the package must maintain hermetic integrity
after each environmental test or sequence of tests.
NOTE 14: Internal water-vapor content may also be measured
in accordance with MIL-STD-883, Method 1018.
10.2.3.3 Cap Torque Test — The failure criteria shall
be agreed upon between user and supplier.
10.2.4 Lead Finish — Plate according to a process
agreed upon between user and supplier.
10.2.5 Lead Trim
10.3 Environmental Testing — Environmental
evaluation shall include, but not be limited to, the
following tests:
NOTE 15: The sequence of testing and the sample sizes for
each sub-group shall be agreed upon between user and
supplier.
10.3.1 Temperature Cycle — In accordance with MIL-
STD-883, Method 1010, Condition C.
10.3.2 Thermal Shock — Per MIL-STD-883, Method
1011, Condition B.
10.3.3 Vibration Fatigue — In accordance with MIL-
STD-883, Method 2005, Test Condition B.
10.3.4 Mechanical Shock — In accordance with MIL-
STD-883, Method 2002, Test Condition B.
10.3.5 Constant Acceleration — In accordance with
MIL-STD-883, Method 2001, Test Condition A.
10.3.6 Moisture Resistance — In accordance with
MIL-STD-883, Method 1004.
10.3.7 Additional Testing — Additional tests
performed during package qualification may include
evaluation of electrical and thermal characteristics,
corrosion resistance and alpha particle emissions. These
tests may be performed on a periodic basis to maintain
package qualification. These tests may include, but are
not limited to, the following:
10.3.7.1 Insulation Resistance — In accordance with
MIL-STD-883, Method 1003, to test conditions agreed
upon between user and supplier.
10.3.7.2 Lead Inductance — In accordance with SEMI
G23 or using an impedance analyzer by a method
agreed upon between user and supplier.
10.3.7.3 Lead-to-Lead Capacitance — Per SEMI G24.
10.3.7.4 Lead Resistance — Per SEMI G25.
10.3.7.5 Junction-to-Case Thermal Resistance — In
accordance with SEMI G30 or a wind tunnel method
agreed upon between user and supplier.
10.3.7.6 Alpha particle emission shall be tested by a
method and to limits agreed upon between user and
supplier.
10.3.7.7 Salt Atmosphere (Corrosion) Testing — In
accordance with MIL-STD-883, Method 1009,
SEMI G1-96 © SEMI 1980, 1996 10
10.3.7.8 Condition A shall be performed to conditions
agreed upon between user and supplier.
11 Sampling
The sampling plan used at incoming inspection shall be
based on MIL-STD-105 and agreed upon between user
and supplier (see Figure 8).
12 Packaging, Marking, and Packing List
12.1 Packaging — The shipping containers and
materials shall be suitably designed to provide the
components or sub-assemblies with protection against
normal transportation damage risks which include
crushing, spillage, and exposure to moisture and other
corrosive gases.
The inner packaging materials must not cause
particulate contamination of the components or sub-
assemblies and shall be cleanroom compatible as
defined by the user. The components or sub-assemblies,
in packing trays, shall be vacuum-sealed in a bag with a
desiccant.
12.2 Marking
12.2.1 Internal Packages — Each internal package
shall be clearly marked with the following information,
as appropriate:
• User’s part number,
• User’s purchase order number,
• Drawing number (user’s and/or supplier’s, as
requested by user),
• Quantity, and
• Date of manufacture.
The package shall also contain any agreed upon
certification data.
12.2.2 External Packages — The packing list on the
outside of the external package shall contain the
following information:
• User’s part number,
• User’s purchase order number,
• Quantity,
• Shipping date, and
• Any specific instructions for receiving dock
personnel.
13 Certification
13.1 Upon request of the user in the contract or
purchase order, a supplier’s certification that the
product was manufactured and tested in accordance
with this specification, together with a report of the test
results, shall be furnished at the time of shipment.
However, if the user does perform inspection and test
on a certified shipment, and the product fails to meet
the requirements, the product shall be subject to
rejection.
13.2 If the user and supplier agree, the product may be
certified as capable of meeting this specification. In this
context, capable of meeting signifies that the supplier is
not required to perform all the inspections and tests.
However, if the user does perform inspection and test
on a certified shipment, and the product fails to meet
the requirements, the product shall be subject to
rejection.