semi合集-English.pdf - 第6021页

SEMI G2-94 © SEMI 1994 1 SEMI G2-94 SPECIFICA TION FOR METALLIC LEA DFR A M ES FOR CER-DIP PA CKA GES 1 Preface 1.1 Pur pose — This specification d e fi nes the materials and dim ensions for the m etal lic leadframe (sta…

100%1 / 7923
SEMI G1-96 © SEMI 1980, 199613
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI G2-94 © SEMI 19941
SEMI G2-94
SPECIFICATION FOR METALLIC LEADFRAMES FOR CER-DIP
PACKAGES
1 Preface
1.1 Purpose — This specification defines the materials
and dimensions for the metallic leadframe (stamped or
etched) used in the construction of Cer-DIP Package.
1.2 Scope — The criteria detailed in this document
applies to the iron-nickel leadframe (MIL-M-38510
Type A or Type B) used in Cer-DIP packages.
1.3 Units — U.S. Customary (inch -pound) or metric
(SI) units may be used at the customer’s discretion.
This specification uses the U.S. Customary units as the
prime unit.
2 Referenced Documents
1
2.1 This document specifically refers to:
MIL-I-23011 — Iron/Nickel Alloys for Sealing to
Glasses and Ceramics
MIL-M-38510 — General Specifications for
Microcircuits
MIL-STD-883 — Test Methods and Procedures for
Microelectronics
2.2 Related information may also be found in:
MIL-STD-105 — Sampling Procedures and Tables for
Inspection by Attributes
3 Terminology
bonding area — Coined area on bond fingers within a
distance of 0.762 mm (0.030") from lead tips.
bottom formed width — See Figure 3.
bow — Curvature of the leadframe strip in the vertical
plane; see Figure 1.
burr — Fragment of excess parent material attached to
the leadframe edges.
camber — Curvature of the leadframe strip edge in the
horizontal plane; see Figure 2.
coined area — The area of the bond fingers planished
to produce a flattened area for functional use; see
Figure 3.
coplanarity — The total indicator reading difference of
the lead tips in the Z direction.
1 Military Standards, Naval Publications and Form Center, 5801
Tabor Ave., Philadelphia, PA 19120
datum plane — M is datum plane; see Figure 3.
discoloration — A darkening or staining of the
aluminum (metallization).
foreign material — Any adhering residue which is not
part of the leadframe composition.
pit — A shallow surface depression or crater with a
visible edge.
planarity — Total indicator reading of the lead tips in
the Z direction relative to datum M.
projection — A raised portion of the surface indigenous
with the parent material, other than a burr.
slug marks — Random dents in the leadframe.
stamped leadframe terminology — See Figure 3.
tilt — The deviation of the plane of the coined area
from a condition parallel to the plane on datum M.
top formed width — See Figure 3.
twist — The angular rotation of one end of the
leadframe or strip with reference to the other end; see
Figure 4.
void — An absence of aluminization from a designated
area of the leadframe.
4 Ordering Information
Purchase order for Cer-DIP metallic leadframes
furnished to this specification shall include the
following items:
4.1 Current drawing of the leadfra me showing all
dimensions and tolerances, including the location of the
metallization layer.
4.2 Material,
4.3 Number of leads,
4.4 Material tensile strength,
4.5 Metallization thickness and type,
4.6 Form of leadframes (i.e., singles, scored strips, or
unscored strips),
4.7 Number of frames per strip; as applicable,
4.8 Material certification,
4.9 Packaging and marking.
SEMI G2-94 © SEMI 1994 2
5 Dimensions
All Dimensioning and tolerancing shall conform to
Y14.5. Table 1 presents standard leadframe dimensions.
6 Materials
6.1 Leadframe Base Material — Tensile strength shall
be specified per MIL-I-23011.
6.1.1 Chemical Composition — Shall conform to the
requirements of MIL-M-385l0, Type A or B.
6.1.2 Material Tensile Strength — Shall be supplied
per MIL-I-23011.
6.2 Metallization — Aluminum
6.2.1 Thickness — 100 microinches minimum, 600
microinches maximum (micromin, micromaximum).
6.2.2 Coverage — 0.030" (0.762 mm) minimum;
measured from lead tip. Maximum to be determined by
ceramic size.
6.2.3 Composition
6.2.3.1 Clad Material — 99.4% minimum aluminum.
6.2.3.2 Vapor Deposition — 99.9% minimum
aluminum.
NOTE: The two types of aluminum may exhibit different
visual appearances and non-functional characteristics after
processing.
7 Defect Limits
7.1 Burrs
7.1.1 Horizontal
7.1.1.1 Bonding Area — 0.001" (0.025 mm) max.
7.1.1.2 Other Areas — 0.002" (0.051 mm) max.
7.1.2 Vertical
7.1.2.1 Bonding Area — 0.001" (0.025 mm) max.
7.1.2.2 Other Areas — 0.002" (0.051 mm) max.
7.2 Planarity/Coplanarity — Shall not exceed the
limits shown in Table 2.
7.3 Foreign Materials — Leadframes shall be clean
and free from foreign material such as photoresist,
lubricants, solvent residue, water marks, and rust spots.
Protective coatings acceptable to both vendor and user
are not considered foreign material.
7.4 Pits and Slug Marks
7.4.1.1 Bonding Area — 0.001" (0.025 mm) max.
surface dimension × 0.0005" (0.013 mm) maximum
depth.
7.4.1.2 Other Areas — 0.010" (0.254 mm) max.
surface dimension × 0.0005" (0.013 mm) maximum
depth.
7.5 Projections
7.5.1 Bonding Area — None allowed.
7.5.2 Other Areas — .010" (.254 mm) max. surface
dimension × 0.002" (0.015 mm) maximum height.
7.6 Scratches — There shall be no scratches in the
aluminum metallization that penetrate to the underlying
base material.
7.7 Voids — All metallized areas of the leadframe
within the bonding area shall have no voids larger than
0.001" (0.025 mm) in any dimension.
7.8 Twist (formed leadframe strip ) — 0.004 inch per
inch (0.102 mm).
7.9 Coining
7.9.1 Coined Depth — Minimum 0.0005" (0.013 mm);
maximum 0.002" (0.051 mm). Minimum coined depth
may be controlled by minimum flat area.
7.9.2 Coined Flat Area — Minimum of 80% of
normal lead width; measured 0.005" (0.127 mm) back
from lead tip.
7.9.3 Coined Length — Minimum 0.025" (0.635 mm)
from lead tip.
7.10 Lead Position
7.10.1 Lead Position — A 0.007" (0.178 mm)
diameter circle must be 100% within nominal lead
position when centered at lead nominal centerline and
0.007" (0.178 mm) back from lead tip.
7.10.2 Minimum Spacing — 0.006" (0.152 mm)
minimum.
7.11 Bowing
7.11.1 Convex — 0.0025 inch per inch (0.0025 mm
per mm) maximum.
7.11.2 Concave — 0.0025 inch per inch (0.0025 mm
per mm) maximum.
7.12 Camber — 0.005 inch per inch (0.005 mm per
mm) maximum.
NOTE: Items 7.11 and 7.12 refer to scored strips only.
8 Sampling
Sampling will be determined between vendor and
customer.