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SEMI E1.9-0701 E2 © SEMI 1994, 2004 3 5 Ordering Information 5.1 Intended Use — This stand ard is intended to specify 300 mm cassettes over a reasonable lifetim e of use, not just those in new conditio n. For this reason…
SEMI E1.9-0701
E2
© SEMI 1994, 2004 2
SEMI E19 — Standard Mechanical Interface (SMIF)
SEMI E57 — Provisional Mechanical Specification for
Kinematic Couplings Used to Align and Support 300
mm Wafer Carriers
4 Terminology
4.1 bilateral datum plane — a vertical plane that
bisects the wafers and that is perpendicular to both the
horizontal and facial datum planes (as defined in SEMI
E57).
4.2 box — a protective portable container for a cassette
and/or substrate(s).
4.3 carrier capacity — the number of substrates that a
carrier holds.
4.4 cassette — an open structure that holds one or
more substrates.
4.5 cassette bottom domain — volume (below z6 above
the horizontal datum plane) that contains the bottom of
the cassette.
4.6 cassette sensing pads — surfaces on the bottom of
the cassette for triggering optical or mechanical sensors.
4.7 cassette side domains — volumes (from z6 above
the horizontal datum plane to z15 above the top
nominal wafer seating plane) that contain the mizo teeth
or slots that support the wafer and the supporting
columns on the sides and rear of the cassette.
4.8 cassette top domain — volume (higher than z15
above the top wafer) that contains the top of the
cassette.
4.9 conveyor rails — parallel edges on the bottom of
the cassette for supporting the cassette on roller
conveyors.
4.10 facial datum plane — a vertical plane that bisects
the wafers and that is parallel to the front side of the
carrier (where wafers are removed or inserted). On tool
load ports, it is also parallel to the load face plane
specified in SEMI E15 on the side of the tool where the
carrier is loaded and unloaded (as defined in SEMI
E57).
4.11 fork-lift slots — rectangular holes (open to the
front and rear) in the bottom of the cassette for picking
up the cassette with a fork.
4.12 front-opening unified pod (FOUP) — a box (that
complies with SEMI E47.1) with a non-removable
cassette (so that its interior complies with SEMI E1.9)
and with a front-opening interface (that mates with a
FIMS port that complies with SEMI E62) (as defined in
SEMI E47.1).
4.13 horizontal datum plane — a horizontal plane from
which projects the kinematic-coupling pins on which
the carrier sits. On tool load ports, it is at the load
height specified in SEMI E15 and might not be
physically realized as a surface (as defined in SEMI
E57).
4.14 nominal wafer center line — the line that is
defined by the intersection of the two vertical datum
planes (facial and bilateral) and that passes through the
nominal centers of the seated wafers (which must be
horizontal when the carrier is placed on the coupling)
(as defined in SEMI E57).
4.15 nominal wafer seating plane — horizontal plane
that bisects the wafer pick-up volume.
4.16 optical wafer sensing paths — lines of sight for
optically sensing the positions of the wafers. Several
horizontal optical wafer sensing paths are present in
between the cassette side domains. In addition, two
vertical optical wafer sensing paths are created by
rectangular exclusion zones in the front of the cassette
top and bottom.
4.17 pod — a box having a Standard Mechanical
Interface (SMIF) per SEMI E19.
4.18 process batch — a set of substrates that are
processed simultaneously in a process chamber.
4.19 robotic handling flanges — four horizontal
projections on top of the cassette for lifting and rotating
the cassette.
4.20 sensor hole — an indentation on the bottom of the
cassette for inserting optical sensors.
4.21 side grip pits — two rectangular indentations on
each side of the cassette for lifting and rotating the
cassette.
4.22 transport group — a set of substrates that are
transported together between tools.
4.23 virtual tracking unit — an entity (which could be
a number of substrates or an individual die or mask
group) that the factory floor control system treats as a
single unit for tracking purposes.
4.24 wafer carrier — any cassette, box, pod, or boat
that contains wafers (as defined in SEMI E15).
4.25 wafer extraction volume — the open space for
extracting a wafer from the cassette.
4.26 wafer pick-up volume — the space that contains
entire bottom of a wafer if the wafer has been pushed to
the rear of the cassette.
4.27 wafer set-down volume — the open space for
inserting and setting down a wafer in the cassette.
SEMI E1.9-0701
E2
© SEMI 1994, 2004 3
5 Ordering Information
5.1 Intended Use — This standard is intended to
specify 300 mm cassettes over a reasonable lifetime of
use, not just those in new condition. For this reason, the
purchaser needs to specify a time period and the
number and type of uses to which the cassettes will be
put. It is under these conditions that the cassettes must
remain in compliance with the requirements listed in
Section 6.
5.2 Temperature Ranges — The purchaser of 300 mm
cassettes needs to specify two sets of temperatures to
which the cassettes might be exposed. An operating
temperature range is the set of environmental
temperatures in which the cassettes will remain in
compliance with the requirements listed in Section 6. A
temporary temperature range is the set of environmental
temperatures to which the cassettes can be exposed
such that when the cassettes return to the operating
temperature range, the cassettes will be in compliance
with the requirements listed in Section 6. Limits on
exposure times to elevated temperatures should be
specified. Also, the purchaser needs to specify a range
of temperatures for the wafers that might be inserted in
the cassettes.
5.3 Info Pad Configurations — The purchaser of 300
mm carriers needs to specify the desired info pad
configuration (up or down). See Appendix 1
(Application Notes).
6 Requirements
6.1 Kinematic Couplings — The physical alignment
interface on the bottom of the cassette consists of
features (not specified in this standard) that mate with
six pins underneath as defined in SEMI E57. Most of
the dimensions of the cassette are determined with
respect to the three orthogonal datum planes defined in
that standard: the horizontal datum plane, the facial
datum plane, and the bilateral datum plane. All of the
dimensions for the cassette are bilaterally symmetric
about the bilateral datum plane. The three features that
mate with the pins must provide a lead-in capability
that corrects a cassette misalignment no greater than
r19 in any horizontal direction. However, it is
recommended that robots placing cassettes on
kinematic couplings use as little of this lead-in
capability as possible to avoid wear.
6.2 Wafer Orientation and Numbering — The wafers
must be horizontal when the carrier is placed on the
coupling, and the wafers are numbered in increasing
order from bottom to top (so the bottom wafer is wafer
number 1, the next wafer up is wafer number 2, etc.).
After processing at a tool, each wafer should be
returned to the same slot from which it was taken.
6.3 Cassette Sides — Figure 1 shows a cross-section of
the horizontal boundaries of the cassette side domains
(which contain the parts of the cassette higher than z6
above the horizontal datum plane and lower than z15
above the top wafer). In this and following figures, the
most heavy lines are used for surfaces that have
tolerances (not surfaces that have only maximum or
minimum dimensions). Table 1 defines the dimensions
shown in this and following figures. The maximum
protrusions of any part of the cassette from the nominal
wafer center line and from the bilateral datum plane is
r5 and x9, respectively. There are two optional side grip
pits on each side. For optically sensing whether a
cassette is properly in place, from left to right under the
bottom wafer is an optical cassette sensing hole. The
radius of this hole is given with both upper and lower
tolerances, but the upper tolerance is only to define a
minimum aperture that must be met at only one section
on each side. Other than through the optical cassette
sensing holes, the cassette bottom and side domains
must block any line of sight passing through both of the
two rectangles at x10 on each side bounded by z4, z20,
y2, and y3.
6.4 Cassette Top — Figure 2 shows a top view of the
horizontal boundaries of the cassette top domain which
contains any part of the cassette higher than z15 above
the top nominal wafer plane. The top robotic handling
flanges (optional), the side grip pits (optional), and
optical cassette sensing hole on the side can be seen in
Figure 3, which is an oblique view of the maximum
cassette dimensions (see Figure 14 to see how cassettes
need not take up all of that volume). The maximum
radial protrusions of the cassette top in the front and
rear are r6 and r12, respectively. Dimensions x6, x12
(shown in Figure 4), and y15 define a vertical path for
optically sensing wafers through the top and bottom
domains.
SEMI E1.9-0701
E2
© SEMI 1994, 2004 4
r5
≤170
r4
≥170
boundary of
right rear cassette
side domain
boundary of
left rear cassette
side domain
front side of the cassette where wafers are accessed
boundary
of left front
cassette
side domain
y6
≤152
wafer
pick-up area
y5
≥120
y4
≤85
x3 ≥125
x1
≥50
x2
≤75
boundary
of right front
cassette
side domain
reserved
for end-
effector
fingers
r1
≤151
facial
datum
plane
bilateral datum plane
r2 =152
r3 ≥r2 + 1
wafer set-down and
extraction
volumes
y1 ≤ 3
y2 =10±1
y3 =10±1
side grip pit
(optional, see
section 6.3)
x4 ≥8
r9
=2.5±.5
optical cassette
sensing hole
x9 ≤167
x10 =166 ±1
(at side grip pits)
y11
≤85
+1
–0
Figure 1
Cassette Side Domains
x6
≤112.5
y15
≤95
boundary
of cassette
top domain
y16
=155 ±1
r6
≤157
facial
datum
plane
front side of the cassette where wafers are accessed
y4
≤85
x1
≥50
x5
=76±1
bilateral datum plane
r5
≤170
optical wafer
sensing path
r11
=166 ±1
y8
=2±0.5
y7
=2±0.5
x9 ≤167
r12
≤152
x7 ≥12
robotic handling
flange (optional,
see section 6.4)
Figure 2
Cassette Top Domain