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SEMI S22-1103a © SEMI 2003, 2005 2 14. Interface C ontrol 15. Electrical Enclosures 16. Con ductors and C ables 17. Wiring Practices 18. Electric Motors ¼ Horse p ower and Larger 19. Access ories and Lighting 20. Marking…

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SEMI S22-1103a © SEMI 2003, 2005 1
SEMI S22-1103a
SAFETY GUIDELINE FOR THE ELECTRICAL DESIGN OF
SEMICONDUCTOR MANUFACTURING EQUIPMENT
This safety guideline was technically approved by the global Environmental Health and Safety Committee.
This edition was approved for publication by the global Audits and Reviews Subcommittee on April 7, 2005.
It was available at www.semi.org in June 2005 and on CD-ROM in July 2005. Originally published
November 2003.
NOTICE: This document contains material that has been balloted and approved by the SEMI
Environmental Health and Safety Committee, but is not immediately effective. This material and the date on
which it becomes effective are included in Delayed Revisions Sections 1 and 2. The provisions of this
information are not an authoritative part of the document until their effective dates. The main body of SEMI
S22-1103a remains the authoritative version. Some or all of the provisions of revisions not yet in effect may
optionally be applied prior to the effective date, providing they do not conflict with portions of the
authoritative version other than those that are to be revised or replaced as part of the deferred change, and
are labeled accordingly. Material that is to be replaced by revisions that are not yet in effect is preceded by a
NOTICE indicating its status.
NOTICE: Paragraphs entitled “NOTE” are not an official part of this document and are not intended to modify or
supercede it.
NOTICE: Conformance to the “should” provisions of this guideline is necessary to declare conformance to this
document. Conformance to “may”, “suggested”, “preferred”, “recommended”, “NOTE”, or “Related Information”
provisions is not necessary to declare conformance.
1 Purpose
1.1 This guideline provides a set of design based electrical safety considerations for production equipment used in
the semiconductor industry.
1.2 Basic product safety concerns can be addressed by satisfying the design, construction, and testing principles set
forth in this document or by satisfying the requirements of applicable electrical safety standards.
2 Scope
2.1 This safety guideline applies to semiconductor manufacturing equipment.
2.2 This document contains the following:
1. Purpose
2. Scope
3. Limitations
4. Reference Standards
5. Terminology
6. Alternate Methods of Conformity
7. Design Philosophy
8. General Considerations
9. Facilities Electrical Connection
10. Protection Against Electric Shock
11. Protection Against Risk of Electrical Fire
12. Bonding to the Protective Conductor
13. Safety Circuits
SEMI S22-1103a © SEMI 2003, 2005 2
14. Interface Control
15. Electrical Enclosures
16. Conductors and Cables
17. Wiring Practices
18. Electric Motors ¼ Horsepower and Larger
19. Accessories and Lighting
20. Markings
21. Technical Documentation
22. Testing
2.3 Included in this safety guideline are design considerations for electrical safety interlocks that protect against
electrical as well as non-electrical safety hazards; and non-electrical interlocks that protect against electrical safety
hazards.
2.4 This document applies to the electrical design for all equipment used to manufacture, measure, assemble, and
test semiconductor products unless the equipment is specifically excluded. See Section 3, Limitations.
NOTE 1: This safety guideline is most useful for semiconductor manufacturing equipment where no relevant product safety
standard exists.
2.5 This safety guideline applies to equipment intended to be powered by hazardous voltages or hazardous electrical
power.
NOTE 2: The official values in this guideline are expressed in the International System of Units (SI). Values that:
a) are expressed in Inch-Pound (also known as “US Customary” or “English”) units,
b) are enclosed in parentheses, and
c) directly follow values expressed in SI units
are not official, are provided for reference only, and might not be exact conversions of the SI values.
NOTICE: This safety guideline does not purport to address all of the safety issues associated with its use. It is the
responsibility of the users of this safety guideline to establish appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior to use.
3 Limitations
3.1 This safety guideline does not apply to equipment, subassemblies, and components that have been certified by
an accredited testing laboratory and used within their certification parameters, or that conform to a relevant
international or national product safety standard as defined by the scope of that standard.
NOTE 3: Criteria for jurisdictional acceptance may vary and should be taken into account although it is beyond the scope of this
document.
3.2 This safety guideline is not intended to address any requirements pertinent to explosive atmospheres, hazardous
locations, and/or hazardous process materials.
3.3 This safety guideline does not apply to support equipment that is an integral part of the facility, such as facility
air conditioning, facility fire detection or fire extinguishing systems, or facility power distribution systems, which
include motor-generator sets and transformers.
3.4 This safety guideline does not include design specifications for performance or functional characteristics of the
equipment.
4 Referenced Standards and Documents
4.1 SEMI Standards
SEMI E33 — Specification for Semiconductor Manufacturing Facility Electromagnetic Compatibility
SEMI S22-1103a © SEMI 2003, 2005 3
SEMI S1 — Safety Guideline for Equipment Safety Labels
SEMI S2 — Environmental, Health and Safety Guideline for Semiconductor Manufacturing Equipment
SEMI S3 Safety Guidelines for Heated Chemical Baths
SEMI S8 — Safety Guideline for Ergonomics Engineering of Semiconductor Manufacturing Equipment
SEMI S10 — Safety Guideline for Risk Assessment and Risk Evaluation Process
SEMI S13 — Safety Guideline for Operation and Maintenance Manuals Used with Semiconductor Manufacturing
Equipment
SEMI 14 — Safety Guidelines for Fire Risk Assessment and Mitigation for Semiconductor Manufacturing
Equipment
4.2 IEC Standards
1
IEC 60112 Method for determining the comparative and the proof tracking indices of solid insulating materials
under moist conditions
IEC 60204-1 — Safety of Machinery - Electrical Equipment of Machines, Part 1: General Requirements
IEC 60417 — Graphical Symbols for Use on Equipment
IEC 60707 — Flammability of solid non-metallic materials when exposed to flame sources - List of test methods
IEC 60950 Safety of Information Technology Equipment
IEC 61010-1 — Safety Requirements for Electrical Equipment for Measurement, Control, and Laboratory Use —
Part 1: General Requirements
IEC 61346-1 Industrial systems, installations and equipment and industrial products - Structuring principles and
reference designations
4.3 European Documents
2
4.3.1 CENELEC Standards
EN 60529 Degrees of Protection Provided by Enclosures
EN 61508 Functional Safety of Electrical/electronic/programmable Electronic Safety-related Systems
4.3.2 European Commission Directives
89/336/EEC Directive on Electromagnetic Compatibility
4.4 NFPA Standards
3
NFPA 70 — National Electrical Code
NFPA 79 Electrical Standard for Industrial Machinery
4.5 UL Standards
4
UL 94 Tests for Flammability of Plastic Materials for Parts in Devices and Appliances
UL 943 — Standard for Ground-Fault Circuit- Interrupters
1 International Electrotechnical Commission 3, rue de Varembé, Case Postale 131, CH-1211 Geneva 20, Switzerland. Telephone:
41.22.919.02.11; Fax: 41.22.919.03.00
2 European Union http://europa.eu.int/
3 National Fire Protection Association, 1 Batterymarch Park, PO Box 9101, Quincy, MA 02269-9101
4 Underwriters Laboratories Inc., 333 Pfingsten Rd, Northbrook, IL 60062