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SEMI D10-95 © SEMI 1995, 2003 5 RELATED INFORMATION 1 NOTICE : This relat ed information is not an offi cial part of SEMI D10 and is not i ntended to modify or supe rcede the official standard. Publicatio n was authorize…

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SEMI D10-95 © SEMI 1995, 2003 4
NOTE 4: A negative result indicates loss of material, and
positive result indicates material gain.
9.2.3 Method C (Surface Haze)
9.2.3.1 Measure total transmittance, Tt, and diffuse
transmittance, Td, and calculate the haze value from the
following expression:
H =
Td
Tt
× 100 (5)
where
Tt = total transmittance,
Td = diffuse transmittance, and
H = haze value in %.
10 Reporting Results
10.1 Report date and time of test, ambient temperature,
test operator, test conditions (reagent and concentration,
volume of the test medium, test temperature, test time,
stroke length, and frequency of shaking), specimen size
and total surface area, specimen cleaning method, and
the following:
10.1.1 Method A — The areal weight change (W
A
), the
initial weight of the specimen (W
1
), the density of the
substrate material (D), and calculated depth of
corrosion (P).
10.1.1.1 Method B — Penetration depth (P).
10.1.1.2 Method C — The average, maximum and
minimum value of total transmittance (Tt), diffuse
transmittance (Td), and haze value (H).
10.2 Remarks — In a typical test, one specimen is
immersed in an unused medium of specified volume in
a reaction vessel during a specified time. However, as
long as various conditions are described in the report,
even irregular methods may be allowed. Repetitive
usage of a medium may not markedly affect the result
when the test is done in relatively brief or slightly
corrosive conditions, or in concentrated, extremely
corrosive media.
11 Precision and Accuracy
11.1 Interlaboratory evaluation of these test methods is
planned to verify their suitability and reliability. Until
the results are established, use of this test method for
commercial transactions is not recommended unless the
parties to the test establish the degree of correlation that
can be obtained.
11.2 No standards exist against which any bias of this
test method can be evaluated.
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer' s instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
SEMI D10-95 © SEMI 1995, 2003 5
RELATED INFORMATION 1
NOTICE: This related information is not an official part of SEMI D10 and is not intended to modify or supercede
the official standard. Publication was authorized by full letter ballot procedures. Determination of the suitability of
the material is solely the responsibility of the user.
NOTICE: This related information does not purport to address all of the safety issues associated with its use. It is
the responsibility of the user of this related information to establish appropriate safety and health practices and
determine the applicability of regulatory limitations prior to use.
R1-1.1 The following chemicals and test conditions are recommended when this test is applied to flat panel display
glass substrates:
Buffered hydrofluoric acid (1:5) 49% HF, 49% NH
4
F, at 40° C for 10 minutes.
Hydrofluoric acid nitric acid (1:5) 49% HF, 70% HNO
3
, at 40° C for 10 minutes.
Hydrochloric acid (diluted) (1:1) 36% HCl, H
2
O, at
50° C for 20 minutes.
Sodium hydroxide solution (10%) at 50° C for 20 minutes.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant
literature respecting any materials mentioned herein. These standards are subject to change without notice.
The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI D11-95 © SEMI 1995, 2003 1
SEMI D11-95 (Reaproved 0703)
SPECIFICATION FOR FLAT PANEL DISPLAY GLASS SUBSTRATE
CASSETTES
This specification was technically approved by the Global Flat Panel Display Committee and is the direct
responsibility of the Japanese FPD Materials and Components Committee. Current edition approved by the
Japanese Regional Standards Committee on April 28, 2003. Initially available at www.semi.org June 2003;
to be published July 2003. Originally published in 1995.
1 Purpose
1.1 This document describes cassettes that are used
with glass substrates in the fabrication and processing
of subassemblies and masks for flat panel displays
(FPD).
2 Scope
2.1 This document applies to cassettes that hold a
quantity of rectangular FPD substrates. Selected terms
and definitions and summary specifications are
included. The specifications for single-substrate
cassettes will be developed in other documents.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI D3 — Quality Area Specification for Flat Panel
Display Substrates
SEMI D5 — Standard Size for Flat Panel Display
Substrates
SEMI D6 — Specification for Edge Length and
Thickness for Liquid Crystal Display (LCD) Mask
Substrates
SEMI D9 —Terminology for FPD Substrates
SEMI D21 — Definitions for Flat Panel Display Masks
SEMI E1 — Specification for 3 inch, 100 mm, 125
mm, and 150 mm Plastic and Metal Wafer Carriers
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
4.1 The following descriptions assume that the cassette
orientation places the substrates in a horizontal plane.
4.2 Definitions
4.2.1 cassette bottom plate — the bottom plate of the
cassette. It is parallel to the substrate plane. It is
physically different from the cassette top plate for
purposes of machine interface and for mechanical
positioning by operators.
4.2.2 cassette front — the area between top and bottom
cassette plates through which substrates pass during
loading and unloading.
4.2.3 cassette plate opening — an opening in the
cassette top and bottom plate that provides access to the
glass substrates for external roller driver mechanisms to
move substrates into/from the cassette.
4.2.4 cassette rear — the area between top and bottom
cassette plates opposite the cassette front.
4.2.5 cassette top plate — the upper plate of the
cassette. It is parallel to the substrate plane. It is
physically different from the cassette bottom plate for
the purpose of machine interface and for mechanical
positioning by operators.
4.2.6 first mizo clearance — the distance between the
inside surface of the bottom plate and the centerline of
the nearest mizo.
4.2.7 first mizo dimension — the distance between the
outside surface of the bottom plate and the centerline of
the nearest mizo.
4.2.8 glass substrate cassette — a container for holding
glass substrates for processing, storage, and
transportation during the fabrication of FPD.
4.2.9 inner height — the shortest distance between the
inside surface of the bottom plate and the inside surface
of the top plate.
4.2.10 mizo — a term (plural form = mizo) describing a
family of rails that support the substrates. They may be
smooth-sided, toothed symmetrically, or toothed non-
symmetrically. Precise mizo contours are not described
in this document.