semi合集-English.pdf - 第5479页
SEMI P2-0298 © SE MI 1981, 1998 1 SEMI P2-0298 SPECIFIC A TION FOR CHROM E THIN FILMS FOR HARD SURFACE PHOTOM A SKS 1 Purpose This specification covers the g e neral requirements of the chrome thin film f or hard surface…
SEMI P1-1101 © SEMI 1981, 2001 10
APPENDIX 1
NOTE: The material in this appendix is an official part of SEMI P1 and was approved by full letter ballot
procedures on August 3, 2001.
A1-1 Hard Surface Photomask Glass Properties
GLASS PROPERTIES
Property
HIGH THERMAL EXPANSION (HTE)
Modulus of Elasticity
7.0–7.3 × 10
3
Kg/mm
2
Poisson's Ratio 0.22–0.23
Specific Gravity 2.50–2.56 g/cm
3
Index of Refraction 1.52
MEDIUM THERMAL EXPANSION (MTE)
Modulus of Elasticity
7.1–9.4 × 10
3
Kg/mm
2
Poisson's Ratio 0.18–0.26
Specific Gravity 2.36–2.87 g/cm
3
Index of Refraction 1.49–1.57
LOW THERMAL EXPANSION (LTE)
Modulus of Elasticity
7.5–8.7 × 10
3
Kg/mm
2
Poisson's Ratio 0.16–0.24
Specific Gravity 2.52–2.58 g/cm
3
Index of Refraction 1.53–1.56
ULTRA LOW THERMAL EXPANSION (ULTE)
Modulus of Elasticity
6.7–7.4 × 10
3
Kg/mm
2
Poisson's Ratio 0.16–0.19
Specific Gravity 2.18–2.20 g/cm
3
Index of Refraction 1.46
DURABLE FUSED SILICA (DFS)
Modulus of Elasticity
6.7–7.4 × 10
3
Kg/mm
2
Poisson's Ratio 0.16–0.19
Specific Gravity 2.18–2.20 g/cm
3
Index of Refraction 1.46
MODIFIED FUSED SILICA (MFS)
Modulus of Elasticity
6.7–7.4 × 10
3
Kg/mm
2
Poisson's Ratio 0.16–0.19
Specific Gravity See NOTE 1.
Index of Refraction See NOTE 1.
NOTE 1: Specific Gravity and Index of Refraction of MFS shall be agreed upon between user and supplier.
NOTE 2: Index of Refraction on this table is the value at 587 nm wavelength.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI P2-0298 © SEMI 1981, 19981
SEMI P2-0298
SPECIFICATION FOR CHROME THIN FILMS FOR HARD SURFACE
PHOTOMASKS
1 Purpose
This specification covers the general requirements of
the chrome thin film for hard surface photomasks.
2 Referenced Documents
2.1 SEMI Specification
SEMI P1 — Specification for Hard Surface Photomask
Substrates
2.2 ASTM Standard
1
E 122 — Choice of Sample Size to Estimate the
Average Quality of a Lot or Process
2.3 Federal Standard
2
209D — Clean Room and Work Station Requirements,
Controlled Environment
2.4 Military Specification
3
MIL-STD-105 — Sampling Procedure and Tables for
Inspection by Attributes
3 Terminology
3.1 defects, photomask — Any flaw or imperfection in
the opaque coating or functional pattern of a photomask
that will reproduce itself in a photoresist film to such
degree that it is pernicious to the proper functioning of
the microelectric device being fabricated.
3.2 fingerprint — For the purposes of this practice,
residual surface contamination deposited during
handling.
3.3 pinhole — A small opening extending through a
cover as a photoresist coating or an oxide layer.
4 Ordering Information
4.1 Purchase orders for hard surface photomasking
substrates furnished to this specification shall include
the following:
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohoken, PA 19428-2959
2 General Services Administrator, 4th and D Streets, SW, Room
6039, Washington, DC 20407
3 Military Standards, Naval Publication and Forms Center, 5801
Tabor Avenue, Philadelphia, PA 19120
Optical Density to be agreed upon by the user and supplier
Reflectivity High reflective — Above 40%
Medium Reflective — 2– 40%
Low Reflective — Below 25%
Material to be agreed upon by the user and supplier
Etchability to be agreed upon by the user and supplier
Defects to be agreed upon by the user and supplier
Lot Size to be agreed upon by the user and supplier
5 Material Specifications
The material specifications are to be agreed upon by the
user and supplier.
6 Visual Criteria
6.1 Visual Quality Area
6.1.1 Circular Visual Quality Area — (See SEMI P1,
Figure 6, for available flatness limits of hard surface
photomask substrates.)
6.1.2 Square Visual Quality Area — (See SEMI P1,
Figure 7, for available flatness limits of hard surface
photomask substrates.)
7 Defects
Definitons of defects and the allowable number of each
type are listed in Table 1. The number of defects is
indicated by plate size, chrome grades, and defect size.
8 Sampling
Unless otherwise specified, Recommended Practice
ASTM E 122 shall be used. When so specified,
appropriate sample sizes shall be selected from each lot
in accordance with MIL-STD-105. Each quality
characteristic shall be assigned an acceptable quality
level (AQL) and lot total percent defective (LTPD)
value in accordance with MIL-STD-105 definitions for
critical. Major and minor classifications may
alternatively be assigned cumulative AQL and LTPD
values. Inspection levels shall be agreed upon between
the user and supplier.
9 Handling
Substrates are to be handled on the edges only.
10 Certification
Upon request of the purchaser in the contract or order, a
manufacturer’s or supplier’s certification that the
SEMI P2-0298 © SEMI 1981, 1998 2
material was manufactured and tested shall be in
accordance with this specification.
11 Packing and Marking
11.1 Substrates shall be packed in a Class 100
environment. Containers shall be designed to prevent
glass-to-glass contact and to protect the substrates from
contamination in handling and transit. Substrates shall
be shipped with the coated side facing toward the same
end of the box. This orientation shall be indicated on
each container. Packaging shall comply with the
applicable international, national, state laws, and local
regulations required for shipping.
11.2 Containers shall be labeled, “Warning: Open and
Handle Under Clean Room Conditions Only.” Each
shipment shall be identified by user purchase order
number, drawing number (if applicable), quantity,
supplier lot number, and material identification.
Table 1 Total Allowable Defects for Unsensitized
Photoplates
Defects in the Circular Quality Area
Substrate Size Defect Size
Grade
1–5.0
µ
m 5.1–10
µ
m 10
µ
m
4" AA 000
4" A (Master) 2 0 0
4" B 310
4" C (Test) N/A N/A 10
5" AA 000
5" A (Master) 2 0 0
5" B 410
5" C (Test) N/A N/A 15
6" AA 000
6" A (Master) 3 0 0
6" B 620
6" C (Test) N/A N/A 20
Defects in the Square Quality Area
Substrate Size Defect Size
Grade
1–5.0
µ
m 5.1–10
µ
m 10
µ
m
4" AA 000
4" A (Master) 2 0 0
4" B 410
4" C (Test) N/A N/A 10
5" AA 000
5" A (Master) 3 0 0
5" B 620
5" C (Test) N/A N/A 15
6" AA 000
6" A (Master) 4 0 0
6" B 820
6" C (Test) N/A N/A 20
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.