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SEMI P24-94 © SEMI 1994, 2004 1 SEMI P24-94 (Reapproved 1104) CD METROLOGY PROCEDURES This standard was techn ically approved by the Global Micropattern ing Committee and is the direct responsibility of the North America…
SEMI P23-0200 © SEMI 1993, 2000 32
Figure 27
Sensitivity Check Sheet – Contact Hole Pattern
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f
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SEMI P24-94 © SEMI 1994, 2004 1
SEMI P24-94 (Reapproved 1104)
CD METROLOGY PROCEDURES
This standard was technically approved by the Global Micropatterning Committee and is the direct
responsibility of the North American Micropatterning Committee. Current edition approved by the North
American Regional Standards Committee on July 11, 2004. Initially available at www.semi.org September
2004; to be published November 2004. Originally published in 1994.
1 Purpose
1.1 The purpose of this document is to establish
uniform procedures for metrology systems for the litho-
metrology task. It does not address how these systems
will be applied to solve problems, nor does it address
other contributors to process variations such as thermal
wafer processing, exposure tool focus control,
materials, etc.
1.2 Background — Fundamental to manufacturing is
the gauging or measurement process. It is required
initially to develop a usable manufacturing capability
and then to verify that what is being manufactured
conforms to specification/expectation.
2 Scope
2.1 This document discusses determining the
performance of gauging/measurement systems for a
very specific application — the lithography section of
integrated circuit wafer fabrication. This document in
many cases, will be applicable to IC mask-making, in
which case the word “mask” can be substituted for
“wafer.”
2.2 It is acknowledged that the final measurement for a
fabricated wafer is the electrical functionality.
However, the intermediate lithographic measurements
can be useful in prediction and control of final
functionality. This document is intended to be useful
for this litho-metrology application, irrespective of the
technology employed.
2.3 Measurement results and system performance
depend on the sample(s) used. Therefore, performance
for different systems or the same system at different
times can only be appropriately compared when the
measurements are obtained with a sample of the same
material composition.
2.4 The parameter addressed is precision. Additional
important parameters are reliability and cleanliness,
which have been addressed by other SEMI standards.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI E10 — Standard for Definition and Measurement
of Equipment Reliability, Availability, and
Maintainability (RAM)
SEMI P19 — Specification for Metrology Pattern Cells
for Integrated Circuit Manufacture
3.2 ASTM Standards
1
ASTM D 1129 — Standard Terminology Relating to
Water
ASTM C 609 — Standard Test Method for
Measurement of Small Color Differences Between
Ceramic Wall or Floor Tile
ASTM D 4790 — Standard Terminology of Aromatic
Hydrocarbons and Related Chemicals
ASTM E 180 — Standard Practice for Determining the
Precision of ASTM Methods for Analysis and Testing
of Industrial and Specialty Chemicals
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Applications
4.1 linewidth measurement — this task is to measure
linewidths as defined by SEMI P19.
NOTE 1: Pitch is not addressed in this document.
4.2 contact hole measurement — contact and via hole
area measurement is a different application which may
use the same definitions and procedures as line-width
measurement.
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, PO Box C700, West Conshohocken, PA, 19428-2959, Phone:
(610) 832-9585, Fax: (610) 832-9555, http://www.astm.org/
SEMI P24-94 © SEMI 1994, 2004 2
5 Terminology
5.1 Definitions
5.1.1 precision — the degree of agreement of repeated
measurements of the same parameter expressed
quantitatively as the standard deviation, computed from
the results of a series of controlled determinations
[ASTM D 1129, D-29].
5.1.2 A frequency plot of measurements taken with
random error illustrates precision. The spread or
variation of measurement in test A is smaller than that
in test B. The results of test A are more precise than the
results from test B. See Figure 1.
NOTE 2: Any test procedure used needs to differentiate
between system and wafer contribution.
Frequency
Measurement
S
A
S
B
Figure 1
Generic Frequency Plot
5.1.3 repeatability — the standard deviation of results
obtained by the same operator using the same
instrument in successive measurements [ASTM C 609,
C-21]. The same system parameters need to be used.
The degree to which the individual operator affects the
measured result is a critical parameter and must be
identified and benchmarked.
NOTE 3: The degree to which the individual operator affects
the measured result may be a critical parameter and must be
identified.
5.1.4 reproducibility — the precision of a test method
expressed in terms of agreement expected between
measurements made in different laboratories using
similar apparatus and the same procedure [ASTM D
4790, D-16].
5.1.5 stability — the standard deviation of means of
groups of measurements taken at specified intervals
over an extended period of time.
NOTE 4: The means are used to avoid including the
measurement precision. Stability is a characterization of the
system independent of precision. It is important to use a stable
sample so that system stability, independent of the sample, is
determined.
5.1.6 standard deviation — a measure of the dispersion
of a series of results around their average, expressed as
the square root of the quantity, obtained by adding the
squares of the deviations from the average of the results
and dividing by the number of observations minus one.
It is also the square root of the variance and can be
calculated as follows:
s
x
i
x
2
n 1
1
Where:
s = estimated standard deviation of the series of results
X
i
= each individual value
X = average (arithmetic mean) of all values, and
n = number of values
The following forms of this equation are more
convenient for computation, especially when using a
calculator:
s
x
2
x
2
/ n
n 1
2
or
s
nx
2
x
2
nn 1
3
where:
s = estimated standard deviation
x
2
sum of the squares of all the individual values
x
2
square of the total of the individual values,
and
n = number of values
NOTE 5: Care must be taken in using either of these
equations that a sufficient number of decimal places is carried
in the sum of the values and in the sum of their square so that
serious rounding errors do not occur. For best results, all
rounding should be postponed until after a value has been
obtained for s [ASTM E 180, E 15].