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SEMI E10-0304 E © SEMI 1986, 2004 4 • Process engineering (e.g., process character- ization), • Equipment engineeri ng (e.g., equi pment eval- uation), and • Software engineering (e.g., s oftware qualification). 5.8 SCHE…

SEMI E10-0304

4.1.26 training (on-the-job) — the instruction of

personnel in the operation and/or maintenance of

equipment done during the course of normal work

functions. On-the-job training typically does not

interrupt operation or maintenance activities and can

therefore be included in any equipment state (except

standby and non-scheduled) without special

categorization.

4.1.27 unit — any wafer, substrate, die, packaged die,

or piece part thereof.

4.1.28 uptime — the time when the equipment is in a

condition to perform its intended function. It includes

productive, standby, and engineering time, and does not

include any portion of non-scheduled time.

4.1.29 user — any entity interacting with the

equipment, either locally as an operator or remotely via

the host. From the equipment’s view point, both the

operator and the host

represent the user.

4.1.30 utilization — the percent of time the equipment

is performing its intended function during a specified

time period.

4.1.31 verification run — a single cycle of the equip-

ment (using units or no units) used to establish that it is

performing its intended function within specifications.

5 Equipment States

5.1 To clearly measure equipment performance

(RAM), this document defines six basic equipment

states into which all equipment conditions and periods

of time must fall.

5.2 The equipment states are determined by function,

not by organization. Any given maintenance

procedure, for example, is classified the same way no

matter who performs it, an operator, a production

technician, a maintenance technician, or a process

engineer.

5.3 Figure 1 is a stack chart of the six basic equipment

states. These basic equipment states can be divided into

as many sub-states as are required to achieve the

equipment tracking resolution that a manufacturing

operation desires. SEMI E10 makes no attempt to list

all possible sub-states, but does give some examples for

guidance.

5.4 Key blocks of time associated with the basic states

and example substates are given in Figure 2. These

blocks of time are used in the RAM equations given

later in this document. The blocks of time associated

with the basic states and example substates are

described in the following sections.

SCHEDULED

DOWNTIME

STANDBY

TIME

ENGINEERING

TIME

UNSCHEDULED

DOWNTIME

NON-SCHEDULED

TIME

PRODUCTIVE

TIME

Equipment

Uptime

Operations

Time

Total Time

Manufacturing

Time

Equipment

Downtime

Figure 1

Equipment States Stack Chart

5.5 PRODUCTIVE STATE — The time (productive

time) when the equipment is performing its intended

function. The productive state includes:

• Regular production (including loading and

unloading of units),

• Work for third parties,

• Rework, and

• Engineering runs done in conjunction with

production units (e.g., split lots and new

applications).

5.6 STANDBY STATE — The time (standby time),

other than non-scheduled time, when the equipment is

in a condition to perform its intended function,

chemicals and facilities are available, but it is not

operated. The standby state includes:

• No operator available (including breaks, lunches,

and meetings),

• No units available (including no units due to lack

of available support equipment, such as metrology

tools),

• No support tools (e.g., cassettes, wafer carriers,

probe cards), and

• No input from external automation systems (i.e.,

host).

5.7 ENGINEERING STATE — The time (engineering

time) when the equipment is in a condition to perform

its intended function (no equipment or process

problems exist), but is operated to conduct engineering

experiments. The engineering state includes:

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• Process engineering (e.g., process character-

ization),

• Equipment engineering (e.g., equipment eval-

uation), and

• Software engineering (e.g., software qualification).

5.8 SCHEDULED DOWNTIME STATE — The time

(scheduled downtime) when the equipment is not

available to perform its intended function due to

planned downtime events. The scheduled downtime

state includes:

• Maintenance delay (maint-delay),

• Production test,

• Preventive maintenance,

• Change of consumables/chemicals,

• Setup, and

• Facilities related (fac-rel).

5.8.1 Maintenance Delay — The time (maint-delay

downtime) during which the equipment cannot perform

its intended function because it is waiting for either user

or supplier personnel or parts (including

consumables/chemicals) associated with maintenance.

Maintenance delay may also be due to an administrative

decision to leave the equipment down and postpone

maintenance.

5.8.1.1 Maintenance delays may occur at any point in

the maintenance process. These maintenance delay

downtimes must be tracked separately from

maintenance time. Delay downtime is included in time

off-line, but not in time to repair (see Sections 6.3 and

6.4 Equipment Availability and Maintainability).

5.8.2 Production Test — The time (production test

downtime) for the planned interruption of equipment

availability for evaluation of units, as defined in the

specifications of equipment operation, to confirm that

the equipment is performing its intended function

within specifications. It does not include testing that

can be done in parallel with, or transparent to, the

running of production, nor does it include any testing

done following a preventive maintenance, setup, or

repair procedure.

5.8.3 Preventive Maintenance — The sum of the times

(preventive maintenance downtimes) for:

• Preventive action: A predefined maintenance

procedure (including equipment ramp-down and

ramp-up), at scheduled intervals, designed to

reduce the likelihood of equipment failure during

operation. Scheduled intervals may be based upon

time, equipment cycles, or equipment conditions.

• Equipment test: The operation of equipment to

demonstrate equipment functionality; (e.g., system

reaches base pressure, wafers transfer without

problem, gas flow is correct, plasma ignites, source

reaches specified power).

• Verification run: The processing and evaluation of

units after preventive action to establish that the

equipment is performing its intended function

within specifications.

NOTE 2: Equipment suppliers are responsible for specifying

a preventive maintenance program to achieve a predetermined

equipment performance level. Users are obligated to identify

any deviation from the recommended program if they expect

the supplier to meet or improve that performance level.

5.8.4 Change of Consumables/Chemicals — The time

(change of consumables/chemicals downtime) for the

scheduled interruption of operation to replenish the raw

materials of semiconductor processing. It includes

changes of gas bottles, acids, targets, sources, etc., and

any purging, cleaning, or flushing normally associated

with those changes. It does not include delays in

obtaining those consumables/chemicals.

5.8.5 Setup — The sum of the times (setup downtimes)

for:

• Conversion: The time required to complete an

equipment alteration necessary to accommodate a

change in process, unit, package configuration, etc.

(excluding modifications, rebuilds, and upgrades).

• Equipment test: The operation of equipment to

demonstrate equipment functionality; (e.g., system

reaches base pressure, wafers transfer without

problem, gas flow is correct, plasma ignites, source

reaches specified power).

• Verification run: The processing and evaluation of

units after conversion to establish that equipment is

performing its intended function within

specifications.

NOTE 3: Equipment suppliers are responsible for providing

procedures which achieve setup conversion and testing within

predetermined specifications. Users are obligated to identify

any deviation from the procedures if they expect the supplier

to make setups fall within those specifications.

5.8.6 Facilities Related — The time (facilities-related

downtime) when the equipment cannot perform its

intended function solely as a result of out of

specification facilities. Those facilities include:

• Environmental (e.g., temperature, humidity,

vibration, particle count),

• House hookups (e.g., power, cooling water, house

gases, exhaust, LN2), and

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• Communications links with other equipment or

host computers.

5.8.6.1 Any downtime created by the items listed

above shall be included in facilities-related downtime.

For example, if, as a result of a scheduled 15-minute

power outage an otherwise unnecessary cryo pump

regeneration is needed, all time required to return the

equipment to a condition where it can perform its

intended function is included in facilities-related

downtime.

5.9 UNSCHEDULED DOWNTIME STATE — The

time (unscheduled downtime) when the equipment is

not in a condition to perform its intended function due

to unplanned downtime events:

• Maintenance delay (maint-delay)

• Repair

• Change of consumables/chemicals

• Out-of-spec input

• Facilities related (fac-rel)

5.9.1 Maintenance Delay — The time (maint-delay

downtime) during which the equipment cannot perform

its intended function because it is waiting for either user

or supplier personnel or parts (including

consumables/chemicals) associated with maintenance.

Maintenance delay may also be due to an administrative

decision to leave the equipment down and postpone

maintenance.

5.9.1.1 Maintenance delays may occur at any point in

the maintenance process. These maintenance delay

downtimes should be tracked separately from

maintenance time. Delay downtime is included in time

off-line, but not in maintenance time (see Sections 6.3

and 6.4 Equipment Availability and Maintainability).

5.9.2 Repair — The sum of the times (repair

downtimes) for:

• Diagnosis: The procedure of identifying the source

of an equipment problem or failure.

• Corrective action: The maintenance procedure

(including equipment ramp-down and ramp-up, re-

booting, resetting, recycling, restarting, reverting to

a previous software version, etc.) employed to

address an equipment failure and return the

equipment to a condition where it can perform its

intended function.

• Equipment test: The operation of equipment to

demonstrate equipment functionality (e.g., system

reaches base pressure, wafers transfer without

problem, gas flow is correct, plasma ignites, source

reaches specified power).

• Verification run: The processing and evaluation of

units after corrective action to establish that the

equipment is performing its intended function

within specifications.

5.9.3 Change of Consumables/Chemicals — The time

(change of consumables/chemicals downtime) for the

unscheduled interruption of operation to replenish the

raw materials of semiconductor processing. It includes

changes of gas bottles, acids, targets, sources, etc., and

any purging, cleaning, or flushing normally associated

with those changes. It does not include delays in

obtaining these consumables/chemicals.

5.9.4 Out-of-Spec Input — The time (out-of-spec input

downtime) when the equipment cannot perform its

intended function solely as a result of problems created

by out-of-specification or faulty inputs. Those inputs

include:

• Support tools (e.g., warped cassettes or wafer

carriers, faulty probe cards, reticles),

• Unit (e.g., upstream process problems, warped

wafers, contaminated wafers, warped lead frames),

• Test data (e.g., metrology tool out of calibration,

misread charts, erroneous data interpre-

tation/entry), and

• Consumables/chemicals (e.g., contaminated acid,

leaky target bond, degraded photo resist, degraded

mold compound).

5.9.4.1 Any downtime created by the items listed

above shall be included in out-of-specification input

downtime. For example, if, as a result of an

intermittent probe card short, a prober/tester system is

put down for repair, all downtime incurred prior to

identifying the problem is re-categorized as out-of-

specification input downtime.

5.9.5 Facilities Related — The time (facilities-related

downtime) when the equipment cannot perform its

intended function solely as a result of out-of-

specification facilities. Those facilities include:

• Environmental (e.g., temperature, humidity,

vibration, particle count),

• House hookups (e.g., power, cooling water, house

gases, exhaust, LN2), and

• Communications links with other equipment or

host computers.

5.9.5.1 Any downtime created by the items listed

above shall be included in facilities-related downtime.

For example, if, as a result of an unscheduled 15-

minute power outage, an otherwise unnecessary cryo

pump regeneration is needed, all time required to return