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SEMI M31-0705 © SEMI 1998, 2005 3 4.1.20 wafer carrier — any cassette, box, pod, or boat that contains wafers (as defined in SEMI E15). 4.1.21 wafer extraction volume — the open space for extracting a wafer from the carr…
SEMI M31-0705 © SEMI 1998, 2005 2
NOTICE: As listed or revised, all documents cited shall be the latest publications of adopted standards.
4 Terminology
4.1 Definitions
4.1.1 bilateral datum plane — a vertical plane that bisects the wafers and that is perpendicular to both the
horizontal and facial datum planes (as defined in SEMI E57).
4.1.2 box — a protective portable container for a carrier and/or substrate(s).
4.1.3 carrier — an open structure that holds one or more substrates.
4.1.4 carrier bottom domain — volume (below z6 above the horizontal datum plane) that contains the bottom of the
carrier (as defined in SEMI E1.9).
4.1.5 carrier capacity — the number of substrates that a carrier holds (as defined in SEMI E1.9).
4.1.6 carrier sensing pads — surfaces on the bottom of the carrier for triggering optical or mechanical sensors (as
defined in SEMI E1.9).
4.1.7 carrier side domains — volumes (from z6 above the horizontal datum plane to z15 above the top nominal
wafer seating plane) that contain the mizo teeth or slots that support the wafer and the supporting columns on the
sides and rear of the carrier (as defined in SEMI E1.9).
4.1.8 carrier top domain — volume (higher than z15 above the top wafer) that contains the top of the carrier (as
defined in SEMI E1.9).
4.1.9 facial datum plane — a vertical plane that bisects the wafers and that is parallel to the front side of the carrier
(where wafers are removed or inserted). On tool load ports, it is also parallel to the load face plane specified in
SEMI E15 on the side of the tool where the carrier is loaded and unloaded (as defined in SEMI E57).
4.1.10 front-opening shipping box (FOSB) — a shipping box with a front-opening interface.
4.1.11 front-opening unified pod (FOUP) — a box (that complies with SEMI E47.1) with a non-removable cassette
(so that its interior complies with SEMI E1.9) and with a front-opening interface (that mates with a FIMS port that
complies with SEMI E62) (as defined in SEMI E47.1).
4.1.12 front-opening box for interfactory transport (FOBIT) — box for interfactory transport between IC
manufacturing sites.
4.1.13 horizontal datum plane — a horizontal plane from which projects the kinematic-coupling pins on which the
carrier sits. On tool load ports, it is at the load height specified in SEMI E15 and might not be physically realized as
a surface (as defined in SEMI E57).
4.1.14 minienvironment — a localized environment created by an enclosure to isolate the product from
contamination and people.
4.1.15 nominal wafer centerline — the line that is defined by the intersection of the two vertical datum planes
(facial and bilateral) and that passes through the nominal centers of the seated wafers (which must be horizontal
when the carrier is placed on the coupling) (as defined in SEMI E57).
4.1.16 optical wafer sensing paths — lines of sight for optically sensing the positions of the wafers. Several
horizontal optical wafer sensing paths are present in between the carrier side domains. In addition, two vertical
optical wafer sensing paths are created by rectangular exclusion zones in the front of the carrier top and bottom (as
defined in SEMI E1.9).
4.1.17 shipping box — a protective portable container for a carrier and/or wafer(s) that is used to ship wafers from
the wafer suppliers to their customers.
4.1.18 shipping-box front-opening mechanical interface (SFMI) — optional automated-shippable door style for a
FOSB that is compatible with SEMI E62, and must be considered characteristics with exceptions as noted in ¶5.4.2.
4.1.19 virtual tracking unit — an entity (which could be a number of substrates or an individual die or mask group)
that the factory floor control system treats as a single unit for tracking purposes (as defined in SEMI E1.9).
SEMI M31-0705 © SEMI 1998, 2005 3
4.1.20 wafer carrier — any cassette, box, pod, or boat that contains wafers (as defined in SEMI E15).
4.1.21 wafer extraction volume — the open space for extracting a wafer from the carrier (as defined in SEMI E1.9).
4.1.22 wafer pick-up volume — the space that contains entire bottom of a wafer if the wafer has been pushed to the
rear of the carrier (as defined in SEMI E1.9).
4.1.23 wafer set-down volume — the open space for inserting and setting down a wafer in the carrier (as defined in
SEMI E1.9).
5 Requirements
5.1 The FOSB has the following components and sub-components:
Key:
Required feature
Optional feature
Door on front
Manual door (optional)
Automated door (optional)
Holes for latch keys that lock the door to the SFMI interface when the door is unlatched from the box
Holes for registration pins
Door presence sensing areas
Top
Top robotic handling flange (optional)
Interior
Cassette with supports for 13 or 25 wafers
Wafer retainer
2 end effector exclusion zones
Sides
Ergonomic manual handles (optional)
Bottom
5 carrier sensing pads
4 Info pads
3 features that mate with kinematic coupling pins and provide a 10 mm lead-in
3 features that mate with kinematic coupling pins and provide a 15 mm lead-in (optional)
Retaining features for manual door (optional)
Retaining features for automated-shippable door
5.2 Kinematic Couplings — The physical alignment mechanism from the FOSB to the tool load-port (or a nest on a
vehicle or in a stocker) consists of features (not specified in this standard) on the top entity that mate with three or
six pins underneath as defined in SEMI E57. The three features that mate with the kinematic coupling pins must
provide a lead-in capability that corrects a FOSB misalignment of up to r69 in any horizontal direction.
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5.3 Inner and Outer Radii — All required concave features may have a radius of up to r65 to allow cleaning and to
prevent contaminant build-up. All required convex features may also have a radius of up to r66 to prevent small
contact patches with large stresses that might cause wear and particles. Note that these limits on the radius of all
required features are specified as a maximum (not a minimum) to ensure that the required features are not rounded
off too much. The lower bound on the radius is up to the FOSB supplier. Note also that this radius applies to every
required feature unless another radius is called out specifically. Here a required feature is an area on the surface of
the FOSB supplier. Note also that this radius applies to every required feature unless another radius is called out
specifically. Here a required feature is an area on the surface of the FOSB specified by a dimension (or intersections
of dimensions) that has a tolerance and not just a maximum or minimum (such as the edges of the robotic handling
flange).
5.4 Door — It is recommended that the FOSB not be vertical when it is opened or closed. When the FOSB is in a
vertical orientation with the door removed, the wafers must be restrained from touching each other by appropriate
wafer support design or other retaining techniques.
5.4.1 Manual Door — If chosen, the manual door option requires no automation to open the door. An exclusion
zone surrounding the manual door area is specified in the standard. There are several possible techniques for sealing
and clamping the manual door that meet user requirements. Therefore, only an exclusion zone surrounding the
manual door area is specified in this standard. All features of the door and door retaining mechanism must lie within
the exclusion zone illustrated in Figure 1 and must not interfere with other specified features (including the
kinematic couplings). Figure 1 and dimensions x81, y50, y81, y82, z47, z48 and z49 define the manual door area and
therefore apply only to the manual door option as described in this section. The y81 dimension applies from the
horizontal datum plane to the top surfaces of the FOSB (z47-z48 or z47+z49 at the upper door frame volume
specified by y50).
5.4.2 Automated-shippable Door — If chosen, the automated-shippable door must be designed to mate with a port
that conforms to SEMI E62. However, following characteristics of automate-shippable door must be considered.
5.4.2.1 Wafer Retaining Structure — The slot is usually designed that wafers are suspended in the slot without
contacting the surface of the slot for preventing the damage during transportation when FOSB door is closed. It
should be noted that wafer position of FOSB is different from that of FOUP when the door is closed due to the wafer
retaining structure.
5.4.2.2 Rear of Door (y51) — For manual door, FOSB has a y51
50 mm to hold wafers in large area at front
wafer retainer for keeping wafer quality during transportation. For automated-shippable door, FOSB has a
y51 140 mm to comply with SEMI E47.1.
5.4.2.3 Force between Box Door and Box (f34: defined by SEMI E62) — f34 is related to wafer retaining force
though, need to consider door is pulled by latching too. Even though, f34 is increased, minimum force applied to
wafer would be recommended for eliminating damage to the wafers in dynamic motion for opening and closing the
door.
5.4.2.4 Latch Key Torque (f30: defined by SEMI E62) — The required latch key torque depends on the closing
force.
5.4.2.5 A FOSB with an automated-shippable door should be able to withstand a force when applied to one of the
retaining features of up to 40N (f61) in any direction without negative impact to the intended function of the FOSB
(e.g. shell deformation, wafer positions, door closing capabilities).
5.5 Seal Zones for Door — In the Front Opening Shipping Box Automated Door Option the automated box door is
on the front side of the box (corresponding to the front side of the carrier where wafers are accessed so the door is
perpendicular to the wafers and parallel to the facial datum plane). The automated door and the carrier frame must
have surfaces that mate with the seal zones defined in SEMI E62. Specifically, the FOSB automated box door
option and the carrier frame must have surfaces that made with the seal zones and the reserved spaces for vacuum
application (which includes all of the circles bounded by r38 except for the holes for the registrations at the center of
each circle) defined in §5 of SEMI E62 (which specifies r38 as well as the seal zone dimensions). These automated
door and frame surfaces must be a distance of y52 from the facial datum plane and must have a flatness of y42. No
surface on the automated door may project further from the facial datum plane than the door seal zone and the
reserved spaces for vacuum application. The automated door must also be designed so that when the box is pressed
against the FIMS port, both latch keys on the port are inserted to their full length. Furthermore, when the latch keys