semi合集-English.pdf - 第1652页

SEMI E38-1296 © SEMI 1995 , 1996 41 When the putting of t he wafer is now successful, the PM commands the transpor t m odule to Retract. PM2 TM >>------------------------------------->> HORetract.Req(Port=Por…

100%1 / 7923
SEMI E38-1296 © SEMI 1995, 1996 40
Data collection is then disabled.
CC PM2
>>------------------------------------->>
Set.Req(EREvent,EventID=Event1,
Enabled=FALSE)
CC PM2
<<-------------------------------------<<
Set.Rsp(EREvent,EventID=Event1,Status=OK)
15. PM2 to CM TRANSFER JOB SETUP
The CC informs the TM that a wafer transfer is required
from the PM2 to CM.
CC TM
>>------------------------------------->>
TRJobCreate.Req(MID="Wafer1",
TRSourceAmID="PM2",
TRDestinationAmID="CM")
The transport module assigns an identifier for this
particular transfer job. The transfer job is then started
by the transport module.
CC TM
<<-------------------------------------<<
TRJobCreate.Rsp(JobID=TMJob3,Status= OK)
CC TM
<<-------------------------------------<<
TRJobStarted.Req(JobID=TMJob3, TimeStamp)
16. CC TO PM2 SEND WAFER
The CC informs the PM2 that a wafer is to be
transferred to the TM.
CC PM2
>>------------------------------------->>
TRJobCreate.Req(MID="Wafer1",Port=
"Port1", Dir=Send))
CC PM2
<<-------------------------------------<<
TRJobCreate.Rsp(JobID=IOJob6,Status=OK)
CC PM2
<<-------------------------------------<<
TRJobStarted.Req(JobID=IOJob6, TimeStamp)
When the process module is ready, it directly
communicates with the transport module to indicate its
readiness for wafer handoff.
TM PM2
<<-------------------------------------<<
HOReady.Req(PortID="Port1",AmID="PM2",
HODir=GET,MID="Wafer1")
17. CC TO CM RECEIVE WAFER
The CC informs the CM that a wafer is to be transfered
from the TM.
CC CM
>>------------------------------------->>
TRJobCreate.Req(MID="Wafer1",Port=
"Port1", Dir=Receive)
CC PM2
<<-------------------------------------<<
TRJobCreate.Rsp(JobID=IOJob7,Status=OK)
CC PM2
<<-------------------------------------<<
TRJobStarted.Req(JobID=IOJob7, TimeStamp)
When the cassette module is ready, it directly
communicates with the transport module to indicate its
readiness for wafer handoff.
TM CM
<<-------------------------------------<<
HOReady.Req(PortID="Port1",AmID="CM",
HODir=PUT,MID="Wafer1")
18. PM2 TO TM WAFER HANDOFF
The PM2 transfers the wafer to the TM through the
handoff sequence, and the TM will keep the cluster
controller informed of its transfer progress. The
transport module informs the process module that it is
proceeding with the “getting” of the wafer.
PM2 TM
<<-------------------------------------<<
HOReady.Req(Port=Port1,AmID="PM2",HODir=G
ET,MID="Wafer1")
The process module informs the TM to use the
EXTEND scenario as the put operation.
PM2 TM
>>------------------------------------->>
HOExtend.Req(Port=Port1,AmID="PM2")
PM2 TM
<<-------------------------------------<<
HOExtend.Rsp(Port=Port1,AmID="PM2",
Status=OK)
SEMI E38-1296 © SEMI 1995, 199641
When the putting of the wafer is now successful, the
PM commands the transport module to Retract.
PM2 TM
>>------------------------------------->>
HORetract.Req(Port=Port1,AmID="PM2")
PM2 TM
<<-------------------------------------<<
HORetract.Rsp(Port=Port1,AmID="PM2",
Status=OK)
Upon successful completion of the handoff, a verify
sequence is used to complete the transaction.
PM2 TM
>>------------------------------------->>
HOVerify.Req(Port=Port1,AmID="PM2")
PM2 TM
<<-------------------------------------<<
HOVerify.Rsp(Port=Port1,AmID="PM2",
Status=OK)
CC PM2
<<-------------------------------------<<
TRJobComplete.Req(JobID=IOJob6,
TimeStamp)
The cluster controller is informed that the processing
job in PM2 is complete.
CC PM2
<<-------------------------------------<<
PRJobComplete.Req(JobID=PM2Job1,
TimeStamp,Status=OK)
19. TM TO CM WAFER HANDOFF
The TM now has possession of the wafer and is ready
to proceed with the putting of the wafer into the cassette
module. First, the TM informs the cluster controller that
it is proceeding with the transfer of the wafer to CM
through the handoff sequence.
CM TM
<<-------------------------------------<<
HOReady.Req(Port=Port1,AmID="CM",
HODir=PUT,MID="Wafer1")
The cassette module informs the transport module to
use the PLACE sequence to put the wafer.
CM TM
>>------------------------------------->>
HOPlace.Req(Port=Port1,AmID="CM")
CM TM
<<-------------------------------------<<
HOPlace.Rsp(Port=Port1,AmID="CM",
Status=OK)
When the putting of the wafer has been successful, the
cassette module informs the transport module with a
verify sequence.
CM TM
>>------------------------------------->>
HOVerify.Req(Port=Port1,AmID="CM")
CM TM
<<-------------------------------------<<
HOVerify.Rsp(Port=Port1,AmID="CM",Status=
OK)
The cassette module then informs the cluster controller
of its current status.
CC CM
<<-------------------------------------<<
TRJobComplete.Req(JobID=IOJob7,
TimeStamp,Status=OK)
The TM then informs the cluster controller that the
putting of material is finished and that the requested
transfer job is complete.
CC TM
<<-------------------------------------<<
TRJobComplete.Req(JobID=TMJob3,
TimeStamp,Status=OK)
20. CM TO FACTORY CASSETTE HANDOFF
The cassette is passed from the cluster tool to the
factory environment.
CC CM
>>------------------------------------->>
TRJobCreate.Req(MID="Carrier1",
Port=Port2,Dir=Send)
CC CM
<<-------------------------------------<<
TRJobCreate.Rsp(JobID=IOJob8,Status=OK)
CC CM
<<-------------------------------------<<
TRJobStarted.Req(JobID=IOJob8, TimeStamp)
SEMI E38-1296 © SEMI 1995, 1996 42
At this point, it is assumed that the cassette module
performs actions such as loadlock venting, door
opening, and initiating communication with the user
(human or host) to perform the handoff to the factory.
The cluster controller is informed of progress. When
the transfer to the factory is complete, the cluster
controller is informed.
CC CM
<<-------------------------------------<<
TRJobComplete.Req(JobID=IOJob8,
TimeStamp,Status=OK)
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.