semi合集-English.pdf - 第2606页

SEMI E91-0600 © SEMI 1999 , 2000 11 7.4 Dat a Item Variable T able Table 7 Data Item Variable Table Variable Name Descriptio n Class Format Comments StopUnit Constant whic h speci fie s separation of stop operatio n in p…

SEMI E91-0600 © SEMI 1999, 2000 10

Table 5 Collection Events Required by Prober Job State Transition

Transition Current State New State

Typical Variable

Data

JOB Created Undefined JOB CREATED

JOB Canceled JOB CREATED Undefined

JOB Started JOB CREATED JOB SET UP

Enter Processing JOB SET UP JOB PROCESSING

End Processing JOB PROCESSING Undefined

Start Aborting JOB SET UP, JOB PROCESSING JOB ABORTING

End Aborting JOB ABORTING Undefined

Start Stopping JOB SET UP, JOB PROCESSING JOB STOPPING

End Stopping JOB STOPPING Undefined

EventJobID

Table 6 Other Collection Events

Event Name Contents Typical Variable Data

Wafer Start Wafer processing was started. WaferStartJobID, WaferStartWaferID

Wafer End Wafer processing was completed. WaferEndJobID, WaferEndWaferID

Ready to Receive

Previous Data

Waits for reception of instructed data for wafer. WaitPreDataJobID, WaitPreDataWaferID

7 Data Item Variables

7.1 The purpose of this section is to define the list of

data item variables required by the PSEM. Values of

these variables will be available to the host through

collection event reports and host status queries.

7.2 Requirements

7.2.1 All generic variable data items defined in GEM

are required by all PSEM equipment. Any supplier-

defined variables shall be documented in the same

format used by this document. The following minimum

information is required:

<variable name> Class: <ECV, SV, or DVVAL>

Format: <SML>

Description: <if class=DVVAL, description must

contain statement of when data is

valid>.

<If format = ASCII then a length is

required. It is assumed to be left-

justified unless otherwise noted. >

7.3 Data Types

7.3.1 Equipment Constants (ECVs) can be changed by

the host using S2F15. The operator may be able to

change some values, but the equipment does not change

the values on its own. The value of an equipment

constant may be queried by the host at any time, using

the S2F13/14 transaction. They reside in non-volatile

memory of the equipment. Equipment constants remain

in effect until they are overwritten either by manual

entry or by a NEW EQUIPMENT CONSTANT SEND.

Equipment constants have various uses in PSEM,

including the following:

• Equipment offsets that match the performance of

several pieces of equipment that would otherwise

perform differently due to inherent manufacturing

differences. Examples are home values and motion

axis scaling factors.

• Setting the configuration of the equipment to allow

for different material specifications, equipment

options, material flows, frequency of automatic

functions, etc. Examples are yield check frequency.

• Managing optional machine features. Examples are

constants that tell the system whether optional

features such as automated media stackers are

present and control the configuration and function

of these optional subsystems when they are

present.

7.3.2 Status Variables (SVs) are val id at all times. A

SV may not be changed by the host but may be changed

by the equipment or operator. The value of status

variables may be queried by the host at anytime using

the S1,F3/4 or S6,F19/20 transactions. DVVALs are

variables that are valid only upon the occurrence of

specific collection events. An attempt to read a data

variable at the wrong time will not generate an error,

but the data reported may not have relevant meaning.

SEMI E91-0600 © SEMI 1999, 200011

7.4 Data Item Variable Table

Table 7 Data Item Variable Table

Variable Name Description Class Format Comments

StopUnit Constant which specifies separation of stop

operation in probing.

ECV U1 0=Unit of Die

1=Unit of Wafer

2=Unit of Cassette

3=Unit of Lot

EventJobID Prober Job ID which occurs Prober Job state

transition.

DVVAL A[30] Valid when Prober Job state

transition occurs.

EventJobState Current state of Prober Job whose state changed. DVVAL U2 Valid in event of Prober Job

state transition.

ResultData Processing result in unit of one wafer. DVVAL L[n] Valid only in wafer end event.

8 Process Program Manage ment

8.1 PSEM explains how to specify a process program for the prober and the process program control between the

host and prober.

8.2 Process Program Requirements

8.2.1 The PSEM requires that the G EM capability of process program management be fully supported for this class

of prober.

8.3 Process Program

8.3.1 The process program of the prober consists of the main process program and two or more sub process

programs that are referred to by the main process program.

Table 8 Kinds and Descriptions of Process Programs

Kind Description

Product type master record Master process program for processing.

Sub-parameter record Sub-process program for processing.

Various kinds of parameter records that consist main process program for processing.

8.3.2 These process programs are controlled by the prober with grouped into different categories according to

application purposes and structures. The prober defines PPID with “structure class name/class name/process

program record name.” The number of PPID digits is defined by an equipment supplier. If the number of the digits

is less than a default value, left-justify and fill in space after PPID. Do not use space at some midpoint in PPID. At

present, the prober practically uses the structure class name and class name as shown in the table given below.

Table 9 How to Operate Class Name and Structural Class Name

Classification Operation Remarks

Structural class name Class name indicating major classification of process program record. Defined by supplier.

Class name Class name indicating attribute of process program record. Defined by supplier.

8.4 Master Process Program Reco rd

8.4.1 The master process program re cord is a plain text (ASCII) record like below:

DEVICE:xxxxxxxx

WAFER_SIZE:xx

DIE_SIZE:xxxxxx,xxxxxx

.........

PARAM_RECORD00:structure class name/class name/process program record name

.........

PARAM_RECORDnn:structure class name/class name/process program record name

8.4.1.1 Each line has a structure:

TAG + ":" + parameter(s) + line terminator

8.4.1.2 The line terminator is some of CR+LF (0x0d0a), CR (0x0d), LF (0x0a).

8.4.1.3 Specific parameters of equipment supplier may be put between "HOT_CHUCK_TOLE" and

"PARAM_FILE00".

Table 10 Tag Parameters in Master Process Program

Tag Description Format Unit

PRODID Product name (i.e., Device type) A[1,24] -

WAFER_SIZE Wafer size A[1,3] mm

DIE_SIZE_X Die size X A[1,6] micron

DIE_SIZE_Y Die size Y A[1,6] micron

MULTI_DIE Multi probing number A[1,3] -

REFERENCE_DIE_COORD_X Reference die coordinator X A[1,4] -

REFERENCE_DIE_COORD_Y Reference die coordinator Y A[1,4] -

OVER_DRIVE Over drive value A[1,4] micron

FLAT_ANGLE Flat orientation A[1,3] degree

FLAT_TYPE FLAT or NOTCH A[1,5] -

HOT_CHUCK Flag of hot chuck usage A[2,3]

“ON” or “OFF”

HOT_CHUCK_TEMP Hot chuck temperature A[1,4] Celsius

HOT_CHUCK_TOLE Hot chuck tolerance A[1,3] Celsius

PARAM_RECORDnn Sub-parameter record nn A[ ] -

9 Map Data

9.1 This section defines handling o f map data in the PSEM equipment. The contents of map data are not defined

here. The specification in this section is provisional. This will be revised in the near future.

9.2 Use of Map Data

9.2.1 Map data is divided into two groups: result data which is reported to the host when processing of each wafer

is completed and instruction data which is instructed by the host in a unit of wafer at the time of re-inspection or

marking.

9.3 Structure of Map Data

9.3.1 The map data has a list structu re and the result data is defined by class <DVVAL> and the instruction data is

defined by <CEPVAL>.

9.3.1.1 Example:

L,n

1. <Data