semi合集-English.pdf - 第6337页

3 SEMI G66-96 © SEMI 1996, 2004 13.1.5 Date of test 14 Related Documents 14.1 ASTM Specification 1 ASTM D 570 — Stan dard Test Method for Water Absorption of Plastic 1 American Society for Testing and Materials, 100 Barr…

100%1 / 7923
SEMI G66-96 © SEMI 1996, 2004 2
8 Sampling Plan
8.1 At least three samples shall be chosen for each
molding type for each test.
9 Test Specimens
9.1 Test specimens are required as follows:
9.1.1 Specimens for diffusion area.
9.1.1.1 Diameter — 50 ± 1 mm
9.1.1.2 Thickness — 3 ± 0.2 mm
9.1.2 Specimens for saturated area.
9.1.2.1 Diameter — 50 ± 1 mm
9.1.2.2 Thickness — 1 ± 0.2 mm
10 Equipment Set-Up
10.1 Refer to manufacturer’s operation manuals.
11 Procedure
11.1 Specimen Preparation
11.1.1 Prepare the specimens by molding samples
using the specimen mold and conditions recommended
by the molding compound manufacturer.
11.1.2 Post-mold cure the specimens to recommended
conditions using the high-temperature chamber.
11.2 Specimen Conditioning
11.2.1 Dry the specimens at 125°C in the high-
temperature chamber for 24 hours minimum.
NOTE 1: If the samples are already dry (e.g., samples
directly from post-mold cure), additional conditioning is not
required.
11.2.2 Place the specimens in the desiccator (1) and
allow to cool to room temperature.
11.2.3 Weigh the specimens to the nearest 0.0001g.
11.3 Water Absorption Exposure and Reconditioning
11.3.1 Diffusion Area
11.3.1.1 Place the conditioned specimens (3 mm
thickness) in the high-temperature/humidity chamber
set at 85°C and 85% relative humidity for 24 ± 1 hours.
NOTE 2: The specimens should be placed to avoid any
contact with each other and with the walls of the chamber,
e.g. to use a holder or to place on a wire net.
11.3.1.2 Remove the specimens from the chamber and
wipe off any excess water from the surfaces with a
clean cloth or absorbant paper.
11.3.1.3 Place the specimens in desiccator (2) and
allow to cool to room temperature.
NOTE 3: The specimens should be placed to avoid any
contact with each other and with the walls of the chamber
(e.g., to use a holder or to place on a wire net).
11.3.1.4 Re-weigh the specimens to the nearest 0.0001
g.
11.3.2 Saturated Area
11.3.2.1 Place the conditioned specimens (1 mm
thickness) in the high-temperature/humidity chamber
set at 85°C and 85% relative humidity for 168 ± 4
hours.
NOTE 4: The specimens should be placed to avoid any
contact with each other and with the walls of the chamber
(e.g., to use a holder or to place on a wire net).
11.3.2.2 Remove the specimens from the chamber and
wipe off any excess water from the surfaces with a
clean cloth or absorbant paper.
11.3.2.3 Place the specimens in desiccator (2) and
allow to cool to room temperature.
NOTE 5: The specimens should be placed to avoid any
contact with each other and with the walls of the chamber,
e.g. to use a holder or to place on a wire net.
11.3.2.4 Re-weigh the specimens to the nearest
0.0001g.
12 Calculations
12.1 Water Absorption Rate — The rate is calculated as
follows:
12.1.1 Water absorption rate (wt%) = ( (M2 M1) /M1)
× 100 (1)
Where:
M1 is the initial conditioned weight, and
M2 is the reconditioned weight after exposure to
temperature/humidity
12.2 Diffusion and Solubility Coefficients
12.2.1 There are various methods to calculate diffusion
and solubility coefficients. See Appendix 1 for one of
these methods.
13 Report
13.1 The following information shall be reported:
13.1.1 Manufacturer and identification of molding
compound
13.1.2 Specimen sizes
13.1.3 Test conditions
13.1.4 Water absorption rate
3 SEMI G66-96 © SEMI 1996, 2004
13.1.5 Date of test
14 Related Documents
14.1 ASTM Specification
1
ASTM D 570 — Standard Test Method for Water
Absorption of Plastic
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohocken, Pennsylvania 19428-2959, USA.
Telephone: 610.832.9585, Fax: 610.832.9555, Website:
www.astm.org
SEMI G66-96 © SEMI 1996, 2004 4
APPENDIX 1
APPLICATION NOTES — METHOD OF CALCULATION FOR
DIFFUSION AND SOLUBILITY COEFFICIENT
NOTICE: The material in this appendix is an official part of SEMI G66 and was approved by full letter ballot
procedures.
A1-1 Purpose
A1-1.1 This application note describes a method for
calculating diffusion and solubility coefficients.
A1-2 Solubility Coefficient, S
A1-1.2 The solubility coefficient is given from the data
of saturated area as follows:
A1-1.2.1 S= M
s
d / P 1000 (2)
Where:
S = Solubility coefficient ((mg/cm
3
/ (kg/mm
2
))
M Saturated moisture absorption rate (wt%) (data
from saturated area test)
D = Density of specimen (g/cm
3
)
P = Partial pressure of moisture in environment (Pa)
(value at 85 C in this test)
A1-3 Diffusion Coefficient, D
A1-1.3 The moisture absorption rate in resin exposed
for relatively short term is calculated using the
following equation based on Fick’s formula:
M
t
/ M
s
4{ (D t) / (1
) }
1/2
(3)
Then:
D = 1
2
M
t
2

/ (t 4
2
M
s
2
) (4)
Where:
D = Diffusion coefficient (cm
2
/ h)
t = Time of moisture absorption (h) (data from diffusion
area test — 24 hours)
M
t
= Moisture absorption rate at the time "t" (wt%)
(data from diffusion area test)
1 = Thickness of the specimen (cm) (data from
diffusion area test = 0.3 cm)
M
5
Saturated moisture absorption rate (wt%) (data of
saturated area test)
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standard set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights
asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised
that determination of any such patent rights or
copyrights, and the risk of infringement of such rights,
are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.