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SEMI E35-0305 © SEMI 1995, 2005 19 Example Values Description 150 mm Example #1 200 mm Example #2 300 mm Example #3 8. Installation Cost as Percent of Equipment Cost Lithography NA NA 8% Metrology NA NA 5% Other NA NA 12…

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SEMI E35-0305 © SEMI 1995, 2005 18
RELATED INFORMATION 2
EXAMPLE VALUES TABLE
NOTICE: This related information is not an official part of SEMI E35 and is not intended to modify or supersede
the official standard. It has been derived from multiple sources. Publication was authorized by vote of the SEMI
Metrics Committee. These values are provided only as examples. Actual values should be determined by
considering company experience, specific equipment characteristics, applications, process technology, product type,
regional differences and analysis objectives. Determination of the suitability of the material is solely the
responsibility of the user.
Example Values Description 150 mm Example
#1
200 mm Example
#2
300 mm Example
#3
1. Fab Values
Engineering Usage 0 0 0
Standby Time 0 0 0
Production Tests 127 14 14
MTTT 0.31 0.25 0.3
Whole Systems NA 1 1
2. Scheduled Production
Hours/Week/Shift 42 42 42
Shifts/Week 4 4 4
Hours/Day 24 24 24
Days/Year 350 365 365
Supplier Shifts/Week NA 4 4
3. Labor and Salary Rates
Engineering $100,000 $111,000 $111,000
Supervision $80,000 $111,000 $111,000
Operator/Hour $26 $25 $25
Maintenance/Hour $26 $30 $30
Productivity 80% 80% 80%
4. Space Rates in cost/m
2
/year (cost/ft
2
/year)
Fed. Std 209E Class 1 or ISO Class 3 $3875 ($360) $4306 ($400) $4306 ($400)
Fed. Std 209E Class 10 or ISO Class 4 $2583 ($240) $2691 ($250) $2691 ($250)
Fed. Std 209E Class 100 or ISO Class 5 $1076 ($100) $1076 ($100) $1076 ($100)
Other $538 ($50) $538 ($50) $538 ($50)
5. Wafer Costs
Test Wafer $5.50 $100 $500
Test Wafer Reuse Times
1
1 10 10
Incoming Wafer $250 $500 $1317
Completed Wafer $500 $1000 $2034
6. Depreciation Values
Life of Equipment Years 5 7 7
Depreciation Life Years NA 5 5
Salvage Value $0 $0 $0
Depreciation Method Straight Line Straight Line Straight Line
7. Other Values
Systems/Engineer 5 10 10
Systems/Supervisor 20 30 30
Systems/Operator 2 3 3
Defect Fault Probability 0.167 0.05 0.08
SEMI E35-0305 © SEMI 1995, 2005 19
Example Values Description 150 mm Example
#1
200 mm Example
#2
300 mm Example
#3
8. Installation Cost as Percent of Equipment Cost
Lithography NA NA 8%
Metrology NA NA 5%
Other NA NA 12%
#1
Derived from SEMATECH Cost of Ownership Rev. B December 1990.
#2
Approved, Metrics Committee, July 11, 1995.
#3
Derived from joint Selete and International 300mm Initiative (I300I) inputs, 1997.
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant
literature, respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
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respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E35.1-95 © SEMI 1995, 2004 1
SEMI E35.1-95 (Withdrawn 0304)
GUIDE FOR COST OF EQUIPMENT OWNERSHIP COMPARISON
METRIC
NOTICE: This document was balloted and approved for withdrawal in 2004.
1 Purpose
1.1 The purpose of this guide is to provide a standard
constrained version of the Cost of Ownership for
Semiconductor Manufacturing Equipment Metrics
Guide to provide a baseline metric for comparing cost
effectiveness of competitive factory equipment
subsystems in the semiconductor industry. The major
constraints are the inclusion of only Equipment Yield
and the exclusion of the Cost of Yield Loss consisting
of defect limited yield and parametric yield.
1.2 The guide establishes well-defined practice to
facilitate cost comparisons of equipment by using
definitions, classifications and methods necessary to
build a useful cost of equipment ownership comparator
as a constraint version of SEMI E35. The guide should
facilitate communication about cost of ownership.
2 Scope
2.1 This guide is a subset of a full COO calculator as
presented in SEMI E35 and constitutes a fully
conforming standard constraint version. The baseline
metric is meant to reflect those equipment aspects over
which an equipment supplier has responsibility and
seeks to minimize aspects which couple costs for
individual equipment to the entire factory system. The
use of the metric is for competitive evaluation of
equipment sets to be used for a specific process step.
2.2 Effective use of the metric to build a COO model
requires identification of the constraints, parameter
values within the adopted category classification. The
primary calculators should, where possible, use direct
values for inputs rather than deriving them from
secondary models or using the default values provided
in Related Information 1 and 2 in SEMI E35. A COO
model requires data for many parameters. Default data
for the COO is provided within this document and may
be updated periodically through support documents.
3 Referenced Documents
3.1 SEMI Documents
SEMI E10 — Guideline for Definition and
Measurement of Equipment Reliability, Availability,
and Maintainability
SEMI E35 — Guideline for Cost of Ownership for
Semiconductor Manufacturing Equipment Metrics
SEMI Compilation of Terms
4 Terminology
All terminology in this guideline is defined in SEMI
E35.
5 Cost of Equipment Ownership Comparator
The Cost of Equipment Ownership Comparator
(CEOC) metric is the incremental cost added to a good
wafer or IC device flowing through a volume sized
process system embedded in a factory environment for
a specified lifetime. The metric is expressed as Cost per
Good Wafer Equivalent for one pass through the
system. CEOC should reflect the full cost of embedding
and operating in a factory environment a process
system needed to accommodate a specified number of
wafers but does not include defect yield or parametric
yield loss.
5.1 CEOC: Fixed and Recurring Costs — Determining
the Cost of Ownership requires enumerating all of the
Fixed and Recurring costs. Fixed costs are those
incurred once and are usually associated with the
acquisition and incorporation of equipment into the
factory. Recurring costs are those which arise on an
annual basis from the operation and maintenance of the
equipment.
5.2 Yield
5.2.1 Production yield (PY) is often tied to a large
number of factors which are principally the
responsibility of the IC manufacturer and equipment
comparisons for production yield should be done
directly in the context of the production flow. Yield is a
metric of the percentage of the wafer volume that
results in good wafers and enters the picture in a
number of ways which can complicate comparisons.
Yield-related comparisons of equipment should be dealt
with directly rather than lumping them into the CEO.
COST of
Embedding + Operating
CEO =
annualized
Fixed Costs
per system
annualized
Recurring Costs
per system
+
(
)
*
Volume Required
# Systems
Good Units
Per Year
5.2.2 Particles additions for example are often used as
a predictor of yield loss. Equipment should be