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SEMI E48-1101 © SEMI 1995 , 2001 3 Figure 2 Integrated SMIF Top Vi ew NOTICE: SEMI makes no w arra nties or representations as to the suitability of the specification se t forth herein for any particular application. T h…

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SEMI E48-1101 © SEMI 1995, 2001 2
B2 — Maximum distance from the side of the indexer unit to the cassette or container centroid.
B3 — Maximum distance from the front of the indexer unit to the cassette or container centroid.
B4 — Minimum breadth required for the indexer unit in a tool.
B5 — Maximum distance that can be penetrated underneath the port plate.
S — Recommended minimum spacing between cassette or container controids.
Figure 1
Integrated SMIF Side View
SEMI E48-1101 © SEMI 1995, 20013
Figure 2
Integrated SMIF Top View
NOTICE: SEMI makes no warranties or representations as to the suitability of the specification set forth herein for
any particular application. The determination of the suitability of the specification is solely the responsibility of the
user. Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other
relevant literature respecting any materials mentioned herein. These specifications are subject to change without
notice.
The user’s attention is called to the possibility that compliance with this specification may require use of
copyrighted material or of an invention covered by patent rights. By publication of this specification, SEMI takes
no position respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned
in this specification. Users of this specification are expressly advised that determination of any such patent rights or
copyrights, and the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E49-1104 © SEMI 1995, 2004 1
SEMI E49-1104
GUIDE FOR HIGH PURITY AND ULTRAHIGH PURITY PIPING
PERFORMANCE, SUBASSEMBLIES, AND FINAL ASSEMBLIES
This standard was technically approved by the Global Gases Committee and is the direct responsibility of the
North American Gases Committee. Current edition approved by the North American Regional Standards
Committee on August 16, 2004. Initially available at
www.semi.org
September 2004; to be published
November 2004. Originally published 1995; last published March 2004.
1 Purpose
1.1 The purpose of this overview document is to
provide a basic set of terminology and reference
documents for SEMI E49.2–E49.8 and E137.
2 Scope
2.1 This document contains terminology and reference
documents used in SEMI E49.2–E49-8 and E137,
which will reference performance and method standards
as well as recommended practices.
2.1.1 The SEMI E49 subdocuments are organized by
types of piping distribution systems — gas,
DI/chemical, solvent — and by types of assembly and
testing procedures — sub-assembly for stainless steel,
sub-assembly for polymer and final tool assembly.
Final assemblies should be tested or validated for all
appropriate parameters (e.g., purity, integrity, failure
rate) as specified in the applicable E49 subdocuments.
2.1.2 The piping distribution documents (SEMI E49.2
through E49.8) include guidelines for system design,
performance, materials, and components. Purity and
performance grades are described for each of the three
types of distribution systems.
2.1.3 Users should complete an overall tool cost of
ownership analysis (see SEMI E35) to determine the
optimum application of HP or UHP tool features. Key
parameters should include facilities cost and installation
cycle time, piping system reliability and maintainability
factors, tool and sub-system contribution to
contamination, and resultant effects on wafer quality
and wafer throughput factors.
2.2 Final assemblies should be evaluated according to
the criteria of SEMI S2 for Environmental, Health and
Safety (EH&S) issues associated with their use.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI C41 — Specifications and Guidelines for 2-
Propanol
SEMI E10 — Specification for Definition and
Measurement of Equipment Reliability, Availability,
and Maintainability (RAM)
SEMI E35 — Cost of Ownership for Semiconductor
Manufacturing Equipment Metrics
SEMI E49.2 — Guideline for the Qualification of
Polymer Assemblies Used in Ultrapure Water and
Liquid Chemical Systems in Semiconductor Process
Equipment
SEMI E49.4 — Guide for High Purity Solvent
Distribution Systems In Semiconductor Manufacturing
Equipment
SEMI E49.5 — Guide for High Purity Solvent
Distribution Systems In Semiconductor Manufacturing
Equipment
SEMI E49.6 — Guide for Subsystem Assembly and
Testing Procedures - Stainless Steel Systems
SEMI E49.7 — Purity Guide for the Design and
Manufacture of Ultrapure Water and Liquid Chemical
Systems in Semiconductor Process Equipment
SEMI E49.8 — Guide for High Purity and Ultrahigh
Purity Gas Distribution Systems In Semiconductor
Manufacturing Equipment
SEMI E137 — Guide for Final Assembly, Packaging,
Transportation, Unpacking, and Relocation of
Semiconductor Manufacturing Equipment
SEMI F1 — Specification for Leak Integrity of High-
Purity Gas Piping Systems and Components
SEM F19 — Specification for the Surface Condition of
the Wetted Surfaces of Stainless Steel Components