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SEMI F21-1102 © SEMI 1995, 2002 3 RELATED INFORMATION 1 SPECIFIC CONTAMINANTS TO MEASURE FOR VERIFICATION OF ENVIRONMENTAL COMPLIANCE NOTE: This related information is not an o fficial part of SEMI F21 and is not inte nd…

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SEMI F21-1102 © SEMI 1995, 2002 2
8.2 Other
8.2.1 Berro, N., Cook, J.P.D., et al., “Airborne
Contamination of Semiconductor Wafers Traced to
Humidification Plant Additives,” Journal of the IES,
pp. 15–18, November 1993.
8.2.2 Buchmann, K. and Rudolph, J., “Gas Chromato-
graphy of Radioactive Inorganic Compounds,” Journal
of Radiational Chemistry, 32(2): 245–64, 1976.
8.2.3 Dixon, W.J., “Processing Data for Outliers,”
Biometrics, 9(7): 74–89.
8.2.4 Kasi, S.R., Liehr, M., Thiry, P.A., et al.,
“Hydrocarbon Reaction with HF-Cleaned Si (100) and
Effects on Metal-Oxide-Semiconductor Device
Quality,” Applied Physics Letters, 59: 108–110, 1992.
8.2.5 Kelly, T.J. and Kinkead, D.A., “Testing of
Chemically Treated Adsorbent Air Purifiers,” ASHRAE
Journal, August 1993.
8.2.6 Kinkead, D.A., “Controlling a Killer: How to
Win the War Over Gaseous Contaminants,”
Cleanrooms, June 1993.
8.2.7 Kinkead, D.A. and Higley, J.K., “Targeting
Gaseous Contaminants in Wafer Fabs: Fugitive
Amines,” Microcontamination, pp. 37–40, June 1993.
8.2.8 Mori, E.J., Dowdy, J.D., and Shive, L.W.,
“Correlating Organophosphorus Contamination of
Wafer Surfaces with HEPA Filter Installation,”
Microcontamination, pp. 35–37, November 1992.
8.2.9 Muller, A.J., et al., “Volatile Cleanroom
Contaminants: Sources and Detection,” Solid State
Technology, September 1994, page 61.
8.2.10 Muller, A.J., Psota-Keity, L.A., and Sinclair,
J.K., “Concentrations of Organic Vapors and Their
Surface Arrival Rates at Surrogate Wafers During
Processing in Clean Rooms,” Proceedings of the
Electrochemical Society: Semiconductor Cleaning
Technology, Hollywood, FL, Ruzyllo, J. and Novak,
R.E. (eds.), vol. 90–9, pp. 204–211, 1990.
8.2.11 Seeman, D.J., “Fluid Seal Urethane
Gels/Chemical Compounds: The Need to Establish
Standards and Standard Test Procedures for Their
Acceptance in the Cleanroom Environment,”
Proceedings of 38th Annual Technical Meeting of IES,
Nashville, TN, pp. 492–497, May 1992.
8.2.12 Stevie, F.A., Harrus, A.S., Muller, A.J., et al.,
“Boron Contamination of Surfaces in Silicon
Microelectronics Processing: Characterization and
Causes,” Journal of Vacuum Science and Technology,
A9(5), 2813, 1991.
8.2.13 Tolg, G. and Tschopel, P., “Sources of Error in
Trace Inorganic Analytical Chemistry,” Systemic
Errors in Trace Analysis, Verlag VCH, Weinheim,
1993 in print.
SEMI F21-1102 © SEMI 1995, 2002 3
RELATED INFORMATION 1
SPECIFIC CONTAMINANTS TO MEASURE FOR VERIFICATION OF
ENVIRONMENTAL COMPLIANCE
NOTE: This related information is not an official part of SEMI F21 and is not intended to modify or supercede the official
standard. It has been derived from the work of the originating task force. Publication was authorized by full ballot procedures.
Determination of the suitability of the material is solely the responsibility of the user.
Although it is difficult to compile an inclusive list, the
originating task force recommends that the user test the
air for each of the contaminants listed.
R1-1 Acids
• Hydrofluoric
• Sulfuric
• Hydrochloric
• Nitric
• Phosphoric
• Hydrobromic
R1-2 Bases
• Ammonia (ammonium hydroxide)
• Tetramethylammonium hydroxide
• Trimethylamine
• Triethylamine
• NMP
• Cyclohexylamine
• Diethylaminoethanol
• Methylamine
• Dimethylamine
• Ethanolamine
• Morpholine
R1-3 Condensables
• Silicone (boiling point ≥ 150°C)
• Hydrocarbon (boiling point ≥ 150°C)
R1-4 Dopants
• Boron (usually as boric acid)
• Phosphorous (usually as organophosphates)
• Arsenic (usually as arsenates)
SEMI F21-1102 © SEMI 1995, 2001 4
RELATED INFORMATION 2
EXAMPLE OF AN ANALYSIS REPORT
NOTE: This related information is not an official part of SEMI F21 and is not intended to modify or supercede the official
standard. It has been derived from the work of the originating task force. Publication was authorized by full ballot procedures.
Determination of the suitability of the material is solely the responsibility of the user.
Analysis for compliance with SEMI Standard Classification MA-10:
Site : FAB 3
Test date and duration : 18 August 1994, 0800
–
1700, 9 hours
Contaminants measured : Hydrofluoric acid
1 pptm
Sulfuric acid
1 pptm
Hydrochloric acid 2 pptm
Nitric acid
1 pptm
Phosphoric acid
2 pptm
Hydrobromic acid
1 pptm
Total 8 pptm
Detection Limits : 1 pptm for each analyte
Confidence Level :
95%
Assumptions made : All acids determined as anions after water scrubbing;
anions can be from other sources but are assumed to
be in the acid form for reporting purposes.
Conclusion :
This environment meets the MA -10 criterion in
SEMI F21.
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