semi合集-English.pdf - 第1211页

SEMI E5-1104 © SEMI 1982, 2004 153 Stream,Function Name (Mnemonic) Direction S10,F9 Broadcast (BCN) S,H->E,[re ply] Description This function is generally the same as S10,F3 except that specific TID in each equipment …

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SEMI E5-1104 © SEMI 1982, 2004 152
Stream,Function Name (Mnemonic) Direction
S10,F4 Terminal Display, Single Acknowledge (VTA) S,H<-E
Description
Acknowledge or error
Structure
<ACKC10>
Exception
None
Stream,Function Name (Mnemonic) Direction
S10,F5 Terminal Display, Multi-Block (VTN) M,H->E,[reply]
Description
Data to be displayed on the equipment’s terminal.
Structure
L,2
1. <TID>
2. L,n
1. <TEXT
1
>
.
.
n.<TEXT
n
>
Exception
None
Stream,Function Name (Mnemonic) Direction
S10,F6 Terminal Display, Multi-block Acknowledge (VMA) S,H<-E
Description
Acknowledge or error
Structure
<ACKC10>
Exception
None
Stream,Function Name (Mnemonic) Direction
S10,F7 Multi-block Not Allowed (MNN) S,H<-E
Description
An error message from a terminal that cannot handle a multi-block message from S10,F5.
Structure
<TID>
Exception
None
S10,F8 Not Used
SEMI E5-1104 © SEMI 1982, 2004 153
Stream,Function Name (Mnemonic) Direction
S10,F9 Broadcast (BCN) S,H->E,[reply]
Description
This function is generally the same as S10,F3 except that specific TID in each equipment need not be specified. Instead, the text
is directed to each terminal in the equipment when the function is received. This function assumes that this feature exists on all
equipment, otherwise repeated S10,F3 messages should be used.
Structure
<TEXT>
Exception
None
Stream,Function Name (Mnemonic) Direction
S10,F10 Broadcast Acknowledge (BCA) S,H<-E
Description
Acknowledge or error
Structure
<ACKC10>
Exception
None
SEMI E5-1104 © SEMI 1982, 2004 154
10.15 Stream 11 has been deleted and will not appear
again in this publication.
10.15.1 It is the consensus of the Communications
Committee that Stream 11 is obsolete. Its use is
discouraged, and it has been removed from the 1989
edition of the standard. The reasons for removal are
three-fold:
1. The purpose of this stream, as it was originally
envisioned, is perceived to be of little use and can
best be accomplished by other means beyond the
scope of this standard;
2. The functions in this stream have many technical
problems that severely limit their use;
3. There is a noticeable lack of implementations of
this standard that utilize Stream 11 in its originally
intended form.
NOTE 11: Applications that need to transfer unformatted
data between the host and equipment should use the facilities
of Stream 13.
10.16 Stream 12 Wafer Mapping — Messages which
deal with coordinate positions and data associated with
those positions. This includes functions such as wafer
mapping with coordinates of die on a wafer and the
associated binning information.
10.16.1 Structure — Functions 1 through 20 address
the variations required by semiconductor equipment
manufacturers in transmitting wafer maps to and from
the process equipment (wafer probe through die attach).
The functions include three basic formats. The three
formats developed are:
1. Row/column format where a coordinate row
starting position is given with die count in the row
and starting direction. The respective binning
information follows for each die.
2. Array format is structured such that a matrix array
captures all or part of a wafer with the associated
binning information.
3. Coordinate format provides an X/Y location and
bin code for die on the wafer.
10.16.2 Definitions and Descriptions — The following
information is required to perform map association to
the physical wafer as it relates to the archival use and
transmission of wafer maps.
1. Flat/Notch Location
2. Frame Rotation
3. Row Count
4. Column Count
5. Die Units of Measure
6. Die Size
7. Process Die Count
8. Reference Points
9. Bin Code Equivalents
10. Process Axis
11. Null Bin Code Value
12. ID Type
10.16.2.1 Flat/Notch Location — The position in
degrees that the flat or notch are oriented during
processing relative to a “normal” position of zero
degrees. See Figure 6.
10.16.2.2 Frame Rotation — The orientation of a film
frame relative to a “normal” position of zero degrees.
See Figure 7.
10.16.2.3 Row/Column Count — The row and column
counts are the total number of rows and columns,
respectively, on a wafer which must be correlated
directly with the wafer map. These numbers will
always be greater than zero.
10.16.2.4 Die Sizes — The die size is given in standard
units as specified by the die unit of measure item
DUTMS, and will also be greater than zero. The value
of the die size is determined by measuring the distance
from a point on one die to the same point on the next
die, often referred to as an index. This is depicted in
the lower portion of Figure 7, Section B in the General
Rules Section.
10.16.2.5 Process Die Count — The process die count
item is used by equipment that is being map driven to
make determinations about how much material to
prepare. For example, a die attach will epoxy lead
frames in advance of the attach process. By knowing
the total number of die to be processed within a wafer
map, the equipment can stop epoxying lead frames
equivalent to the last die to be attached. This item is
also used by the equipment to tell the host how many
total die it processed for that map. For example, a die
attach would use PRDCT to report the total die actually
attached from a particular wafer.
10.16.2.6 Reference Points — Reference points
provide a means of relating a map to the physical wafer.
The total number of these points, and the method for
assigning and detecting them, is the responsibility of
the equipment. This standard only provides a means for
transmitting them.
10.16.2.7 Origin — The origin is in one of five
locations which is specified by the equipment when
generating a wafer map. The origin is on an array
structure having dimensional values equal to those