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SEMI M3-0304 © SEMI 1978, 2004 4 meet the requirements, the material may be subject to rejection. 13 Packing and Marking 13.1 Special packing requirements shall be subject to agreement between the supp lier and th e purc…
SEMI M3-0304 © SEMI 1978, 2004 3
8.2.4 Front surface finish quality level (see Related
Information 2 and Figures R2-1 through R2-4 for
information on recommended front surface finish
quality levels), and
8.2.5 Back surface finish (see Related Information 2
for recommended back surface finish level).
9 Sampling
9.1 Unless otherwise specified, ASTM Practice E 122
shall be used. When so specified, appropriate sample
sizes shall be selected from each lot in accordance with
ANSI/ASQC Z1.4-1993. Each quality characteristic
shall be assigned an acceptable quality level (AQL) and
lot total percent defective (LTPD) value in accordance
with ANSI/ASQC Z1.4-1993 definitions for critical,
major, and minor classifications. If desired and so
specified in the contract or order, each of these
classifications may alternatively be assigned cumulative
AQL and LTPD values. Inspection levels shall be
agreed upon between the supplier and the purchaser.
10 Test Methods
10.1 Dimensions — Measure as follows:
10.1.1 Diameter — Determine by a method agreed
upon between the supplier and the purchaser at
locations specified in Configuration 1 of
SEMI MF2074.
NOTE 3: Sapphire substrates are highly susceptible to surface
damage. While the mechanical dimensions of a slice can be
measured by use of tools such as micrometer calipers and
other conventional techniques, the substrate may be damaged
physically in ways that are not immediately evident. Special
care must therefore be used in the selection and execution of
measurement methods.
10.1.2 Thickness, Center Point — Determine at the
center of the substrate (Point 2 in Figure 4) in
accordance with SEMI MF533.
10.1.3 Total Thickness Variation (5 point) —
Determine in accordance with SEMI MF533, except
that thickness measurements shall be made at the five
locations in Figure 4 instead of the locations specified
in SEMI MF533. Points 1, 3, 4, and 5 in Figure 4,
which define the locations of the edge measurements,
are located 6 mm in from the wafer periphery.
10.1.4 Flat Length — Determine in accordance with
SEMI MF671.
10.1.5 Bow — Determine in accordance with
SEMI MF534.
10.2 Flat Orientation — Determine in accordance with
SEMI MF847.
10.3 Surface Orientation — Determine in accordance
with the x-ray method of SEMI MF26.
10.4 Crystal Perfection — Unless otherwise specified,
determine in accordance with SEMI MF1810.
10.5 Surface Defects and Contamination — Determine
defects in accordance with SEMI MF523.
10.6 Other Impurities — Determine by methods agreed
upon between the supplier and the purchaser.
10.7 Front Surface Finish — Determine by methods
agreed upon between the supplier and the purchaser.
10.8 Back Surface Finish — Determine by methods
agreed upon between the supplier and the purchaser.
10.9 Flatness — Determine by a method agreed upon
between the supplier and the purchaser.
10.10 Edge Profile — Determine by a method agreed
upon between the supplier and the purchaser. Method
B of SEMI MF928 is a non-destructive way of
evaluating the shape of the edge profile; if this method
is used, the template to be used shall be agreed upon
between the supplier and the purchaser.
11 Flat System
11.1 Figures 2 and 3 describe the primary and
secondary flat system.
11.1.1 Primary Flat: 45° ± 2° in the counter-clockwise
direction from the projection of the c-axis along an r-
plane.
11.1.2 Secondary Flat (Optional): 90° ± 2° in the
counter-clockwise direction from the primary flat,
along an r-plane.
11.2 The a-axis lies between the two flats bisecting the
90° angle. Projection of the c-axis lies 45° in the
clockwise direction from the primary flat and 90° in the
clockwise direction from the a-axis.
12 Certification
12.1 Upon request of the purchaser in the contract or
order, a manufacturer’s or supplier’s certification that
the material was manufactured and tested in accordance
with this specification, together with a report of the test
results, shall be furnished at the time of shipment.
12.2 In the interest of controlling inspection costs, the
supplier and the purchaser may agree that the material
shall be certified as “capable of meeting” certain
requirements. In this context, “capable of meeting”
shall signify that the supplier is not required to perform
the appropriate tests in Section 11. However, if the
purchaser performs the test and the material fails to
SEMI M3-0304 © SEMI 1978, 2004 4
meet the requirements, the material may be subject to
rejection.
13 Packing and Marking
13.1 Special packing requirements shall be subject to
agreement between the supplier and the purchaser.
Otherwise all slices shall be handled, inspected, and
packed in such a manner as to avoid chipping,
scratches, and contamination, and in accordance with
the best industry practices to provide ample protection
against damage during shipment.
13.2 The substrates supplied under these specifications
shall be identified by appropriately labeling the outside
of each box or other container, and each subdivision
thereof, in which it may reasonably be expected that the
substrates will be stored prior to further processing.
Identification shall include, as a minimum, the nominal
diameter, orientation, and lot number. The lot number,
either (1) assigned by the original manufacturer of the
substrates, or (2) assigned subsequent to substrate’s
manufacture, but providing reference to the original lot
number, shall provide ready access to information
concerning the fabrication history of the particular
substrates in that lot. Such information shall be
retained on file at the manufacturer’s facility for at least
one month after that particular lot has been accepted by
the purchaser.
[n]
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Figure 1
Sapphire Crystallographic Diagrams
SEMI M3-0304 © SEMI 1978, 2004 5
Figure 2
Sapphire Surface Orientation
Figure 3
Primary and Secondary Flat Locations
Figure 4
Measurement Points for Determination of Layer Thickness Variation