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SEMI G38-0996 © SEMI 1987, 2004 6 Pattern ___________________________________________ 3. Measurement Condition Ambient Temperature, T a ________________ °C Ambient Humidity, H a ________________ %RH Air Velocity, V a 0, …

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SEMI G38-0996 © SEMI 1987, 2004 5
7 Summary Report
7.1 The following details shall be specified:
1. Description of Package
1.1 Package Type
Package Name ________________ (per JEDEC or EIAJ)
Pin Counts ________________ pins
Special Specification ________________ Yes ________________ No
If Yes, describe the detail specification.
1.2 Test Chip
Chip per SEMI G32 ________________ Yes ________________ No
Chip Size ________________ mm x ________________ mm
Chip Thickness ________________ mm
1.3 Leadframe
Leadframe Material Fe/Ni Alloy, Cu, Cu Alloy, Other (____________ )
Leadframe Thickness ________________ mm
Die Pad Size ________________ mm x ________________ mm
1.4 Package Dimension & Compound
Package Size ________________ mm x ________________ mm
Package Thickness ________________ mm
Compound Material ___________________________________________
1.5 Others
Die Attach Material ____________________________________________
Heat Sink/Spreader ________________ Yes ________________ No
If yes, describe the configuration, dimension, method of attachment, location, etc.
2. Description of Test Board
Test Board per SEMI G42 ________________ Yes ________________ No
No. of Layers ___________________________________________
If test board is specified, describe the specification of the following items:
Dimension ________________ mm x ________________ mm x ________________mmt
No. of Layers ___________________________________________
Material ___________________________________________
SEMI G38-0996 © SEMI 1987, 2004 6
Pattern ___________________________________________
3. Measurement Condition
Ambient Temperature, T
a
________________ °C
Ambient Humidity, H
a
________________ %RH
Air Velocity, V
a
0, 1, 2, 5, ( ) mm/sec.
Power Dissipation, P
H
0, 1, 2 W
4. No. of Samples, N
________________
5.
Thermal Resistance, R
θJA
________________ °C/W
8 Related Documents
8.1 Laboratory Methods of Testing Fans for Rating, AMCA Standard 210-74/ASHRAE Standard 51-75, Air
Movement and Control Association and the American Society of Heating, Refrigerating and Air-Conditioning
Engineers, 1975.
8.2 Fluid Meters — Their Theory and Application, American Society of Mechanical Engineers, Sixth Edition, 1971.
Figure 1
Test Board Positioning
Figure 2
Wind Tunnel Set-Up
SEMI G38-0996 © SEMI 1987, 2004 7
Figure 3
Test Board Orientation Inside Wind Tunnel