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SEMI E103-0704 © SEMI 2000, 2004 3 Figure 2 Front View o f Example Sin g le-Wafer Box and SWIF 6.7 SWIF Sensi n g — It is possible that the SWIF is not removed from the load port when single- wafer boxes are removed and …

SEMI E103-0704 © SEMI 2000, 2004 2

6 Requirements

6.1 System Components — A system that conforms to

this standard must include a box that holds one wafer

and that fits onto a SWIF.

6.2 Relevant FOUP Dimensions — The SWIF must

have all of the required bottom and front features and

be no larger than the maximum dimensions of a 13- or

25-wafer FOUP. However, this system (of single-wafer

box and SWIF) must have box placement sensing pads

as specified in SEMI E47.1 FOUP standards

Requirements Section 6.12. For example, the SWIF

must comply with dimensions r67, x53, y50, y51, y52,

y53, z41, z47 – z48, z47 + z49, and the upper limits on

x50 and y40 (as specified in SEMI E47.1) and with

dimension y33 (as specified in SEMI E62).

6.3 Optional Automation Features — Since the single-

wafer box and/or SWIF will usually be delivered

manually (possibly with a PGV), the SWIF is not

required to have the other automation features of the

FOUP such as the robotic handling flange on top or the

fork-lift flanges on the side (although this standard does

not forbid the SWIF from having such features).

6.4 SWIF Door — The SWIF must have a full FOUP-

size door (which surrounds the door of the single-wafer

box) that mates with a FIMS-compatible interface (as

specified in SEMI E62) to avoid contaminating the

environment on the equipment side of the FIMS

interface.

6.5 Wafer Position — When the FIMS door is opened

by the equipment, the end effector may only be able to

access the middle wafer slot (wafer 7 for a SWIF that

emulates a 13-wafer carrier, and wafer 13 for a SWIF

that emulates a 25-wafer carrier), because a surface

immediately behind the door may block access to the

other wafer slots. Thus, batch wafer handlers will

probably not work with this system.

6.6 Wafer Clearances — The clearance below the

middle wafer must be the same as the clearance below

the bottom wafer in an ordinary FOUP (z8 minus z6,

both from SEMI E1.9), and the clearance above the

middle wafer must be the same as the clearance above

the top wafer in an ordinary FOUP (z15 from SEMI

E1.9). These vertical clearances are defined in SEMI

E1.9 and SEMI E47.1 and apply throughout the wafer

set-down and extraction volumes for the middle wafer.

The horizontal clearances shown in Figure 10 of SEMI

E47.1 are also required. One possible example of such

a system (of single-wafer box and SWIF) is shown in

Figures 1 and 2 (with vertical clearances indicated).

wafer

33 mm [z8 from SEMI E1.9]

–21 mm [z6 from SEMI E1.9]

= 12.0 mm minimum

11 mm [z44 from SEMI E47.1]

+ 33 mm [z8 from SEMI E1.9]

+ 10 mm [z12 from SEMI E1.9] × (6 or 12 wafers)

± 0.5 mm [z10 from SEMI E1.9]

= 164.0±0.5 mm (for wafer #13 in a 25-wafer FOUP)

or 104.0±0.5 mm (for wafer #7 in a 13-wafer FOUP)

13.0 mm minimum

[z15 from SEMI E1.9]

single-wafer box

single wafer interface (SWIF)

equipment load port

FIMS port

11 mm [

44 from

SEMI

E47.1

]

+ 33 mm [

8 from

SEMI E1.9

]

+ 10 mm [

12 from

SEMI E1.9

] × (6 or 12 wafers)

± 0.5 mm [

10 from

SEMI E1.9

]

= 164.0 ± 0.5 mm (for wafer

13 in a 25-wafer FOUP)

or 104.0 ± 0.5 mm (for wafer

7 in a 13-wafer FOUP)

Figure 1

Side View of Example Single-Wafer Box and SWIF on a Load Port with a FIMS Interface

SEMI E103-0704 © SEMI 2000, 2004 3

Figure 2

Front View of Example Single-Wafer Box and SWIF

6.7 SWIF Sensing — It is possible that the SWIF is not

removed from the load port when single-wafer boxes

are removed and replaced on the SWIF. However,

when the single-wafer box is removed from the SWIF,

all of the carrier sensing pads (defined in Section 6.6 of

SEMI E1.9) on the bottom of the SWIF must be raised

(so that the load port can sense a change of carriers by

its carrier placement sensor, if any). However, in order

to ensure that the SWIF triggers most optical carrier

presence detectors on the load port, the SWIF (without

a single-wafer box) must block any line of sight

through a volume consisting of the smallest cylindrical

section that contains all of the wafer pick-up volumes

(defined in SEMI E1.9) of the corresponding FOUP

(defined in SEMI E47.1). Note that this standard does

not prevent the use of other kinds of carrier presence

detectors (such as sensors that detect weight on the load

port).

7 Related Documents

7.1 SEMI Standards

SEMI E15.1 — Specification for 300 mm Tool Load

Port

SEMI E57 — Mechanical Specification for Kinematic

Couplings Used to Align and Support 300 mm Wafer

Carriers

SEMI E63 — Mechanical Specification for 300 mm

Box Opener/Loader to Tool Standard (BOLTS-M)

Interface

SEMI E72 — Specification and Guide for 300 mm

Equipment Footprint, Height, and Weight

SEMI E92 — Specification for 300 mm Light Weight

and Compact Box Opener/Loader and Tool-Interface

Standard (BOLTS-Light)

SEMI M31 — Provisional Mechanical Specification for

Front-Opening Shipping Box Used to Transport and

Ship 300 mm Wafers

SEMI S8 — Safety Guidelines for Ergonomics/ Human

Factors Engineering of Semiconductor Manufacturing

Equipment

NOTICE: Unless otherwise indicated, all documents

cited shall be the latest published versions.

NOTICE: SEMI makes no warranties or representa-

tions as to the suitability of the specification set forth

herein for any particular application. The determination

of the suitability of the specification is solely the

responsibility of the user. Users are cautioned to refer

to manufacturer’s instructions, product labels, product

data sheets, and other relevant literature respecting any

materials mentioned herein. These specifications are

subject to change without notice.

The user’s attention is called to the possibility that

compliance with this specification may require use of

copyrighted material or of an invention covered by

patent rights. By publication of this specification,

SEMI takes no position respecting the validity of any

patent rights or copyrights asserted in connection with

any item mentioned in this specification. Users of this

specification are expressly advised that determination

of any such patent rights or copyrights, and the risk of

infringement of such rights, are entirely their own

responsibility.

RELATED INFORMATION 1

APPLICATION NOTES

NOTICE: This related information is not an official part of SEMI E103 but was approved for publication by full

letter ballot procedures on July 28, 2000.

R1-1

R1-1.1 In fabs in which this system (of single-wafer box and SWIF) is used, equipment should have control

software algorithms that prevent end effectors and wafer slot mappers from entering the carrier except in the

clearances around the middle wafer (defined in Section 6.2) when the presence of this system is detected. A variety

of methods for differentiating the system from ordinary FOUPs are possible.

R1-1.2 Using sensors, equipment can differentiate the system (of single-wafer box and SWIF) from ordinary

FOUPs. For example, sensors below the info pad B location on the load port and on the FIMS door (opposite the

seal zones or the reserved spaces for vacuum application on the box door) could indicate that the carrier type is an

open cassette but with a FOUP door, together implying the presence of this system (of a single-wafer box and

SWIF). Note that such sensors on the load port are not currently specified in any SEMI standard.

R1-1.3 Carrier ID tags can inform the equipment that the load port holds this system (of single-wafer box and

SWIF) instead of an ordinary FOUP.

R1-1.4 Messages from the host computer system can inform the equipment that the load port holds this system (of

single-wafer box and SWIF) instead of an ordinary FOUP.

NOTICE: SEMI makes no warranties or representations as to the suitability of the specification set forth herein for

any particular application. The determination of the suitability of the specification is solely the responsibility of the

user. Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other

relevant literature respecting any materials mentioned herein. These specifications are subject to change without

notice.

The user’s attention is called to the possibility that compliance with this specification may require use of

copyrighted material or of an invention covered by patent rights. By publication of this specification, SEMI takes

no position respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned

in this specification. Users of this specification are expressly advised that determination of any such patent rights or

copyrights, and the risk of infringement of such rights, are entirely their own responsibility.

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