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SEMI E1.9-0701 E2 © SEMI 1994, 2004 12 y 26 ≥ 145 facial datum plane front side of th e cassette where wafers are accessed y 25 ≤ 127 bilateral datum p lane x 25 ≥ 30 cassette iden tif ication tag area y 21 =136 Figure 1…

SEMI E1.9-0701

lower tolerance of z10 around the nominal wafer

seating plane.

6.7.4 To prevent wafers from creeping out of the

cassette during transport, the fork-lift area may be

slanted so that the front of the cassette is higher than the

rear. Specifically, the surface defined by z4 may be

rotated by an angle ω about the line where z4 intersects

y29 (as shown in Figure 13). Only the surface behind

y29 may be rotated. Thus, the height of z4 shown in

Figure 12 might only be defined at y29, and z4 can be

greater than 15 ± 1 behind y29. However, the flatness of

the resulting tilted surface must still fall within the

tolerance given for z4.

6.8 Cassette Identification Tag Area — The following

areas are provided for putting identification tags on the

cassette. Examples of such tags include thin electronic

modules and printed labels designed to be read by

either humans or machines. It is recommended that

such tags be contained within the 18 mm by 60 mm

(0.71 in. by 2.36 in.) region defined when the bounds

are tight. It is also recommended that if such tags are

smaller than the minimum bounds of the tag area, they

should be centered within those bounds.

6.8.1 An optional place for an identification tag on the

top of the cassette is shown in Figure 14. Although the

height of this surface is not specified, the surface must

be completely visible from above. The parallelism of

the top identification tag with respect to the horizontal

datum plane is given by z25. It is recommended that the

identification tag should be centered on the bilateral

datum plane at a point y21 behind the facial datum

plane.

6.8.2 An optional place for an identification tag on the

right-hand side of the cassette is shown in Figure 15

(where “right-hand” is defined as the right side of the

cassette when it is oriented correctly and it is viewed

from the rear). Although the left-right location of this

surface is not specified, the surface must be completely

visible from the right of the cassette. The parallelism of

the side identification tag with respect to the bilateral

datum plane is given by x27. It is recommended that the

identification tag should be centered on the facial datum

plane at a point z99 above the horizontal datum plane.

6.8.3 An optional place for an identification tag on the

bottom of the cassette is shown in Figure 16. Although

the height of this surface is not specified, the surface

must be completely visible from below. The parallelism

of the bottom identification tag with respect to the

horizontal datum plane is given by z25. It is

recommended that the identification tag should be

centered on the bilateral datum plane at a point y22

behind the facial datum plane.

=15±1

horizontal

datum

plane

y29 =89

(to axis of rotation)

facial datum plane

0° ≤ ω ≤ 2°

front side of the cassette where

wafers are accessed

=7±1

Figure 13

Slanting of Fork-Lift Area

SEMI E1.9-0701

y26

≥145

facial

datum

plane

front side of the cassette where wafers are accessed

y25

≤127

bilateral datum plane

x25 ≥30

cassette

identification

tag area

y21

=136

Figure 14

Optional Top Cassette Identification Tag Area

z28

≥124.5

horizontal

datum

plane

z27

≤64.5

facial datum plane

y27

≥9

y28

≥9

cassette

identification

tag area

front side of the cassette where

wafers are accessed

z99

=94.5

Figure 15

Optional Side Cassette Identification Tag Area

SEMI E1.9-0701

x25 ≥30

y16

=155 ±1

y24

≤136

cassette

identification

tag area

front side of the cassette where wafers are accessed

facial

datum

plane

bilateral datum plane

y22

=145

Figure 16

Optional Bottom Cassette Identification Tag Area

6.9 Pitch and Capacity — Table 2 shows the different

options with regard to the wafer pitch (spacing) and the

cassette capacity. Again, no tolerance is given on the

wafer pitch (z12), for reasons given in Section 6.7.

6.10 Inner and Outer Radii — All concave features

may have a radius no greater than r15 to allow cleaning

and to prevent contaminant build-up. All required

convex features must also have a radius of r16 to

prevent small contact patches with large stresses that

might cause wear and particles. Here a required feature

is an area on the surface of the carrier specified by a

dimension (or intersections of dimensions) that has a

tolerance and not just a maximum or minimum (such as

the rim of the fork-lift pin hole, the edges of the robotic

handling flanges, and the corners at the rear of the

cassette top and bottom domains).

6.11 Vertical Wafer Access — This standard does not

cover accessing wafers in a vertical orientation.

7 Related Documents

7.1 SEMI Standards

SEMI E22.1 — Cluster Tool Module Interface

300 mm: Transport Module End Effector Exclusion

Volume Standard

SEMI E47.1 — Provisional Mechanical Specification

for Boxes and Pods Used to Transport and Store 300

mm Wafers

SEMI E62 — Provisional Specification for 300 mm

Front-Opening Interface Mechanical Standard (FIMS)

SEMI E63 — Provisional Mechanical Specification for

300 mm Box Opener/Loader to Tool Standard

(BOLTS-M) Interface

SEMI E103 — Provisional Mechanical Specification

for a 300 mm Single-Wafer Box System that Emulates

a FOUP

SEMI M28 — Specification for Developmental 300

mm Diameter Polished Single Crystal Silicon Wafers

SEMI M31 — Provisional Mechanical Specification for

Front-Opening Shipping Box Used to Transport and

Ship 300 mm Wafers