semi合集-English.pdf - 第5040页
SEMI M18-0704 © SEMI 1990, 2004 26 SOI Wafer ITEM VALUE STANDARD REFERENCE A STANDARD TEST METHODS IS IN M47 IS REQ'D B SEMI M47 JEITA SEMI JIS JEITA DIN 25 SOI LAYER CHARACTERIS TICS 25.0 Ty pe of SOI YES YES Table…
SEMI M18-0704 © SEMI 1990, 2004 25
ITEM VALUE STANDARD REFERENCE
A
STANDARD TEST METHODS
IS IN
M2
IS IN
M11
IS
REQ’D
B
SEMI M2SEMI M11 JEIDA ASTM SEMI JIS JEIDA DIN
13.13 Foreign Matter YES YES NO Table 1 Table 1 MF523
14. BACK SURFACE VISUAL INSPECTION CHARACTERISTICS
14.1 Contamination YES YES NO Table 1 Table 1 MF523
15. OTHER CHARACTERISTICS
Annealed Wafer
ITEM VALUE STANDARD
REFERENCE
A
STANDARD TEST METHODS
IS IN
SEMI
IS
REQ'D
B
SEMI JEIDA ASTM SEMI
J
IS JEIDA DIN
20. GENERAL ANNEALED WAFER CHARACTERISTICS
20.1 Annealing Atmosphere NO YES
20.2 Co-Dopant in Crystal NO YES
21. MECHANICAL CHARACTERISTICS
D
21.1 Bow YES NO M1 Sec 9 MF534 H 611
21.2 Warp YES NO M1 Sec 9 MF657,
MF1390
21.3 Sori NO NO M1 Sec 9 MF1451 43
21.4 Flatness/Global NO NO M1 Sec 9 MF1530 50441/3
21.5 Flatness/Site NO NO M1 Sec 9 MF1530
21.6 Fixed Quality Area NO NO M1 Sec 9 MF1530
22. FRONT SURFACE VISUAL INSPECTION CHARACTERISTICS
D
22.1 Stacking Faults YES NO M2 Table 1 MF1810 50446
22.2 Slip YES NO M2 Table 1 MF523,
MF1726
50446
22.3 Other Defect YES NO M2 Table 1 MF523,
MF1726
50446
23. BACK SURFACE VISUAL INSPECTION CHARACTERISTICS
23.1 Contamination YES NO M1 Table 1 MF523
23.2 Other
24. OTHER CHARACTERISTICS
24.1 Depth of BMD Denuded Zone NO NO
24.2 BMD Density NO NO MF1239
24.3 Other
SEMI M18-0704 © SEMI 1990, 2004 26
SOI Wafer
ITEM VALUE
STANDARD
REFERENCE
A
STANDARD TEST METHODS
IS IN
M47
IS
REQ'D
B
SEMI M47 JEITA SEMI JIS JEITA DIN
25 SOI LAYER CHARACTERISTICS
25.0 Type of SOI YES YES Table 1
25.1 Starting silicon wafer for SOI YES NO Table 1
25.2 Surface Silicon Thickness YES YES Table 1
25.3 Surface Silicon Thickness Mean
Value Variation
YES NO Table 1
25.4 Surface Silicon Thickness Variation
in Wafer
YES YES Table 1
25.5 Crystal Orientation YES NO Table 1 SEMI MF26
25.6 Rotation Misalignment YES NO Table 1
25.7 Edge Exclusion,
Nominal
YES NO Table 1
25.8 Non-SOI Edge Area YES NO Table 1
25.9 Conductivity Type YES NO Table 1 SEMI MF42
25.10 Dopant YES NO Table 1
25.11 Dopant Concentration YES NO Table 1
25.12 SOI Etch Pit YES NO Table 1
25.13 Threading Dislocation YES NO Table 1
25.14 HF Defect YES NO Table 1
25.15 Void YES NO Table 1
25.16 Roughness (Si surface)
rms @ 2 × 2 µm
YES NO Table 1 EM-3505
Roughness (Si surface)
rms @ 10 × 10 µm
YES NO Table 1 EM-3505
Roughness (Si surface)
rms @ [ ] × [ ] µm
YES NO Table 1 EM-3505
Roughness (Si surface)
rms @ [ ] × [ ] µm
YES NO Table 1 EM-3505
25.17 Surface Metal Contamination (Fe) YES NO Table 1 SEMI MF1526
Surface Metal Contamination (Cr) YES NO Table 1 SEMI MF1526
Surface Metal Contamination (Ni) YES NO Table 1 SEMI MF1526
Surface Metal Contamination (Cu) YES NO Table 1 SEMI MF1526
Surface Metal Contamination [ ] NO NO SEMI MF1526
Surface Metal Contamination [ ] NO NO SEMI MF1526
Surface Metal Contamination [ ] NO NO SEMI MF1526
Surface Metal Contamination [ ] NO NO SEMI MF1526
Surface Metal Contamination [ ] NO NO SEMI MF1526
Surface Metal Contamination [ ] NO NO SEMI MF1526
26 BOX CHARACTERISTICS
26.1 BOX Thickness YES YES Table 1
SEMI M18-0704 © SEMI 1990, 2004 27
ITEM VALUE
STANDARD
REFERENCE
A
STANDARD TEST METHODS
IS IN
M47
IS
REQ'D
B
SEMI M47 JEITA SEMI JIS JEITA DIN
26.2 BOX Thickness Variation YES YES Table 1
26.3 Bonded Interface Location YES NO Table 1
26.4 BOX Pinholes YES NO Table 1
26.5 Dielectric Breakdown YES NO Table 1
27 MECHANICAL CHARACTERISTICS
27.1 Warp YES NO M1 Sec 9 SEMI MF1390
27.2 Flatness-site YES NO M1 Sec 9
28 FRONT SURFACE INSPECTION CHARACTERISTICS
28.1 Scratch YES NO M1 Table 1 SEMI MF523
28.2 Haze YES NO M1 Table 1 SEMI MF523
28.3 LLS
@ particle size
YES NO M1 Table 1
M35
28.4 Slip YES NO SEMI MF523
28.5 Edge Chip YES NO M1 Table 1 SEMI MF523
28.6 Edge Crack YES NO M1 Table 1 SEMI MF523
28.7 Foreign Matter YES NO M35 SEMI MF523
29 BACK SURFACE CHARACTERISTICS
29.1 Backside Metal Contamination (Fe) YES NO Table 1
Backside Metal Contamination (Cr) YES NO Table 1
Backside Metal Contamination (Ni) YES NO Table 1
Backside Metal Contamination (Cu) YES NO Table 1
Backside Metal Contamination [ ] NO NO
Backside Metal Contamination [ ] NO NO
Backside Metal Contamination [ ] NO NO
Backside Metal Contamination [ ] NO NO
Backside Metal Contamination [ ] NO NO
Backside Metal Contamination [ ] NO NO
A
Item is defined or described and/or a test procedure applicable to the item is included in the cited reference.
B
Value is/is not required to minimally specify a wafer.
C
Individual value is not required if wafer is specified according to SEMI M1.
D
In today's technology, it may be possible to inspect for some of these items using automated laser scanning systems; however, a standard test
procedure has yet to be developed. Application of automated inspection must be agreed upon between supplier and user.
Table 2 EDI Code List
Line Item EDI Code ID Sub Param ID
1.1 Growth Method 100001
1.2 Crystal Orientation 100002
1.3 Conductivity Type 100003
1.4 Dopant 100004
1.5 Nominal Edge Exclusion Distance for Fixed Quality Area 100005
2.1 Resistivity 100006