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SEMI S21-1103 © SEMI 2003 15 Note 4: Specific protection recommendations for laser ra diation above the maxim u m permissible exposure (MPE). Note 5: Skin protection should be used fo r all exposed areas including head a…

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SEMI S21-1103 © SEMI 2003 14
APPENDIX 2
SELECTION OF PERSONAL PROTECTIVE EQUIPMENT
NOTICE: The material in this appendix is an official part of SEMI S21.
A2-1 Introduction
A2-1.1 This appendix provides specific technical information relating to Section 12. In general, it provides Personal
Protective Equipment (PPE) recommendations for specific hazards.
A2-1.2 This appendix is intended to be used as a guide to select PPE along with Section 12.
Table A2-1 PPE Selection Matrix
Personal Protective Equipment (PPE)
Potential
Hazard
Safety
Glasses,
Goggles
Face
Shield
Aprons,
Sleeves, or
Full Body
Suits
Gloves Skin
Protection
Safety
Shoes
Respirator Hardhat Hearing
Protection
(earplugs
or muffs)
Chemical R R
(if splash
hazard)
R
(if splash
hazard)
R R
(based on
hazard
assess-
ment)
Energized
Electrical
R R
(When
proper for
the
available
fault
current)
R
(When
proper for
the
available
fault
current)
R
(for high
voltage –
proper for
the
voltage)
R
(Insulation
-rated
proper for
the
voltage)
Ionizing
Radiation
R
*1
R
*2
R
*1
UV R
*4
R
*5
Visible R
*4
IR R
*3, 4
R
*5
Non-ionizing
Radiation
RF
Noise R
(at levels
>80 dBA)
Extreme
Temperatures
R R
Falling
Objects,
Bumping
Hazards
R R R
Mechanical R R R
Manual
Handling
R R
Oxygen
Deficiency
R
“R” indicates “Recommended”.
Note 1: Goggles and respirator should be worn if the sources are not isolated or exhausted, and are of a nature that they could enter the eye or be
inhaled.
Note 2: Gloves should be used if radioactive sources that are not sealed are being handled.
Note 3: Protective filters should be considered for long-term viewing (> 10 seconds). Where visible light doesn’t elicit the aversion response.
SEMI S21-1103 © SEMI 2003 15
Note 4: Specific protection recommendations for laser radiation above the maximum permissible exposure (MPE).
Note 5: Skin protection should be used for all exposed areas including head and neck.
NOTICE: SEMI makes no warranties or representations as to the suitability of the safety guidelines set forth herein
for any particular application. The determination of the suitability of the safety guidelines is solely the responsibility
of the user. Users are cautioned to refer to manufacturer' s instructions, product labels, product data sheets, and other
relevant literature, respecting any materials or equipment mentioned herein. These safety guidelines are subject to
change without notice.
By publication of this safety guideline, Semiconductor Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in
this safety guideline. Users of this guideline are expressly advised that determination of any such patent rights or
copyrights, and the risk of infringement of such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI S22-1103a © SEMI 2003, 2005 1
SEMI S22-1103a
SAFETY GUIDELINE FOR THE ELECTRICAL DESIGN OF
SEMICONDUCTOR MANUFACTURING EQUIPMENT
This safety guideline was technically approved by the global Environmental Health and Safety Committee.
This edition was approved for publication by the global Audits and Reviews Subcommittee on April 7, 2005.
It was available at www.semi.org in June 2005 and on CD-ROM in July 2005. Originally published
November 2003.
NOTICE: This document contains material that has been balloted and approved by the SEMI
Environmental Health and Safety Committee, but is not immediately effective. This material and the date on
which it becomes effective are included in Delayed Revisions Sections 1 and 2. The provisions of this
information are not an authoritative part of the document until their effective dates. The main body of SEMI
S22-1103a remains the authoritative version. Some or all of the provisions of revisions not yet in effect may
optionally be applied prior to the effective date, providing they do not conflict with portions of the
authoritative version other than those that are to be revised or replaced as part of the deferred change, and
are labeled accordingly. Material that is to be replaced by revisions that are not yet in effect is preceded by a
NOTICE indicating its status.
NOTICE: Paragraphs entitled “NOTE” are not an official part of this document and are not intended to modify or
supercede it.
NOTICE: Conformance to the “should” provisions of this guideline is necessary to declare conformance to this
document. Conformance to “may”, “suggested”, “preferred”, “recommended”, “NOTE”, or “Related Information”
provisions is not necessary to declare conformance.
1 Purpose
1.1 This guideline provides a set of design based electrical safety considerations for production equipment used in
the semiconductor industry.
1.2 Basic product safety concerns can be addressed by satisfying the design, construction, and testing principles set
forth in this document or by satisfying the requirements of applicable electrical safety standards.
2 Scope
2.1 This safety guideline applies to semiconductor manufacturing equipment.
2.2 This document contains the following:
1. Purpose
2. Scope
3. Limitations
4. Reference Standards
5. Terminology
6. Alternate Methods of Conformity
7. Design Philosophy
8. General Considerations
9. Facilities Electrical Connection
10. Protection Against Electric Shock
11. Protection Against Risk of Electrical Fire
12. Bonding to the Protective Conductor
13. Safety Circuits