semi合集-English.pdf - 第765页

SEMI E104-0303 © SEMI 2000, 2003 1 SEMI E104-0303 SPECIFICATION FOR INTEGRATION AND GUIDELI NE FOR CALIBRATION OF LOW-PRES SURE PARTICLE MONITOR This specification was technically approved b y the Gl obal Metrics Committ…

100%1 / 7923
SEMI E103-0704 © SEMI 2000, 2004 4
RELATED INFORMATION 1
APPLICATION NOTES
NOTICE: This related information is not an official part of SEMI E103 but was approved for publication by full
letter ballot procedures on July 28, 2000.
R1-1
R1-1.1 In fabs in which this system (of single-wafer box and SWIF) is used, equipment should have control
software algorithms that prevent end effectors and wafer slot mappers from entering the carrier except in the
clearances around the middle wafer (defined in Section 6.2) when the presence of this system is detected. A variety
of methods for differentiating the system from ordinary FOUPs are possible.
R1-1.2 Using sensors, equipment can differentiate the system (of single-wafer box and SWIF) from ordinary
FOUPs. For example, sensors below the info pad B location on the load port and on the FIMS door (opposite the
seal zones or the reserved spaces for vacuum application on the box door) could indicate that the carrier type is an
open cassette but with a FOUP door, together implying the presence of this system (of a single-wafer box and
SWIF). Note that such sensors on the load port are not currently specified in any SEMI standard.
R1-1.3 Carrier ID tags can inform the equipment that the load port holds this system (of single-wafer box and
SWIF) instead of an ordinary FOUP.
R1-1.4 Messages from the host computer system can inform the equipment that the load port holds this system (of
single-wafer box and SWIF) instead of an ordinary FOUP.
NOTICE: SEMI makes no warranties or representations as to the suitability of the specification set forth herein for
any particular application. The determination of the suitability of the specification is solely the responsibility of the
user. Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other
relevant literature respecting any materials mentioned herein. These specifications are subject to change without
notice.
The user’s attention is called to the possibility that compliance with this specification may require use of
copyrighted material or of an invention covered by patent rights. By publication of this specification, SEMI takes
no position respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned
in this specification. Users of this specification are expressly advised that determination of any such patent rights or
copyrights, and the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI E104-0303 © SEMI 2000, 2003 1
SEMI E104-0303
SPECIFICATION FOR INTEGRATION AND GUIDELINE FOR
CALIBRATION OF LOW-PRESSURE PARTICLE MONITOR
This specification was technically approved by the Global Metrics Committee and is the direct responsibility
of the European Equipment Automation Committee. Current edition approved by the European Regional
Standards Committee on January 8, 2003. Initially available at www.semi.org January 2003; to be published
March 2003. Originally published October 2000; previously published March 2002.
1 Purpose
1.1 The use of in situ particle monitoring (ISPM;
particle measurements performed while the wafer
resides inside the processing chamber) in low-pressure
and vacuum applications provides a number of
advantages for defect, process, and equipment
management such as:
Reduction of particle test wafers used for off-line
tests and saving operator time,
Optimization and real-time characterization of the
process,
Advanced process control,
Advanced equipment control,
Monitoring process chamber conditions, and
Optimization of cleaning procedures and
maintenance.
1.1.1 Therefore, ISPM achieves more equipment
availability and faster ramp-up of the production,
reduces cost of ownership, improves quality and yield.
To reach these goals, ISPM needs to be easily
integrated into new or existing process equipment and
the acquisition as well as the analysis of the particle
data needs to be automated. The ISPM sensor should
not have any negative influence on the process and the
measurement has to represent the main particle flow.
The sensor should be designed to have a minimum
negative impact on the parameters defined in SEMI E10
for the whole semiconductor process equipment, to
achieve an advantage in capacity.
1.2 This standard is intended to stipulate operating
conditions, mechanical, electrical, and communication
interfaces for the use of Low-pressure Particle
Detectors integrated in semiconductor process
equipment. A guideline for a reference calibration of
those sensors is intended to support correlation between
measurements with different sensors.
2 Scope
2.1 This standard applies to particle measurement
under low-pressure and vacuum conditions in
semiconductor manufacturing equipment.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety health practices and determine the
applicability of regulatory or other limitations prior to
use.
3 Referenced Standards
3.1 SEMI Standards
SEMI C6.5 — Particle Specification for Grade 10/0.2
Nitrogen (N
2
) and Argon (Ar) Delivered as Pipeline
Gas
SEMI C6.6 — Particle Specification for Grade 10/0.1
Nitrogen (N
2
) and Argon (Ar) Delivered as Pipeline
Gas
SEMI E4 — SEMI Equipment Communications
Standard 1 Message Transfer (SECS-I)
SEMI E5 — SEMI Equipment Communications
Standard 2 Message Content (SECS-II)
SEMI E10 — Specification for Definition and
Measurement of Equipment Reliability, Availability,
and Maintainability (RAM)
SEMI E33 — Specification for Semiconductor
Manufacturing Facility Electromagnetic Compatibility
SEMI E37 — High-Speed SECS Message Services
(HSMS) Generic Services
SEMI E54 — Sensor/Actuator Network Standard
SEMI E54.10 — Specification for Sensor/Actuator
Network Specific Device Model for an In-Situ Particle
Monitor Device
SEMI F6 — Guide for Secondary Containment of
Hazardous Gas Piping Systems
SEMI E104-0303 © SEMI 2000, 2003 2
3.2 ASTM Standards
1
ASTM D1193 — Standard Specification for Reagent
Water
ASTM F328 — Standard Practice for Calibration of an
Airborne Particle Counter Using Monodisperse
Spherical Particles
ASTM F649 — Practice for Secondary Calibration of
Airborne Particle Counter Using Comparison
Procedures
3.3 BSI Standards
2
BS 3406-7 — Determination of Particle Size
Distribution – Recommendations for Single Particle
Light Interaction Methods
3.4 IEC Standards
3
IEC 60625-1 — Programmable Measuring Instruments
- Interface System (Byte Serial, Bit Parallel) - Part 1:
Functional, Electrical and Mechanical Specifications,
System Applications, and Requirements for the
Designer and User
IEC 60625-2 — Programmable Measuring Instruments
- Interface System (Byte Serial, Bit Parallel) - Part 2:
Codes, Formats, Protocols, and Common Commands
IEC 60654-1 — Operating Conditions for Industrial-
Process Measurement and Control Equipment - Part 1:
Climatic Conditions
IEC 60654-2 — Operating Conditions for Industrial-
Process Measurement and Control Equipment - Part 2:
Power
IEC 60654-3 — Operating Conditions for Industrial-
Process Measurement and Control Equipment - Part 3:
Mechanical Influences
IEC 60654-4 — Operating Conditions for Industrial-
Process Measurement and Control Equipment - Part 4:
Corrosive And Erosive Influences
IEC 60801-1 — Electromagnetic Compatibility for
Industrial-Process Measurement and Control
Equipment - Part 1: General Introduction
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohocken, Pennsylvania 19428-2959, USA.
Telephone: 610.832.9585, Fax: 610.832.9555 Website:
www.astm.org
2 British Standards Institute, 389 Chiswick High Road, London, W4
4AL, United Kingdom. Telephone: 44.0.20.8996.9000, Fax:
44.0.20.8996.7001 Website: www.bsi-global.com
3 International Electrotechnical Commission, 3, rue de Varembé,
Case Postale 131, CH-1211 Geneva 20, Switzerland. Telephone:
41.22.919.02.11; Fax: 41.22.919.03.00 Website: www.iec.ch
3.5 IEEE Standards
4
IEEE 488.1 — IEEE Standard Digital Interface for
Programmable Instrumentation
IEEE 488.2 — IEEE Standard Codes, Formats,
Protocols, and Common Commands for use with IEEE
488.1, IEEE Standard Digital Interface for
Programmable Instrumentation
3.6 IEST Standards
5
IEST RP-011 — A Glossary of Terms and Definitions
Related to Contamination Control
3.7 ISO Standards
6
ISO 1609 — Vacuum technology -- Dimensions (ISO-
K style and ISO-F style)
ISO 2861-1 — Vacuum technology -- Quick-release
couplings – Dimensions - Part 1: Clamped type (ISO-
KF)
ISO 2861-2 — Vacuum technology -- Quick-release
couplings – Dimensions - Part 2: Screwed type (ISO-
MF)
ISO 3669 — Vacuum technology -- Bakeable flanges --
Dimensions (ISO-K-CF)
ISO 10012-1 — Quality assurance requirements for
measuring equipment – Part 1: Metrological
confirmation system for measuring equipment
ISO 10012-2 — Quality assurance requirements for
measuring equipment – Part 2: Guidelines for control of
measuring processes
ISO 13323-2 — Determination of particle size
distribution – Single Particle Light Interaction Methods
Part 2: Light scattering single particle light interaction
devices design, performance specifications, and
operation requirements
ISO 14644-1 — Cleanrooms and associated controlled
environments - Part 1: Classification of air cleanliness
ISO 14644-5 — Cleanrooms and associated controlled
environments - Part 5: Operation of cleanroom systems
4 Institute of Electrical and Electronics Engineers, IEEE Operations
Center, 445 Hoes Lane, P.O. Box 1331, Piscataway, New Jersey
08855-1331, USA. Telephone: 732.981.0060; Fax: 732.981.1721
5 Institute of Environmental Sciences and Technology, 5005 Newport
Drive, Suite 506, Rolling Meadows, IL 60008-3841, USA.
Telephone: 847.255.1561; Fax: 847.255.1699 Website: www.iest.org
6 International Organization for Standardization, ISO Central
Secretariat, 1, rue de Varembé, Case postale 56, CH-1211 Geneva 20,
Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30
Website: www.iso.ch