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SEMI G27-89 © SEMI 198 5, 1989 5 8.2 Marking 8.2.1 The following details shall be n o t e d on the packing slip attached to the outside of the shippi ng package: Vendor Part Number Customer Part Num ber Quantity Date Ven…
SEMI G27-89 © SEMI 1985, 1989 4
6.9.1 Lead Planarity — The lead tips shall be within
the following tolerances of the Z plane in the taped or
untaped condition.
Table 2 Taped or Untaped Condition
No. of Leads Strip Width
Lead Tip
Coplanarity
18 Rect. 1.070" - 1.230"
(27.18 mm - 31.24 mm)
± 0.003"
(0.76 mm)
20 Square 0.970"
(24.64 mm)
± 0.003"
(0.076 mm)
28-52 1.070" - 1.470"
(27.18 mm - 37.34 mm)
± 0.004"
(0.120 mm)
64-84 1.670" - 1.870"
(42.42 mm - 47.50 mm)
± 0.005"
(0.127 mm)
6.9.2 Die Attach Pad Planarity — T he die attach pad
shall be within the following tolerances of the Z plane.
6.10 Material
6.10.1 0.203 mm (0.008") material thickness
recommended for greater than 52 leads.
6.10.2 0.254 mm (0.010") material thickness
recommended for 52 lead and below.
6.10.3 Nominal thickness tolerances for both Alloy 42
and copper materials of 0.203 mm (0.008") and 0.254
mm (0.010") shall be 0.008 mm (± 0.0003").
6.10.4 Width Tolerance — 0.051 mm (± 0.002") for
both Alloy 42 and copper.
6.11 Coil Set — Maximum of 0.508 mm (0.020") over
the nominal strip length. Does not include material
thickness.
6.12 Crossbow — Crossbow shall not exceed the
following dimensions:
No. of Leads Maximum Crossbow
18—20 ± 0.005" (0.127 mm)
28 - 52 ± 0.006" (0.152 mm)
68 - 84 ± 0.010" (0.254 mm)
6.13 Camber — Shall not exceed 0 .002" over nominal
strip lengths of 8 ± 2 inches.
The relationship to determine maximum camber for
other lengths is approximated as follows:
C
1
C
2
=
L
1
2
L
2
2
6.14 Progression — The progression over the nominal
strip length shall be within 0.051 mm (± 0.002") and
noncumulative.
6.15 Burrs — Shall be firmly attach ed and able to
withstand a probe force of 10 grams. Vertical burrs
inside the dambar shall not exceed 0.025 mm (0.001").
Vertical burrs outside the dambar and horizontal burrs
in any location shall not exceed 0.051 mm (0.002").
6.16 Pits and Slugmarks
6.16.1 Within functional area and on external leads,
there shall be no slugmarks. Pits shall not exceed 0.008
mm (0.0003") in depth and 0.013 mm (0.0005") in
largest surface dimension in these areas.
APPLICATION NOTE: There is a question regarding the
ability of material suppliers to meet this specification.
Revision of this specification is under review.
6.16.2 In other areas, pits and imperfections shall not
affect leadframe strength regardless of size and shall
not exceed 0.051 mm (0.002") in depth and 0.127 mm
(0.005") in largest surface dimension.
6.17 Strip Cut Off Location — Strip cut off shall be
within 0.076 mm (± 0.003") of basic strip length (see
Figure 6).
6.18 Coining and Metal Clearance
6.18.1 Dimensions shown on drawing s are before coin
dimensions.
6.18.2 Maximum coining bulge shall not exceed 0.051
mm (0.002") per edge and shall be governed by metal
to metal clearance requirements (lead to lead and lead
to pad).
6.18.3 Metal to Metal Clearance — Shall be as agreed
to between vendor and customer.
7 Sampling
7.1 The sampling plan shall be agr eed upon between
vendor and customer.
8 Packaging and Marking
8.1 Packaging — Containers and packaging materials
shall be selected to provide protection against normal
transportation damage risks and spillage. They will also
offer protection from contamination, exposure to
moisture, oxidation, and tarnishing.
SEMI G27-89 © SEMI 1985, 19895
8.2 Marking
8.2.1 The following details shall be n oted on the
packing slip attached to the outside of the shipping
package:
Vendor Part Number
Customer Part Number
Quantity
Date
Vendor Lot Number
User PO Number
Drawing Number
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI G28-0997 © SEMI 1986, 19971
SEMI G28-0997
SPECIFICATION FOR LEADFRAMES FOR PLASTIC MOLDED S.O.
PACKAGES
1 Purpose
This specification defines the acceptance criteria for
stamped leadframes for plastic molded S.O. packages.
2 Scope
This specification is a guideline for production of
stamped S.O. Leadframes to be used in plastic molded
S.O. packages.
3 Referenced Documents
3.1 SEMI Specifications
SEMI G4 — Specification for Integrated Circuit
Leadframe Materials used in the Production of Stamped
Leadframes
SEMI G9 — Specification for Stamped Leadframes for
Plastic Molded Dual-In-Line Semiconductor Packages
SEMI G10 — Standard Method for Mechanical
Measurement for Plastic Package Leadframes
SEMI G21 — Specification for Plating Integrated
Circuit Leadframes
3.2 ANSI/ASQC Specifications
1
ANSI/ASQC Z1.4 — Sampling Procedures and Tables
for Inspection by Attributes
3.3 ANSI Specifications
2
ANSI Y14.5M — Dimensioning and Tolerancing
4 Terminology
4.1 burr — A fragment of excess material either
horizontal or vertical adhering to the component
surface.
4.2 camber — Curvature of the leadframe strip edge in
the horizontal plane (see Figure 1).
4.3 coil set — Longitudinal bowin g of the leadframe
(see Figure 2).
4.4 coined area — That area at the tip of the bond
fingers flattened to produce an acceptable surface for
wire bonding (see Figure 3).
1 ASQC, 611 East Wisconsin Avenue, Milwaukee, WI 53202
2 ANSI, 1430 Broadway, New York, NY 10018
4.5 crossbow — Transverse bowing of the leadframe
(see Figure 4).
4.6 functional area — The die attach pad and the wire
bond (lead tips) area.
4.7 lead twist — Angular rotation of bonding fingers
(see Figure 5).
4.8 pit — A shallow surface depression or crater in the
leadframe material.
4.9 slugmarks — Random dents in the leadframe
caused by foreign material in the stamping die.
4.10 stamped leadframe terminology — (See Figure
6.)
5 Ordering Information
Purchase orders for leadframes for plastic molded S.O.
packages furnished to this specification shall include
the following items:
a. Current leadframe specification drawing.
b. All dimensions and tolerances per ANSI Y14.5
practices.
c. Material type and physical characteristics (see
SEMI G4).
d. Type hardness and thickness of any required plating
(see SEMI G21).
6 Dimensions
See Table 1 and Figure 7 for standard dimensions.
Tolerances shall be agreed between vendor and
customer.
7 Defect Limits and Parame ters (see SEMI
G10 for measurement methods)
7.1 Internal Frame Area
7.1.1 Minimum Flat Wire Bonding Area — 80% of
nominal lead width and .015" (.381 mm) in length.
7.1.2 Coin Depth
7.1.2.1 0.008" (0.20 mm) material: 0.0005" (0.013
mm) minimum/0.001" (0.02 mm) maximum.
7.1.2.2 0.010" (0.25 mm) material: 0.0005" (0.013
mm) minimum/0.002" (0.05 mm) maximum.