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SEMI F19-0304 © SEMI 1995, 2004 2 4.1.8 CrOX/FeOX — Ratio of Chromium Oxide to Iron Oxide in the passive oxid e layer, as defined in SEMI F60 4.1.9 EDS — Energy Dispe r sive X-ray Spectroscopy 4.1.10 ESCA — Electron Spec…

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SEMI F19-0304 © SEMI 1995, 2004 1
SEMI F19-0304
SPECIFICATION FOR THE SURFACE CONDITION OF THE WETTED
SURFACES OF STAINLESS STEEL COMPONENTS
This specification was technically approved by the Global Gases Committee and is the direct responsibility of
the North American Gases Committee. Current edition approved by the North American Regional Standards
Committee on December 4, 2003. Initially available at www.semi.org February 2004; to be published March
2004. Originally published in 1995.
NOTICE: This document was completely rewritten in
2004.
1 Purpose
1.1 The purpose of this specification is to provide a
standard for the quality of the wetted surfaces of
stainless steel components used in the chemical (gas
and liquid) distribution systems of semiconductor
manufacturing facilities.
2 Scope
2.1 This specification defines the wetted surface
characterization requirements and the finish acceptance
criteria for tubing and components fabricated in
stainless steel per SEMI F20 and intended to control
and/or contain gases and liquids used in semiconductor
manufacturing.
2.2 The surface characterization tests to be performed
are specified herein, and the existing standards for
performing these tests are referenced.
2.3 Terms specific to this technology are either listed
herein as they relate to the acceptance criteria of this
specification or are defined in the referenced documents
as they relate to a specific test method.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI F20 — Specification for 316L Stainless Steel
Bar, Extruded Shapes, Plate, and Investment Castings
for Components Used in High Purity Semiconductor
Manufacturing Applications
SEMI F37 — Method for Determination of Surface
Roughness Parameters for Gas Distribution System
Components
SEMI F60 — Test Method for ESCA Evaluation of
Surface Composition of Wetted Surfaces of Passivated
316L Stainless Steel Components
SEMI F70 — Test Method for Determination of
Particle Contribution of Gas Delivery System
SEMI F72 — Test Method for Auger Electron
Spectroscopy (AES) Evaluation of Oxide Layer of
Wetted Surfaces of Passivated 316L Stainless Steel
Components
SEMI F73 — Test Method For Scanning Electron
Microscopy (SEM) Evaluation of Wetted Surface
Condition of Stainless Steel Components
SEMI F77 — Test Method for Electrochemical Critical
Pitting Temperature Testing of Alloy Surfaces Used in
Corrosive Gas Systems
3.2 ASTM
1
Standard
ASTM A 967 — Standard Specification for Chemical
Passivation Treatments for Stainless Steel Parts
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
4.1 Abbreviations and Acronyms
4.1.1 Å — Angstrom (= 0.1 nm)
4.1.2 AES — Auger Electron Spectroscopy
4.1.3 Avg — Average
4.1.4 CPT — Critical Pitting Temperature
4.1.5 Cr — Chemical symbol for Chromium
4.1.6 Cr/Fe — Ratio of total Chromium to total Iron in
the passive oxide layer, as defined in SEMI F60
4.1.7 CrOX — Chromium Oxide
1 American Society for Testing and Materials, 100 Barr Harbor
Drive, West Conshohocken, Pennsylvania 19428-2959, USA.
Telephone: 610.832.9585, Fax: 610.832.9555 Website:
http://www.astm.org
SEMI F19-0304 © SEMI 1995, 2004 2
4.1.8 CrOX/FeOX — Ratio of Chromium Oxide to
Iron Oxide in the passive oxide layer, as defined in
SEMI F60
4.1.9 EDS — Energy Dispersive X-ray Spectroscopy
4.1.10 ESCA — Electron Spectroscopy for Chemical
Analysis (sometimes referred to as XPS)
4.1.11 Fe — Chemical symbol for Iron
4.1.12 FeOX — Iron Oxide
4.1.13 Max — Maximum
4.1.14 µin — Micro inch (= 10
-6
inch)
4.1.15 µm — Micrometer (= 10
-6
meter)
4.1.16 nm — Nanometer (= 10
-9
meter)
4.1.17 Ra — Roughness average of surface profile
4.1.18 Ry — Maximum peak-to-valley roughness
height of surface profile
4.1.19 SEM — Scanning Electron Microscopy
4.1.20 XPS — X-Ray Photoelectron Spectroscopy
(sometimes referred to as ESCA)
4.2 Definitions
4.2.1 blistering — a localized delamination within the
metal that has an appearance of chipped or flaked-off
areas.
4.2.2 defect — unintentional and undesirable
irregularity in the part surface that could affect system
performance. Examples of such defects include cracks,
inclusions, blistering, dents, pits, stringers and
scratches.
4.2.3 dent — an isolated irregularity on the wetted
surface made by an impact.
4.2.4 electropolishing — a method of polishing metals
and alloys in which material is removed from the
surface by making the metal the anode in an electrolytic
bath.
4.2.5 etched — a surface that has alloy structural
features revealed by preferential chemical or
electrochemical attack.
4.2.6 flaw — synonymous with defect.
4.2.7 frostiness — a continuous surface pattern whose
appearance is like that of a sparkly, very fine, sandy-
textured surface.
4.2.8 grain boundary — an interface separating two
grains, where the orientation of the lattice changes from
that of one grain to that of the other.
4.2.8.1 stepped grain boundary — a form of
preferential etching in which the grains are attacked at
different rates, resulting in one grain to appear raised
with respect to an adjacent grain, forming a “step” at
the grain boundary.
4.2.9 haze — a diminished surface brightness or
specularity attributable to diffuse light scattering by
concentrations of microscopic surface irregularities, or
to chemical inhomogeneity.
4.2.10 inclusion — indigenous or foreign material
within the metal, usually referring to non-metallic
compound particles such as oxides, alumina, sulfides or
silicates.
4.2.11 interrupted electropolishing — a break in the
continuity of the electropolished surface appearance
due to a change of electropolishing conditions at the
interruption boundary; may be visible as a change in
reflectivity across the boundary or a step in the surface.
4.2.12 lay — the direction of the predominant surface
pattern, ordinarily determined by the production
method used.
4.2.13 machining Lines — a type of process line that
results from machining processes.
4.2.14 nominal surface — the intended surface contour,
the shape and extent of which is shown and
dimensioned on a drawing or descriptive definition.
4.2.15 orange peel — large-featured, roughened type
of surface visible to the unaided eye whose surface
appearance pattern is like that of an orange peel.
4.2.16 passivation — the chemical treatment of a
stainless steel surface with an oxidizing solution for the
purpose of enhancing the corrosion resistant surface
film.
4.2.17 pit — a surface cavity or crater with a defined
edge not caused by impact.
4.2.18 process Lines — surface features that are a
result of the material removal or forming process used
in manufacturing of a component.
4.2.19 Ra Avg. — average Ra of a set of surface
roughness measurements.
4.2.20 Ra Max. — maximum Ra of a set of surface
roughness measurements.
4.2.21 Ry Max. — maximum Ry of a set of surface
roughness measurements.
4.2.22 roughness — the finer irregularities of the
surface texture, usually including those irregularities
that result from the manufacturing process. These are
considered to include traverse feed marks and other
SEMI F19-0304 © SEMI 1995, 2004 3
irregularities within the limits of the roughness
sampling length.
4.2.23 scratch — an elongated mark or groove cut in
the surface by mechanical means, not associated with
the predominant surface texture pattern.
4.2.24 stringer — a microstructural configuration of
alloy constituents or foreign nonmetallic material, or
trace thereof, oriented in the direction of mechanical
working.
4.2.25 surface texture — the repetitive or random
deviations from the nominal surface which form the
three dimensional topography of the surface. Surface
texture includes roughness, waviness, lay, and flaws.
4.2.26 waviness — the more widely spaced component
of surface texture. Unless otherwise noted, waviness is
to include all irregularities whose spacing is greater
than the roughness sampling length. Waviness may
result from such factors as machine or work deflections,
vibrations, chatter, heat treatment, or warping strains.
Roughness may be considered as superimposed on a
“wavy” surface.
4.2.27 wetted surface — surfaces of the components
that are in contact with the contained gases and/or
liquids used in semiconductor manufacturing processes.
5 Ordering Information
5.1 The purchase order for components to be supplied
in compliance with this specification shall include the
following information:
5.1.1 Purchase Order Number.
5.1.2 Supplier’s (preferred) or purchaser’s part
number(s), including size(s).
5.1.3 Quantity of components by part number and size.
5.1.4 Grade of each part number and size per the grade
classifications specified in this specification.
5.1.5 Reference to this specification number and any
additional applicable specifications.
5.1.6 Documentation and certification requirements.
5.1.7 Any special and/or supplementary requirements.
6 Requirements
6.1 Requirements of this specification are divided into
three grades of products:
6.1.1 General Purpose Components (GP) — These are
components intended for use in fluid distribution
systems of semiconductor manufacturing facilities that
do not have stringent cleanliness requirements.
Examples are clean dry air and vacuum lines.
6.1.2 High Purity Components (HP) — These are
components intended for use in high performance
capability chemical distribution systems of
semiconductor manufacturing facilities.
6.1.3 Ultra High Purity Components (UHP) — These
are components intended for use in advanced chemical
distribution systems of semiconductor manufacturing
facilities in which optimum performance capabilities
are required.
6.2 Requirements of this specification are shown in
Table 1, along with the appropriate test methods for
evaluating each.
6.3 Surface Roughness Requirements — Surface
roughness requirements for each grade of component
are shown in Table 1. Measurements shall be made per
the mechanical profilometry test method SEMI F37.
6.3.1 Welds, screw slots, intersections, and non-
metallic parts are not measured.
6.4 Surface Defect Requirements — Surface defect
requirements for the HP and UHP grades of
components are shown in Table 1. Measurements shall
be made per the SEM test method of SEMI F73.
6.5 Surface Contamination Requirements — Gross
surface contamination on the HP and UHP grades of
components observed in the SEM determination of
surface defects per SEMI F73 shall be evaluated by
EDS.
6.5.1 Elements expected to be found on the surfaces of
components by EDS include the primary alloying
elements Iron (Fe), Chromium (Cr), Nickel (Ni), and
Molybdenum (Mo). The residual elements Manganese
(Mn) and Silicon (Si), the Oxygen (O) of the passive
layer, and adsorbed carbon are also expected to be
found. Any other elements detected by EDS are to be
considered contaminants and are cause for rejection.
6.6 Surface Chemistry Requirements — The preferred
test method for evaluating the chemistry and
contamination of the oxide passive layer is the ESCA
test method of SEMI F60 for the HP and UHP grades of
components. Alternatively, the evaluation may be
performed by the AES test method of SEMI F72, per
agreement between the supplier and user.
6.6.1 Elements expected to be found on the surfaces of
components by ESCA or AES include the primary
alloying elements Iron (Fe), Chromium (Cr), Nickel
(Ni), and Molybdenum (Mo), the residual elements
Manganese (Mn), Silicon (Si), Sulfur (S), Phosphorous
(P), Nitrogen (N) and Silicon (Si), and the Oxygen (O)
of the passive layer. Adsorbed Carbon contamination
shall be < 30 atomic percent, declining to base levels
within 15 Angstrom of the initial surface.