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SEMI M23-0703 © SEMI 1993, 2003 12 NOTICE: SEMI makes no warranties or representations as to the su itability of the standard set forth herein for any particular application . The determinati on of the suitability o f th…

SEMI M23-0703 © SEMI 1993, 2003 11
Figure 6
SEMI Wafer Edge Profile Template
Table 3 Edge Profile — Dimension and Tolerance Requirements
Property Dimensions Units
Edge Profile Coordinate: x-coordinate y-coordinate
Point A 75 0
µm
Point B 510 0
µm
Point C 50 (See NOTE 1.)
µm
Point D 0 75
µm
NOTE 1: The y-coordinate of point C is 1/3 the nominal wafer thickness.
Figure 7
Example of Acceptable and Unacceptable Wafer Edge Profiles

SEMI M23-0703 © SEMI 1993, 2003 12
NOTICE: SEMI makes no warranties or representations as to the suitability of the standard set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant
literature respecting any materials mentioned herein. These standards are subject to change without notice.
The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.

SEMI M23.1-0600 © SEMI 1993, 20001
SEMI M23.1-0600
STANDARD FOR ROUND 50 mm DIAMETER POLISHED
MONOCRYSTALLINE INDIUM PHOSPHIDE WAFERS
This standard was technically approved by the Global Compound Semiconductor Committee and is the direct
responsibility of the Japanese Compound Semiconductor Committee. Current edition approved by the
Japanese Regional Standards Committee on April 28, 2000. Initially available at www.semi.org May 2000;
to be published June 2000. Originally published in 1993; previously published in 1996.
The complete specification for this product includes all general requirements of SEMI M23.
Table 1 Dimension and Tolerance Requirements
Property Dimension Tolerance Units
A
DIAMETER 50.0 ± 0.5 mm
THICKNESS, CENTER POINT
A 350 ± 25 µm
B 450 ± 25 µm
PRIMARY FLAT LENGTH 16 ± 2 mm
SECONDARY FLAT LENGTH 8 ± 2 mm
BOW to be specified
TOTAL THICKNESS VARIATION to be specified
A
: For reference purposes, the metric (SI) units apply.
Table 2 Orientation and Flat Location Requirements
Property Requirement
OPTION Dove-Tail
PRIMARY FLAT ORIENTATION
)110( ± 0.5°, under an indium facet. The primary flat shall be
perpendicular to the “Dove-tail” etch figure.
SECONDARY FLAT ORIENTATION 90 ± 5° clockwise from the primary flat.
SURFACE ORIENTATION
A { 100} ± 0.5°
B { 100} off 2° ± 0.5° toward any { 110} plane
ORTHOGONAL MISORIENTATION ± 5°
NOTICE: SEMI makes no warranties or representations as to the suitability of the standard set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant
literature respecting any materials mentioned herein. These standards are subject to change without notice.
The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.