semi合集-English.pdf - 第2608页

SEMI E91-0600 © SEMI 1999 , 2000 13 : n. <Da ta n > 9.4 Upl oading (Reporti ng) Resul t D a ta 9.4.1 R esult Data is reported by S6,F 1 1 upon co mpletion of the inspection in each wafer. 9.4.1.1 Ex a mple: L,3 1. …

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SEMI E91-0600 © SEMI 1999, 2000 12
.........
PARAM_RECORD00:structure class name/class name/process program record name
.........
PARAM_RECORDnn:structure class name/class name/process program record name
8.4.1.1 Each line has a structure:
TAG + ":" + parameter(s) + line terminator
8.4.1.2 The line terminator is some of CR+LF (0x0d0a), CR (0x0d), LF (0x0a).
8.4.1.3 Specific parameters of equipment supplier may be put between "HOT_CHUCK_TOLE" and
"PARAM_FILE00".
Table 10 Tag Parameters in Master Process Program
Tag Description Format Unit
PRODID Product name (i.e., Device type) A[1,24] -
WAFER_SIZE Wafer size A[1,3] mm
DIE_SIZE_X Die size X A[1,6] micron
DIE_SIZE_Y Die size Y A[1,6] micron
MULTI_DIE Multi probing number A[1,3] -
REFERENCE_DIE_COORD_X Reference die coordinator X A[1,4] -
REFERENCE_DIE_COORD_Y Reference die coordinator Y A[1,4] -
OVER_DRIVE Over drive value A[1,4] micron
FLAT_ANGLE Flat orientation A[1,3] degree
FLAT_TYPE FLAT or NOTCH A[1,5] -
HOT_CHUCK Flag of hot chuck usage A[2,3]
“ON” or “OFF”
-
HOT_CHUCK_TEMP Hot chuck temperature A[1,4] Celsius
HOT_CHUCK_TOLE Hot chuck tolerance A[1,3] Celsius
PARAM_RECORDnn Sub-parameter record nn A[ ] -
9 Map Data
9.1 This section defines handling o f map data in the PSEM equipment. The contents of map data are not defined
here. The specification in this section is provisional. This will be revised in the near future.
9.2 Use of Map Data
9.2.1 Map data is divided into two groups: result data which is reported to the host when processing of each wafer
is completed and instruction data which is instructed by the host in a unit of wafer at the time of re-inspection or
marking.
9.3 Structure of Map Data
9.3.1 The map data has a list structu re and the result data is defined by class <DVVAL> and the instruction data is
defined by <CEPVAL>.
9.3.1.1 Example:
<ResultData>
L,n
1. <Data
1
>
SEMI E91-0600 © SEMI 1999, 200013
:
n. <Data
n
>
9.4 Uploading (Reporting) Result Data
9.4.1 Result Data is reported by S6,F11 upon completion of the inspection in each wafer.
9.4.1.1 Example:
L,3
1. <DATAID>
2. <CEID>:Wafer End
3. L,a
1. L,2
1. <RPTID1>
2. L,7
1. <LOTID>
2. <PROCID>
3. <IDTYP>
4. <MID>
5. <ROWCOLCT>
6. <REFDIEPOS>
7. <ResultData>
:
a. L,2
1. <RPTIDa>
2. L,b
1. <LOC>
2. <PRODID>
3. <WAFSIZE>
4. <FLATTYPE>
5. <FLATANGL>
6. <REFDIECOORD>
7. <BINLIST>
:
b. <Vb>
9.5 Downloading Instruction Data
9.5.1 If the past inspection result is required in processing a wafer, the equipment obtains instructed data from the
host in the following procedure.
Comment Host Equipment Comment
Transfer a wafer.
The equipment is ready to receive
previous result data for a wafer
concerned.
S6,F11 “Waiting Previous Data (wait for
reception of previous result data)” event
report.
Check event. S6,F12
Instruction data download
(PRE-DATA_DOWNLOAD)
S2,F49
S2,F50 Reception response.
The processing is performed based on
instruction data.
SEMI E91-0600 © SEMI 1999, 2000 14
9.5.2 An example of Waiting Previo us Data event report S6,F11 in the procedure above is shown below:
9.5.2.1 Example:
S6,F11
L,3
1. <DATAID>
2. <CEID> :Waiting Previous Data
3. L,2
1. <RPTID1>
2. L,4
1. <LOTID> :Prober Job ID
2. <PROCID>
3. <MID>
4. <IDTYP>
9.5.3 An example of remote command S2,F49 used in the procedure above is shown below.
9.5.3.1 Example:
S2,F49
L,4
1. <DATAID>
2. <OBJSPEC> :a null length item.
3. < RCMD> :“PRE-DATA_DOWNLOAD”
2. L,n
1. L,2
1. <CPNAME
1
>
2. <CEPVAL
1
>
:
n. L,2
1. <CPNAME
n
> :PreviousResultData
2. L,b
1. <CPVAL
n1
>
:
b. <CPVAL
nb
>
9.6 Map Data Item Variable Table
Table 11 Map Data Item Variable Table
Variable Name Description Format Comments
LOTID Lot ID (Prober Job ID) A[30]
PROCID Process ID A[20]
LOC Cassette location U1
PRODID Product name (i.e., Device type) A[24]
SLOTNO Slot position in the cassette A[2] MID
WAFERNO Wafer number A[2] MID
WAFERID Wafer ID A[32] MID
IDTYP ID type to recognize a wafer. A[8] “SLOTNO” or “WAFERNO” or “WAFERID”
WAFSIZE Wafer size A[3] Unit is mm
FLAT Flat or Notch A[5] “FLAT” or “NOTCH”
FLATANGLE Flat angle A[3] Range from “000” to “359”. Unit is degree.
ROW Row count U2
COLUMN Column count U2