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SEMI G75.9-069 8 © SEMI 1998 1 SEMI G75.9-0698 TEST ME THOD FOR MEASUREMENT OF TENSILE STRENGTH, ELONGATION, AND TENSILE MODULUS OF LE A D FRAME T A PE 1 Purpo se 1.1 Tensile strength , elongation, a n d tensile modulus …

SEMI G75.8-0698 © SEMI 1998 2
Figure 1
Coefficient of Thermal Expansion (CTE)
6.7.2.2 Extend the lower tangent line above its highest
temperature and the higher tangent line below its lowest
temperature until they intersect. The temperature at the
intersection point is the Glass Transition Temperature.
6 Related Documents
NOTE: As listed or revised, all documents cited shall be the
latest publications of adopted standards.
6.1 SEMI Standard
SEMI G13 — Standard Test Method for Expansion
Characteristics of Molding Compounds
6.2 ASTM Specification
1
ASTM D 669 — Standard Test Method for Coefficient
of Linear Thermal Expansion of Plastics
6.3 JIS Specification
2
JIS K 6911 — Testing Methods for Thermosetting of
Plastics
1 American Society of Testing and Materials, 100 Barr Harbor Drive,
West Conshohoken, PA 19428-2959 (all cited standards may be
found in Volume 10.05 of the Annual Book of ASTM Standards)
2 Japanese Standards Association, 1-24, Akasaka 4 Chome, Minato-
ku, Tokyo, Japan
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.

SEMI G75.9-0698 © SEMI 19981
SEMI G75.9-0698
TEST METHOD FOR MEASUREMENT OF TENSILE STRENGTH,
ELONGATION, AND TENSILE MODULUS OF LEADFRAME TAPE
1 Purpose
1.1 Tensile strength, elongation, and tensile modulus
of leadframe tape are measured by a tensile pull tester,
which is used to stretch the tape samples to the point of
breakage with a calibrated load cell.
2 Equipment
2.1 Tensile pull tester with 100 kg MAX load cell,
sample clamping chucks, and a chart recorder.
2.2 Micrometer with 0.001 mm accuracy.
2.3 Calipers with 0.02 mm accurac y.
3 Test Condition
3.1 Tensile test measurements shall be carried out at
the following ambient conditions:
Temperature — 23 ± 5°C
Humidity — 50 ± 5% RH
4 Sampling
4.1 The sampling is one sample per one lot. The
vendor has to report the definition of lot, if the
customer requires it.
4.2 The sample width shall be 15.0 ± 0.2 mm, and the
length must be 100 mm minimum.
5 Equipment Setup and Cal ibration
5.1 Refer to the tensile tester manufacturer’s
equipment manual for setup and calibration.
5.2 The pulling rate shall be set to 5 ± 0.5 mm/minute.
5.3 The load shall be recorded in kilograms.
6 Procedure
6.1 Measure the thickness (T) of the sample with the
micrometer and the width (W) with calipers (mm).
6.2 Clamp the tape in the chucks so that the distance
(L
0
) between the chucks is 50 ± 5 mm.
NOTE: Some equipment may measure this length
automatically or plot Stress versus Strain, (L/L
0
), directly,
where L is the elongation.
6.3 Start the pulling and record until the sample
breaks.
6.4 Repeat the testing procedures for all the samples.
7 Results
7.1 Read the Break Force A (kg) and Elongation L
1
(mm) at sample breakage from the chart.
7.2 Draw a tangent line from the origin of the Load-
Elongation curve to the maximum slope of the curve.
(See Figure 1.)
NOTE: B (kg) is the incremental force change required to
produce an elongation, L
2
, in the elastic region and may be
determined from the tangent line.
Figure 1
Breakage Point Calculation Diagram
7.3 Calculations — Tensile Strength at Break (s) is
determined from the following equation:
S(
N
/
mm
2
)
=
9
.
8
A
WT
7.3.1 Percentage Elongation at Break (e) is determined
from the following equation:
ε
(%)
=
100
L
1
L
0
7.3.2 Tensile Modulus (E) is determined from the
following equation:
E
(
N
/
mm
2
)
=
∆
Stress
∆
Strain
=
9
.
8
B
WT
L
2
L
0

SEMI G75.9-0698 © SEMI 1998 2
8 Related Documents
NOTE: As listed or revised, all documents cited shall be the
latest publications of adopted standards.
8.1 ASTM Specification
1
ASTM D 638 — Standard Test Method for Tensile
Properties of Plastics
8.2 JIS Specification
2
JIS K 6911 — Testing Methods for Thermosetting of
Plastics
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
1 American Society of Testing and Materials, 100 Barr Harbor Drive,
West Conshohoken, PA 19428-2959 (all cited standards may be
found in Volume 10.05 of the Annual Book of ASTM Standards)
2 Japanese Standards Association, 1-24, Akasaka 4 Chome, Minato-
ku, Tokyo, Japan
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.