semi合集-English.pdf - 第325页
SEMI E49.2-1104 © SEMI 1995, 2004 7 intervals with very small counts are not taken. In addition, the user should remain cogn izant of the requirement in Table 1 for allowable particle adders. 9.4.7 As noted in Ta ble 1, …
SEMI E49.2-1104 © SEMI 1995, 2004 6
Assembly is repressurized to 40 psig.
During the next 15 minutes the Assembly pressure
is monitored to ensure that no visible leakage or
pressure loss in excess of 2 psi (5%) is observed.
9.2.5 As noted in Table 1, the requirement to pass this
test is no visible leakage and pressure decay of less than
5% of maximum recommended operating pressure.
The actual pressure decay and results of a visible
inspection should be noted on the test report.
9.3 Ultrapure Water Flush Test — This test consists of
resitivity and TOC tests and is required for every
Assembly shipped directly to an end user. These tests
may also be required periodically at other points in the
supply chain.
9.3.1 Resistivity Testing Recommendations
9.3.1.1 The test flow rate should be no less than the
manufacturer’s recommended minimum flow rate for
the instrument(s) being used. The test flow rate should
be no more than the maximum recommended flow for
the Assembly under test or the instrument(s) being
used.
9.3.1.2 Following recommended manufacturer
procedures, measure resistivity just prior to the
Assembly and at the Assembly outflow.
9.3.1.3 Allow the reading just prior to the Assembly to
stabilize until no change outside the precision of the
device is observed for at least 5 minutes and the
resistivity meets or exceeds the specification in section
7.2. Repeat the procedure at the Assembly outflow.
9.3.1.4 Temperature just prior to the Assembly must
not differ more than +/- 0.5 C when compared to the
temperature at the Assembly outflow. Otherwise, a
correction may need to be performed
9.3.1.5 Ensure that instrument connections are leak
tight to avoid positive bias from atmospheric CO
2
.
9.3.1.6 The inflow and outflow may be measured
simultaneously using a 2-channel/2-cell resistivity
meter.
9.3.1.7 As noted in Table 1, the requirement to pass
this test is a resistivity >
18 Mohm-cm @ 25°C (77°F)
and both inlet and outlet. The test report should include
inlet at outlet resistivity measurements.
9.3.2 TOC Testing Recommendations
9.3.2.1 The test flow rate should be no less than the
manufacturers recommended minimum flow rate for the
instrument(s) being used. The test flow rate should be
no more than the maximum recommended flow for the
Assembly under test or the instrument(s) being used.
9.3.2.2 Refer to ASTM Method D5997-96
(Reapproved 2000) when including UV persulfate
oxidation or ASTM 5173-97 when using UV without
persulfate. It should be noted which method is
incorporated.
9.3.2.3 Ensure that the instrument connections are leak
tight to avoid interference from atmospheric CO
2
.
Because TOC is determined by the difference of Total
Carbon (TC) and Total Inorganic Carbon (TIC), the
TOC detection limit can be no lower than 10% of the
TIC reading.
9.3.2.4 Allow the readings to stabilize until at least two
successive readings agree within +/- 5% and the TOC
adders are <
the value specified in Table 1.
9.3.2.5 The procedure should be performed just prior
to the Assembly and at the Assembly outflow.
9.3.2.6 As noted in Table 1, the requirement to pass
this test is TOC adders (ppb) of <
7.5. Both the inlet
and outlet TOC measurements should be included in the
test report.
9.4 Particle Testing Recommendations —
These tests
are required periodically to establish that the Assembly
design is typically capable of meeting the performance
criteria in Table 1.
9.4.1 The test flow rate should be no less than the
manufacturers recommended minimum flow rate for the
instrument(s) being used. The test flow rate should be
no more than the maximum recommended flow for the
Assembly under test or the instrument(s) being used.
9.4.2 Particle contribution will be determined without
valves being actuated. Active components such as
valves should be evaluated for particle performance at
the component level to supplement this test.
9.4.3 The water supplied to the Assembly under test
should be filtered with a maximum 0.05 micron filter
with a retention value such that filtered particle
concentration is <
10 particle/liter > 0.1 µm.
9.4.4 Particle contribution testing will measure the
Assembly outlet particle concentration and assumes all
particles are generated within the Assembly under test.
Periodic verification of the inlet particle concentration
specified in Section 9.4.3 should be performed and
reported in accordance with Section 9.1.1. Allowable
particle adders are outlined in Table 1.
9.4.5 Follow the manufacturer’s recommended
procedures for the optical particle counter.
9.4.6 Allow the reading to stabilize from rinse down
until there is no change within the expected noise for 2
or more intervals (i.e. no change in slope). An
appropriate sample interval should be chosen such that
SEMI E49.2-1104 © SEMI 1995, 2004 7
intervals with very small counts are not taken. In
addition, the user should remain cognizant of the
requirement in Table 1 for allowable particle adders.
9.4.7 As noted in Table 1, the requirement to pass this
test is <
120 allowable Particle adders (particles/L > 0.1
µm). The outlet particle concentration and date and
concentration of most recent inlet particle concentration
verification should be noted on the test report.
9.5 Anions and Metals Testing Recommendations —
These tests are required periodically to establish that the
Assembly design is typically capable of meeting the
performance criteria in Table 1.
9.5.1 The test flow rate should be no more than the
maximum recommended flow for the Assembly under
test or the instrument(s) being used.
9.5.2 Grab Sample Methodology for Assembly supply:
Step 1: Open and close sampling valve 5 times.
Step 2: Open valve full throttle and allow UPW to flow
for at least 2 minutes.
Step 3: Adjust to approximately 1liter/minute and
allow to flow at least 5 minutes.
Step 4: Use precleaned and qualified bottles one each
for anions and metals.
Step 5: Fill to overflowing and empty the contents.
Repeat 4 times. Avoid contact with the neck or inside
of the cap with hands or sample port.
Step 6: Minimizing the distance between the port and
bottle, fill the container to the bottom of the neck.
Step 7: Carefully rinse the cap and immediately secure
it tightly to the bottle.
9.5.3 Grab Sample Methodology for Assembly
Outflow:
Step 1: Under standard assembly operation, allow
outflow to run at least 5 minutes.
Step 2: Use precleaned and qualified bottles one each
for anions and metals. Note that for convenience,
outflow bottles may be prerinsed using inflow UPW.
Step 3: Minimizing the distance between the outflow
and bottle, fill the container to the bottom of the neck.
Step 4: Carefully rinse the cap and immediately secure
it to the bottle.
9.5.4 Use ASTM D4327 with preconcentration to
analyze anions. Use an industry standard method with
ICP-MS to analyze metals.
9.5.5 Required precision for each analyte is such that
the difference of the incoming and outgoing reading has
an error of no more than +/- 20%.
9.5.6 As noted in Table 1, the requirements to pass this
test are dependent on the ionic or metallic adder. The
inlet and outlet concentrations for each analyte (or
copies of laboratory reports) should be maintained and
available upon request.
10 Certification
10.1 The supplier of an Assembly shipped to an end
user is responsible for defining, establishing, executing,
and maintaining a certification program based on the
tests in Section 6.
10.2 By default all of the requirements within this
document apply unless another agreement is made
between supplier of an Assembly shipped to an end
user and an end user.
10.3 Qualification tests and certification documents
shall reflect current production practices.
10.4 The certification program will specify any
necessary corrective action plan in the event that an
Assembly fails to meet these requirements during
testing.
10.5 Upon request, the supplier of an Assembly
shipped to an end user is responsible for supplying
documentation that proves the Assembly consistently
meets the requirements of this document.
10.6 As stated in the purpose, this document is a
“guideline by which the purity and mechanical integrity
of all ultrapure water and liquid chemical Assemblies
shipped to end users may be qualified”. To ensure the
purity and mechanical integrity of Assemblies shipped
to end users is maintained, these guidelines must also
be implemented throughout the supply chain. Section
10.7 provides recommendations for Assemblies shipped
directly to an end user and Section 10.8 provides
recommendations for the remainder of the supply chain.
10.7 The certification program for an Assembly
delivered directly to an end user will specify the
frequency of testing and the test Assembly(s).
10.7.1 Each individual Assembly delivered directly to
an end user shall have the following tests performed:
Hydrostatic test (See Table 1 and Sections 9.1 and
9.2)
Ultrapure Water Flush test (see Table 1 and
Sections 9.1, 9.3.1, and 9.3.2)
SEMI E49.2-1104 © SEMI 1995, 2004 8
10.7.2 To avoid the cost involved in performing the
Particle test (Section 9.4) and Ionic and Metallic
Contamination tests (Section 9.5) on every Assembly
delivered directly to an end user, Assemblies shall be
selected which represent all unique components and
production techniques. The Assemblies will be
certified as meeting the requirements within Table 1
based on the outcome of the representative tests and a
periodic testing program.
10.7.3 Particular attention and increased testing
frequency are recommended for Assemblies that
include components not covered by SEMI F57.
10.7.4 The supplier of an Assembly shipped directly to
an end user should specify which components do, and
which components do not, comply with SEMI F57
where SEMI F57 is applicable.
10.8 The certification program for Assemblies not
delivered directly to an end user will specify the
frequency of testing and the test Assembly(s).
10.8.1 To avoid the cost involved in performing
Hydrostatic testing (Section 9.2), the Ultrapure Water
Flush test (section 9.3), the Particle test (Section 9.4)
and the Ionic and Metallic Contamination tests (Section
9.5) on every Assembly, test Assemblies shall be
selected which represent all unique components and
production techniques. The Assemblies will be
certified as meeting the requirements of Table 1 based
on the outcome of the representative tests and periodic
testing program. Particular attention and increased
testing frequency are recommended for Assemblies that
include components not covered by SEMI F57.
10.8.2 The supplier chain should specify which
components do, and which components do not, comply
with SEMI F57 where SEMI F57 is applicable.
11 Supply Chain Traceability
11.1 It will be the responsibility of all Assembly
suppliers to verify that all components covered by
SEMI F57 comply with the specifications set forth in
SEMI F57.
11.2 It will be the responsibility of all Assembly
suppliers to ensure that all components have been
handled and assembled in accordance with the
recommendations set forth in SEMI E49.7.
11.3 It will be the responsibility of all Assembly
suppliers to maintain records that show all assemblies
comply with Section 10 of this document.
11.4 It will be the responsibility of all Assembly
suppliers to ensure that their sources of Assemblies are
controlled to the extent that they support the
requirements within Section 10.
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer's instructions, product labels,
product data sheets, and other relevant literature,
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
By publication of this standard, Semiconductor
Equipment and Materials International (SEMI) takes no
position respecting the validity of any patent rights or
copyrights asserted in connection with any items
mentioned in this standard. Users of this standard are
expressly advised that determination of any such patent
rights or copyrights, and the risk of infringement of
such rights are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction of
the contents in whole or in part is forbidden without express written
consent of SEMI.