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SEMI E76-0299 SEMI 1998, 1999 3 5.19 s eismic bracing — Stru ctural reinforcem ent to mi nim ize damage du e to earthquak es. 5.20 single li ne drop — A ho okup str ategy where a piece of processi ng equipm ent h…
SEMI E76-0299
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and laws should be consulted to ensure that the
equipment meets regulatory requirements in each
location.
3.3 This guide is not intended to address design issues
related to safety. Safety issues are addressed in other
SEMI standards (See SEMI S2).
4 Referenced Documents
4.1 SEMI documents
SEMI E6 — Facilities Interface Specifications
Guideline and Format
SEMI S2 — Safety Guideline for Semiconductor
Manufacturing Equipment
NOTE: All documents cited will be the latest published
versions.
5 Terminology
5.1 bottom feed — Equipment utility supply lines enter
the equipment from its underside typically through the
floor.
5.2 equipment configuration — Specifically, the
arrangement, location, type and quantity of EPOC’s
needed for installation. Also know as tool configuration.
5.3 equipment point of connection (EPOC) — A
fitting or other terminal provided with the processing
equipment (either external or internal) for utility
connection, the equipment end/termination of the
hookup. Also know as tool point of connection.
5.4 external connection — An external connection is
located outside the main frame of equipment.
5.5 facilities interface specification
— Documentation
provided by an equipment supplier that contains the
equipment requirements for utilities and installation
[SEMI E6].
5.6 facility services — Any gas, exhaust, liquid,
power, data communications or other material which are
supplied to or carried away from the equipment and
used in the process. Also referred to as utilities or
facilities.
5.7 footprint — The total area or floor space
consumed by a piece of equipment when viewed
perpendicular to the area of reference (e.g., normally,
when viewed from directly overhead and considering
the floor).
5.8 hazardous production materials (HPM) — A
solid, liquid, or gas that has a degree of hazard rating in
health, flammability, or reactivity of class 3 or 4 as
ranked by NFPA 704 and that is used directly in
research, laboratory, or production processes that have
as their end product materials that are not hazardous.
5.9 hookup — The set of activities and organization
required to accept incoming process equipment, move it
into place, connect the equipment to all facilities, and
test the connections. The connection of all necessary
facilities and interconnects required to make the
equipment package fully operational.
5.10 interconnect — Connections between equipment
mainframe and peripheral equipment subsystem
equipment [SEMI E6].
5.11 internal connection — An internal connection is
a utility connection to the equipment which is located
internal to the equipment and typically associated with
hazardous utilities.
5.12 interface box — An enclosure located between
the equipment mainframe and facility services typically
containing components for pressure regulation and
filtration. It functions to consolidate facility service
requirements to single points of connection. The
interface box can provide location and ability to pre-
facilitate equipment hookups in advance of equipment
delivery.
5.13 jig — A three dimensional fixture, typically a
frame that contains equipment installation aides which
serve to indicate location and type of connection needed
for equipment hook-up.
5.14 location plane — The common area on a piece of
equipment where EPOC’s may be located (e.g., back,
side, top, bottom).
5.15 pedestal — Structural support element upon
which equipment or raised floor rests.
5.16 pre-facilitation — The stage in the equipment
installation process that follows base build and precedes
equipment delivery/equipment hookup. Pre-facilitation
brings the various facilities services close to the new
equipment location, including new facilities services
and structural modifications required to prepare the
facility to accept the equipment.
5.17 pre-facilitation pedestal — A matching
equipment floor mounting surface intended to act as a
means to expedite equipment hookup, as well as, save
fab floor space by having pre-plumbed connections.
Ideally, the pedestal would be installed and facilitated to
the UPOC’s prior to the equipment arrival.
5.18 raised floor — The removable floor system
installed above the actual building floor within
cleanroom environments to control air flow and allow
access for utility routing and connection.
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5.19 seismic bracing — Structural reinforcement to
minimize damage due to earthquakes.
5.20 single line drop — A hookup strategy where a
piece of processing equipment has only one point of
connection per facility service. All manifolding for an
individual service is handled with in the equipment.
5.21 specialty gas — Non-bulk process gases typically
stored in cylinders and used to supply one or more
process equipment through specialized manifolds.
5.22 subfab — The area below or outside of the
cleanroom production area that can be a single or
multiple levels and may or may not be clean.
5.23 support equipment — Ancillary equipment not
part of the main chassis.
5.24 template — Provides a dimensional outline of the
equipment footprint including overall dimensions,
equipment datum point, utility connection/penetration
locations, equipment interconnect/penetration locations,
maintenance and access spaces, and wafer load/unload
stations. It can be made from any cleanroom compatible
material.
5.25 tool — Any piece of semiconductor fabrication or
inspection equipment designed to process wafers. Often
used synonymously with equipment in the silicon wafer
processing industry.
5.26 tool accommodation — A methodology by which
semiconductor processing equipment is installed in a
cost-effective and timely manner.
5.27 top feed — Where utility supply lines enter the
equipment from the topside.
5.28 utility point of connection (UPOC) — The mating
fitting or terminal provided by the facility for
interconnection with the EPOC for utility supply, the
facility end/termination of the hookup at the equipment.
Table 1. Equipment Point of Connection Location Recommendations
Facility Service / Utility
Bottom Location Plane
Preference
Back Location Plane
Alternate
Gas, Bulk Bottom Back (lower)
Gas, Specialty Bottom Back (lower) Back
Exhaust, Corrosive Bottom Back (lower) Back
Exhaust, Flammable Bottom Back (lower) Back
Exhaust, Solvent Bottom Back (lower) Back
Exhaust, General Bottom Back (lower) Back
Chemical Supply, Inorganic Bottom Back (lower)
Chemical Supply, Organic Bottom Back (lower)
Ultrapure Water Bottom Back (lower)
Cooling Water Bottom Back (lower)
Hot Ultrapure Water Bottom Back (lower)
Drain, Inorganic Bottom Bottom Back (lower)
Drain, Waste Chemical, Organic Bottom Bottom Back (lower)
Power, 100V Bottom Back (above wet EPOC)
Power, 200/400V Bottom Back (above wet EPOC)
Fire Suppression Bottom Back
Ancillary Component Interconnect Bottom Back (above wet EPOC)
Signal Cable Bottom Back (above wet EPOC)
Vacuum Foreline Bottom Bottom Back
Process Vacuum Bottom Back
NOTE: Connections located on the top are not recommended because of possible interference with overhead wafer
handling and minienvironment equipment.
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Table 2. EPOC Consistency Recommendations
Equipment Delivered Compared to EPOC Locations EPOC Types EPOC Sizes
Supplier-provided Facilities Interface
Specification
Should match Should match Should match
Similar Equipment (Same Model and Revision)
for Same Process Application
Should match Should match Should match
Similar Equipment (Same Model and Revision)
for Different Process Application
Should match for same
utilities.
Could match unique
utilities to unique
locations within the
appropriate EPOC
group.
Should match Could match, technical
reasons should exist
for differences.
Similar Equipment (Different Model) for Same
Application
Could match Could match Could Match
6 EPOC Recommendations
6.1 Equipment Point of Connection Locations
6.1.1 Table 1, EPOC Location Recommendations
identifies the locations for the specified facility utility
services. The locations noted apply to all equipment
types, as listed in the document scope, and all
equipment configurations including but not limited to
boxed equipment, linked equipment, and cluster
equipment.
6.1.2 Bottom Location Plane: Facility services are
typically provided from the subfab below the waffle
slab. The bottom location of EPOC’s allows for straight
up routing of supply lines, thus reducing equipment
footprint and easing facilitation. The locations of
EPOC’s need to be readily accessible to facilitate hook-
up to the UPOC (i.e., accessible from the back or sides).
(See Table 1.)
6.1.3 Back Location Plane: If the bottom location
plane option is not utilized for hookup, EPOC’s should
be on back plane of equipment just above the raised
floor. (See Table 1.)
6.2 Equipment Point of Connection Groups
6.2.1 Equipment points of connection should be
grouped together by service type to ensure ease of
hookup and qualification of the equipment. The
following groups should be considered during the
configuration of the equipment.
a) Electrical Power Connections Includes but
is not limited to connections for main electrical
utility power supply.
b) Data Communications Connections
Includes but is not limited to factory systems,
automated material handling system, and
support equipment communication cables and
interface connectors.
c) Gas Delivery System Connections Includes
but is not limited to fittings for bulk and
specialty gas lines.
d) Liquid Delivery System Connections
Includes but is not limited to fittings for liquid
chemical, slurry, ultra pure water, process
cooling water, temperature control unit fluids,
and industrial water lines.
e) Equipment Effluent Connections Includes
but is not limited to fittings for exhaust, drain,
and vacuum lines.
f) Life and Safety System Connections
Includes but is not limited to fire protection,
leak detection, emergency machine off (EMO),
and hazard warning systems.
6.2.2 A hierarchy should be adhered to when locating
these groups of connections on equipment. Data
communication wiring should be routed separately from
power wiring and connections. Radio frequency (RF)
interconnects should be routed and grouped separately.
All electrical and electronic wiring should be away from
and above water and drain lines.
6.3 Equipment Point of Connection Consistency
6.3.1 This section provides key elements to ensure the
required consistency of the equipment points of
connection. Connection locations on the equipment