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SEMI F54-1000 © SEMI 2000 7 NOTICE: SEMI makes no warranties or representations as to the suitability of the test method set forth herein for any particular application. T he determination of the suitability of the te st…

SEMI F54-1000 © SEMI 2000 6

APPENDIX 1

EXAMPLE REPORT FORM

NOTE: The material in this appendix is an official part of SEMI F54 and was approved by full letter ballot procedures on July 13,

2000 by the North American Regional Standards Committee.

A1-1 Test dates:

A1-2 Operator(s) performing test:

A1-3 Serial numbers: Reference instrument

CNC EC

A1-4 Attach flow meter and voltage indicator calibration data as described in Section 11.

A1-5 Data and calculations:

Data Point (Use Additional Sheets as Necessary)

12345678

NaCl Concentration (gm/l)

Flow Rates (cm

/s)

EC Aerosol

EC Sheath

EC Excess Air

CNC

Reference Instrument

Make-up Air or

Excess Aerosol Vent

EC Voltage (V)

Particle Size (micrometer)

Measured Particle Concentrations (Particles/cm

)

CNC

(1)

(1) Corrected for Transport Loss

(2)*

Reference Instrument

(3)

(3) Corrected for Multiple Charging

(Electrometers Only)

(4)*

(4) Corrected for Transport Loss

(5)*

Counting Efficiency

= (2)/(5)

A1-6 Attach plot of counting efficiency as a function of particle size

A1-7 Lower size sensitivity (micrometer)

∗

___________

∗ Attach calculations.

SEMI F54-1000 © SEMI 20007

NOTICE: SEMI makes no warranties or representations as to the suitability of the test method set forth herein for

any particular application. The determination of the suitability of the test method is solely the responsibility of the

user. Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other

relevant literature respecting any materials mentioned herein. These test methods are subject to change without

notice.

The user’s attention is called to the possibility that compliance with this test method may require use of copyrighted

material or of an invention covered by patent rights. By publication of this test method, SEMI takes no position

respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this test

method. Users of this test method are expressly advised that determination of any such patent rights or copyrights,

and the risk of infringement of such rights, are entirely their own responsibility.

International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o

the contents in whole or in part is forbidden without express written

consent of SEMI.

SEMI F55-0600 © SEMI 20001

SEMI F55-0600

TEST METHOD FOR DETERMINING THE CORROSION RESISTANCE

OF MASS FLOW CONTROLLERS

This test method was technically approved by the Global Facilities Committee and is the direct responsibility

of the North American Facilities Committee. Current edition approved by the North American Regional

Standards Committee on April 10, 2000. Initially available on www.semi.org May 2000; to be published

June 2000.

1 Purpose

1.1 A mass flow controller (MFC) is often used to

control corrosive gases under unfavorable conditions.

This test method is intended to help differentiate

between MFC designs on the basis of relative resistance

to corrosion-induced failure.

2 Scope

2.1 This test is intended to show the effect of

corrosion caused when a corrosive gas such as HCl is

contaminated by an oxidizer such as atmospheric

moisture. For the purpose of this test HCl is the

preferred test gas, however this test can also be

performed with other gasses. This test method

describes a corrosive gas exposure test for mass flow

controllers. The test is intended to accelerate the

corrosion while simulating conditions that may be

found within process equipment and gas systems in the

semiconductor industry. As the relationship between

corrosion and performance may differ with MFC

design, corrosion is not measured directly. The effects

of corrosion are detected by observing changes in MFC

calibration and other operating parameters.

2.2 This standard does not purport to address safety

issues, if any, associated with its use. It is the

responsibility of the users of this standard to establish

appropriate safety and health practices and determine

the applicability of regulatory limitations prior to use.

3 Limitations

3.1 This test method should not be expected to yield

comparable quantitative results from one test facility to

another.

3.2 Results may be compromised by the methods used

to construct the apparatus.

3.3 This test is designed to be a destructive test. The

MFC tested will be destroyed. This test is intended

only for MFCs manufactured for use in HCl or a similar

highly corrosive gaseous environment. MFCs

manufactured for non-corrosive service may develop

leaks or other catastrophic failures if tested by this

method. For practical reasons in constructing and

operating the test bed, test samples may be limited to

100 sccm N

equivalent full scale (FS) flow.

3.4 This method does not measure corrosion directly

by analyzing or inspecting the gas-wetted surfaces

following exposure to a corrosive. No attempt is made

to detect particles in the exit gas stream resulting from

the corrosion process.

4 Referenced Documents

SEMI F1 — Specification for Leak Integrity of High-

Purity Gas Piping Systems and Components

NOTE 1: As listed or revised, all documents cited shall be the

latest publications of adopted standards.

5 Terminology

5.1 Acronyms and Abbreviations

5.1.1 DUT — device under test

5.1.2 FS — full scale

5.1.3 kPa — kiloPascal

5.1.4 MFC — mass flow controller

5.1.5 MFM — mass flow meter

5.1.6 ppbv — parts per billion by volume

5.1.7 ppmv — parts per million by volume

5.1.8 sccm — standard cubic centimeters per minute

using a standard temperature of 0° C and a standard

pressure of 101.32 kPa.

5.2 Definitions

5.2.1 actual flow — for the purpose of this standard,

the output value of the reference flowmeter.

5.2.2 ambient temperature — the temperature of the

medium surrounding the device. Under ordinary

laboratory benchtop conditions, ambient temperature is

the temperature of the room.

5.2.3 indicated flow — the electrical output of the

device under test (DUT).

5.2.4 valve drive — electrical output from the DUT

which is analogous to the level of power supplied to the