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SEMI G27-89 © SEMI 198 5, 1989 1 SEMI G27-89 SPECIFICA TION FOR LE A DFRA MES FOR PLASTIC LEAD ED CHIP CARRIER (PLCC) PACKAGES 1 Preface Thi s specific atio n is a guide line for high vo lu me production of leadframes fo…
SEMI G26-90 © SEMI 1983, 19963
10 Packaging and Marking
10.1 Packaging — Containers selected shall be strong
enough and suitably designed to provide maximum
protection against crushing, spillage and other forms of
damage to the container or its contents. Containers shall
afford protection of the contents to contamination from
exposure to excessive moisture or oxidation by gases.
Packaging materials shall be so selected to prevent any
contamination of the ceramic component parts with
paper fibers or organic particles.
10.2 Marking — The outer containers shall be clearly
marked to identify the user stock number, user purchase
order number, drawing number, quantity, vendor lot
number, and solder glass type.
NOTICE: These standards do not purport to address
safety issues, if any, associated with their use. It is the
responsibility of the user of these standards to establish
appropriate safety and health practices and determine
the applicability of regulatory limitations prior to use.
SEMI makes no warranties or representations as to the
suitability of the standards set forth herein for any
particular application. The determination of the
suitability of the standard is solely the responsibility of
the user. Users are cautioned to refer to manufacturer’s
instructions, product labels, product data sheets, and
other relevant literature respecting any materials
mentioned herein. These standards are subject to
change without notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI G27-89 © SEMI 1985, 19891
SEMI G27-89
SPECIFICATION FOR LEADFRAMES FOR PLASTIC LEADED CHIP
CARRIER (PLCC) PACKAGES
1 Preface
This specification is a guideline for high volume
production of leadframes for plastic leaded chip carrier
semiconductor packages. It is a design guideline for
packaging engineers, leadframe stampers and mold
manufacturers, and has been developed to meet the
requirements of automatic assemblers.
2 Applicable Documents
2.1 Order of Precedence — To avoid conflicts, the
order of precedence when ordering leadframes to this
specification shall be as follows:
Purchase Order
This Specification
Referenced Documents
2.2 SEMI Specifications
SEMI G4 — Specification for Integrated Circuit
Leadframe Material
SEMI G10 — Standard Method of Mechanical
Measurement for Leadframes
SEMI G18 — Specification, Integrated Circuit
Leadframe Materials Used in the Production of Etched
Leadframes
SEMI G21 — Specification, Plating Integrated Circuit
Leadframes
2.3 Military and Federal Specifications
1
MIL-STD-105 — Sampling Procedures and Tables for
Inspection by Attributes
MIL-STD-883 — Test Methods and Procedures for
Microelectronics
2.4 ANSI Specification
2
Y14.5M — Dimensioning and Tolerancing
2.5 JEDEC Publication
3
Publication 9b — Registered and Standard Outlines for
Semiconductor Devices
1 Military Standards, Naval Publications and Form Center, 5801
Tabor Avenue, Philadelphia, PA 19120
2 ANSI, 1430 Broadway, New York, NY 10018
3 JEDEC, 20001 Eye Street N.W., Washington, D.C. 20006
3 Selected Definitions
burr — a fragment of excess material either horizontal
or vertical attached to the leadframe.
camber — curvature of the leadframe strip edge (see
Figure 1).
Figure 1
Camber
coil set — longitudinal bowing of the leadframe (see
Figure 2).
Figure 2
Coil Set
coined area — that area at the tip end of the bond
fingers coined to produce a flattened area for functional
use (see Figure 3).
SEMI G27-89 © SEMI 1985, 1989 2
Figure 3
Coined Area
crossbow — transverse bowing of the leadframe (see
Figure 4).
functional area — the die attach pad and the lead tips.
lead twist — angular rotation of bonding fingers (see
Figure 5).
pits — shallow surface depression or craters in the
leadframe material.
Figure 4
Crossbow
Figure 5
Lead Twist
slug marks — random dents in the leadframe caused by
foreign material in the stamping die.
stamped leadframe terminology — (See Figure 6.)
true position circle — the circle with its center
positioned at the center of the coined lead which
defines the design position of the lead tip.
Figure 6
Plastic Leaded Chip Carrier Leadframe
4 Ordering Information
4.1 Purchase orders for leadframes furnished to this
specification shall include the following information:
4.1.1 Current revision of the leadfra me drawing
detailing the base material and the plating type(s),
thickness(es) and area(s).
4.1.2 Reference to this specification.
4.1.3 Vendor certification requirements.
5 Dimensions
See Table 1.
6 Defect Limits and Parame ters
Note: Measurement methods are described in SEMI G10.
Alternate methods may be used as agreed to between vendor
and customer. The methods described in SEMI G10 are
considered to be standard for the purpose of solving
differences.
6.1 Dimensional Tolerances — Se e Figure 6.
6.2 Minimum Flat Wire Bonding Area — 80% of
nominal lead width and 0.635 mm (0.025") in length.
6.3 Coined Depth — 0.013 mm (0 .0005") min. to 30%
of material thickness maximum.
6.4 Horizontal Lead Spacing and Location (Lead
Tips)