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SEMI T4-0301 © SEMI 1995 , 2001 3 RELATED INFORM A TI ON 1 NOTE: T his related inf ormation is not a n official pa rt of SEMI T4, but wa s approved for pu blication by full letter ballo t procedur es in 19 95. R1-1 As th…
SEMI T4-0301 © SEMI 1995, 2001 2
Figure 1
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any
particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer’s instructions, product labels, product data sheets, and other relevant
literature respecting any materials or equipment mentioned herein. These standards are subject to change without
notice.
The user’s attention is called to the possibility that compliance with this standard may require use of copyrighted
material or of an invention covered by patent rights. By publication of this standard, SEMI takes no position
respecting the validity of any patent rights or copyrights asserted in connection with any item mentioned in this
standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and
the risk of infringement of such rights, are entirely their own responsibility.
SEMI T4-0301 © SEMI 1995, 20013
RELATED INFORMATION 1
NOTE: This related information is not an official part of SEMI T4, but was approved for publication by full letter ballot
procedures in 1995.
R1-1 As the outline of the pod sidewall is not
standardized, the available space for the pod
identification tag may vary between different pod types.
R1-2 The defined free space for data transmission
should not be obstructed for the following reasons:
• data transmission
• loading/unloading
• SEMI E15 (multiple row applications)
NOTICE: SEMI makes no warranties or
representations as to the suitability of the standards set
forth herein for any particular application. The
determination of the suitability of the standard is solely
the responsibility of the user. Users are cautioned to
refer to manufacturer’s instructions, product labels,
product data sheets, and other relevant literature
respecting any materials or equipment mentioned
herein. These standards are subject to change without
notice.
The user’s attention is called to the possibility that
compliance with this standard may require use of
copyrighted material or of an invention covered by
patent rights. By publication of this standard, SEMI
takes no position respecting the validity of any patent
rights or copyrights asserted in connection with any
item mentioned in this standard. Users of this standard
are expressly advised that determination of any such
patent rights or copyrights, and the risk of infringement
of such rights, are entirely their own responsibility.
Copyright by SEMI® (Semiconductor Equipment and Materials
International), 3081 Zanker Road, San Jose, CA 95134. Reproduction o
f
the contents in whole or in part is forbidden without express written
consent of SEMI.
SEMI T5-96 © SEMI 1996, 2004 1
SEMI T5-96 (Reapproved 1104)
SPECIFICATION FOR ALPHANUMERIC MARKING OF ROUND
GALLIUM ARSENIDE WAFERS
This specification was technically approved by the Global Traceability Committee and is the direct
responsibility of the North American Traceability Committee. Current edition approved by the North
American Traceability Committee on July 11, 2004. Initially available at www.semi.org September 2004; to
be published November 2004. Originally published in 1996; previously published in 1999.
1 Purpose
1.1 The purpose of this document is to define standard
criteria for the alphanumeric marking of round gallium
arsenide wafers, in order to improve the consistency of
wafer marking and allow simplification of the
performance requirement of automatic optical character
recognition (OCR) equipment.
2 Scope
2.1 This specification defines the geometric and spatial
limits of the alphanumeric code, specifically for
nominally round, flatted gallium arsenide wafers. It
also defines the basic code used to characterize the
individual wafer, thereby providing practical operator
interpretation. This document does NOT address the
marking techniques that may be employed when
complying with this standard nor does it address any
health issues associated with those techniques.
NOTICE: This standard does not purport to address
safety issues, if any, associated with its use. It is the
responsibility of the users of this standard to establish
appropriate safety and health practices and determine
the applicability of regulatory or other limitations prior
to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI AUX001 — List of Vendor Identification Codes
SEMI M12 — Specification for Serial Alphanumeric
Marking of the Front Surface of Wafers
NOTICE: Unless otherwise indicated, all documents
cited shall be the latest published versions.
4 Terminology
4.1 Definitions
4.1.1 adjacent character misalignment — the vertical
distance, r, between the character baselines of two
adjacent characters on the same line (see Figure 6).
4.1.2 character height — the vertical distance between
the lowest and the highest centerpoints of a character.
4.1.3 character separation — the horizontal distance
between the adjacent boundaries of any characters (see
Figure 1).
4.1.4 character skew — the angle between the
character baseline and a line parallel with the bottom of
the character window (see Figure 5).
4.1.5 character spacing — the horizontal distance
between the character spacing reference lines of the
adjacent characters (see Figure 1).
4.1.6 character width — the horizontal distance
between the most left and the most right centerpoint of
a character.
4.1.7 code field (also known as character window) —
the rectangular window within which all characters
must be contained (see Figure 4).
4.1.8 front surface of the wafer — the surface upon
which active semiconductor devices have been, or will
be, fabricated.
NOTE 1: This can be either the V-Groove or Dovetail side of
the GaAs wafer.
4.1.9 line character misalignment — the vertical
distance, R, between the character baselines of any two
characters on the same line (see Figure 7).
5 Shape and Size of Marking
5.1 Dot matrix method shall be used to write charac-
ters. The minimum matrix shall be 5 dots horizontal
and 9 dots vertical as shown in Figure 1. More dots
may be used.
NOTE 2: The 5 × 9 dot matrix shown in Figure 1 is the
minimum number of dots allowed. More dots may be used,
up to and including a solid line. A solid line is not
recommended, since it may increase wafer breakage.
5.2 Character Dimensions and Spacing — See Table
1, Table 2, and Figure 1.