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SEMI E76-0299     SEMI 1998, 1999 7 8 Documentation Recomme ndations 8.1 Equipm ent suppliers should pr ovide the followin g doc umentatio n conc erning eq uipment p oint of connections and/or tem p late, jig, and pr…

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SEMI E76-0299
SEMI 1998, 1999
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Figure 1
Template Example
Figure 2
Jig Example
SEMI E76-0299
SEMI 1998, 1999
7
8 Documentation Recommendations
8.1 Equipment suppliers should provide the following
documentation concerning equipment point of
connections and/or template, jig, and pre-facilitation
pedestal to the device manufacturers. The device
manufacturer should provide to the supplier, the dates
the documentation is required if it is not already
specified in this guide.
a) All documentation should be supplied prior to
the equipment delivery to the device
manufacturer (as deemed appropriate by both
the device manufacturer and supplier) and
includes a minimum of two sets per piece of
equipment .
b) Text and step-by-step procedures should be
written in a concise, coherent manner enabling
the device manufacturers to achieve and
sustain all system performance goals.
c) All drawing documentation provided
electronically should be in a format which is
compatible with standard computer aided
design (CAD) software used by device
manufacturers. The CAD format should be
compatible with common CAD systems, to
include but not limited to, .DWG, .DXF,
.DXB, .PS, and .WMF file extensions.
d) The documentation should match the revision
of the equipment delivered.
8.2 The equipment supplier should notify the device
manufacturer within 30 days of any equipment
configuration changes which have an impact on the
facility or installation requirements. These changes
include, but are not limited to, equipment dimensions,
equipment elevation, and equipment points of
connection. There should be no changes made within 3
weeks of equipment shipment.
8.3 EPOC Documentation
8.3.1 Equipment requirements for utilities and
installation should be provided by the equipment
supplier. Included EPOC documentation should contain
but not be limited to the following information.
a) Floor space requirements (footprint).
b) EPOC matrix indicating service, size/type of
connection, location plane, and x,y,z
dimensions relative to equipment datum point.
c) Two dimensional drawings showing the
equipment points of connection that specify the
protrusion depths.
8.3.2 For interface panels, the equipment supplier
should provide documentation that includes clear
instruction for assembly and positioning the interface
panel, a key that clearly identifies which EPOC’s are
included, and appropriate design drawings such that the
device manufacturer can include the interface panel in
their respective construction designs.
8.3.3 The following documentation is also required to
support the equipment installation activity but is not
directly related to the EPOC.
a) Equipment elevation drawings representing all
sides of the equipment.
b) Air conditioning and ventilation requirements
(acceptable temperature and humidity ranges,
exhaust plumbing, etc.).
c) Vibration requirements (acceptable amplitude
and frequency).
d) Electrical requirements (voltage, current,
wattage, number of phases, power quality,
supply voltage wave form requirements, etc.).
e) Vacuum amounts, gases (grade and flow),
chilled water flow and other environmental
requirements including plumbing requirements
(type, size, etc.) for each.
f) A section detailing the procedures to be
followed during equipment unpacking and
inspection.
g) A section detailing step-by-step set-up
procedures that will specifically outline
machine assembly and installation on the
factory floor.
8.4 Template, Jig, or Pre-facilitation Pedestal
Documentation.
8.4.1 For templates, jigs, and pre-facilitation pedestals,
the equipment supplier should provide documentation
that includes clear instruction for assembly, clear
instruction for aligning the template, jig, or pre-
facilitation pedestal relative to the equipment datum
point, and a key that clearly identifies which EPOC’s
are included. The documentation should also clearly
indicate which pieces of equipment (model and revision
number) that are supported by a specific template, jig,
or pre-facilitation pedestal.
8.4.2 For pre-facilitation pedestals, the equipment
supplier should also provide appropriate design
drawings and information such that the device
manufacturer can include the pedestal design in their
respective construction designs. In addition, the supplier
should provide applicable documentation required for
structural certification.
SEMI E76-0299
SEMI 1998, 1999
8
9 Related Documents
NOTE: All documents cited will be the latest published
versions.
9.1 SEMI Standards
SEMI E49 — Guide for Standard Performance,
Practices, and Sub-Assembly for High Purity Piping
Systems and Final Assembly for Semiconductor
Manufacturing Equipment
SEMI E49.1 — Guide for Tool Final Assembly,
Packaging and Delivery
SEMI E49.2 — Guide for High Purity Deionized Water
and Chemical Distribution Systems in Semiconductor
Manufacturing Equipment
SEMI E49.3 — Guide for Ultrahigh Purity Deionized
Water and Chemical Distribution Systems in
Semiconductor Manufacturing Equipment
SEMI E49.4 — Guide for High Purity Solvent
Distribution Systems in Semiconductor Manufacturing
Equipment
SEMI E49.5 — Guide for Ultrahigh Purity Solvent
Distribution Systems in Semiconductor Manufacturing
Equipment
SEMI E49.6 — Guide for Subsystem Assembly and
Testing Procedures — Stainless Steel Systems
SEMI E49.7 — Guide for Subsystem Assembly and
Testing Procedures — Polymer Systems
SEMI E49.8 — Guide for High Purity Gas Distribution
Systems in Semiconductor Manufacturing Equipment
SEMI E49.9 — Guide for Ultrahigh Purity Gas
Distribution Systems in Semiconductor Manufacturing
Equipment
SEMI E51 — Guide for Typical Facilities Services and
Termination Matrix
SEMI S8 — Safety Guidelines for Ergonomics/Human
Factors Engineering of Semiconductor Manufacturing
Equipment.