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SEMI M57-0705 © SEMI 2004, 2005 5 ITEM SPECIFICATION MEASUREMENT METHOD 5-4.1.8 Zinc [ ]Not greater th an [  10 ]a toms/cm 2 [ ]ICP/MS; [ ]AAS; [ ]SEMI MF1617 (SIMS); [ ]SEMI M33 (TXRF); [ ]ISO 14706 (TXRF); [ ]Other: (…

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SEMI M57-0705 © SEMI 2004, 2005 4
Table 1 Silicon Wafer Specification Format for Order Entry, Part 5 Annealed Wafers
ITEM SPECIFICATION MEASUREMENT METHOD
5-1. ANNEALING CONDITIONS
5-1.1 Annealing Atmosphere [ ]Hydrogen; [ ]Argon; [ ]Other: (specify)_____
5-2. POST-ANNEAL WAFER PREPARATION CHARACTERISTIC
5-2.1 Edge Surface Condition [ ]Ground; [ ]Etched; [ ]Polished
A
5-3. POST-ANNEAL DIMENSIONAL CHARACTERISTICS
5-3.1 Warp
[ ] µm; max.
[ ]SEMI MF657; [ ]SEMI MF1390; [ ]Other: (specify)________
5-3.2 Flatness, Site
Acronym
#2
: [ ] [ ] [ ] [ ] Value: Not greater than [ ]µm
Site Size ___ mm × ___ mm
% Usable Area________
[ ]Include partial sites; [ ]Do not include partial sites
Offset: x = [ ] mm, y = [ ] mm
[ ]SEMI MF1530; [ ]Other: (specify)_____________
5-4. POST-ANNEAL FRONT SURFACE CHEMISTRY
5-4.1 Surface Metal Contamination
5-4.1.1 Sodium
[ ]Not greater than [ 10 ]atoms/cm
2
[ ]ICP/MS; [ ]AAS; [ ]SEMI MF1617 (SIMS);
[ ]Other: (specify)_____________
5-4.1.2 Aluminum
[ ]Not greater than [ 10 ]atoms/cm
2
[ ]ICP/MS; [ ]AAS; [ ]SEMI MF1617 (SIMS);
[ ]Other: (specify)_____________
5-4.1.3 Potassium
[ ]Not greater than [ 10 ]atoms/cm
2
[ ]ICP/MS; [ ]AAS; [ ]SEMI MF1617 (SIMS);
[ ]SEMI M33 (TXRF); [ ]ISO 14706 (TXRF);
[ ]Other: (specify)_____________
5-4.1.4 Chromium
[ ]Not greater than [ 10 ]atoms/cm
2
[ ]ICP/MS; [ ]AAS; [ ]SEMI MF1617 (SIMS);
[ ]SEMI M33 (TXRF); [ ]ISO 14706 (TXRF);
[ ]Other: (specify)_____________
5-4.1.5 Iron
[ ]Not greater than [ 10 ]atoms/cm
2
[ ]ICP/MS; [ ]AAS; [ ]SEMI MF1617 (SIMS);
[ ]SEMI M33 (TXRF); [ ]ISO 14706 (TXRF);
[ ]Other: (specify)_____________
5-4.1.6 Nickel
[ ]Not greater than [ 10 ]atoms/cm
2
[ ]ICP/MS; [ ]AAS; [ ]SEMI MF1617 (SIMS);
[ ]SEMI M33 (TXRF); [ ]ISO 14706 (TXRF);
[ ]Other: (specify)_____________
5-4.1.7 Copper
[ ]Not greater than [ 10 ]atoms/cm
2
[ ]ICP/MS; [ ]AAS; [ ]SEMI MF1617 (SIMS);
[ ]SEMI M33 (TXRF); [ ]ISO 14706 (TXRF);
[ ]Other: (specify)_____________
SEMI M57-0705 © SEMI 2004, 2005 5
ITEM SPECIFICATION MEASUREMENT METHOD
5-4.1.8 Zinc
[ ]Not greater than [ 10 ]atoms/cm
2
[ ]ICP/MS; [ ]AAS; [ ]SEMI MF1617 (SIMS);
[ ]SEMI M33 (TXRF); [ ]ISO 14706 (TXRF);
[ ]Other: (specify)_____________
5-4.2 Other Surface Metals (List Separately)
5-4.2.1 Calcium
[ ]Not greater than [ 10 ]atoms/cm
2
[ ]ICP/MS; [ ]AAS; [ ]SEMI MF1617 (SIMS);
[ ]SEMI M33 (TXRF); [ ]ISO 14706 (TXRF);
[ ]Other: (specify)_____________
5-5. POST-ANNEAL FRONT SURFACE INSPECTION CHARACTERISTICS
5-5.1 Slip [ ]None; [ ]Other: (specify)___________ [ ]SEMI MF1809; [ ]JIS H 0609; [ ]DIN 50434;
[ ]DIN 50443/1; [ ]Other: (specify)_________
5-5.2 Oxidation Induced Stacking
Faults (OSF)
[ ]None; [ ]Not greater than [ ] per cm
2
Test Cycle: [ ]SEMI MF1727;
[ ]JIS H 0609; [ ]Other: (specify)____
Observation Method: [ ]SEMI MF1726;
[ ]JIS H 0609; [ ]DIN 50443/1;
[ ]Other: (specify)____________
5-5.3 Scratches – Macro
[ ]None; Total Length = [ ]mm [ ]SEMI MF523; [ ]JIS H 0614; [ ]SSIS;
#3
[ ]Other: (specify)___________
5-5.4 Scratches – Micro [ ]None; [ ]Total Length = [ ]mm [ ]SEMI MF523; [ ]JIS H 0614; [ ]SSIS;
#3
[ ]Other: (specify)___________
5-5.5 Haze
[ ]None; [ ]Other: (specify)___________ [ ]SEMI MF523; [ ]JIS H 0614; [ ]SSIS;
#3
[ ]Other: (specify)___________
5-5.6 Localized Light Scatterers
(Total LLS)
Size: [ ] m (LSE) Count: [ ] [ ] per wafer; [ ] per cm
2
Size: [ ] m (LSE) Count: [ ] [ ] per wafer; [ ] per cm
2
[ ]SEMI MF523; [ ]JIS H 0614; [ ]SSIS;
#3
[ ]Other: (specify)___________
5-5.7 Localized Light Scatterers
(COP only)
Size: [ ] m (LSE) Count: [ ] [ ] per wafer; [ ] per cm
2
[ ]SEMI MF523; [ ]JIS H 0614; [ ]SSIS;
#3
[ ]Other: (specify)___________
5-5.8 Other Front Surface Defects Terracing, Surface microroughness, Nanotopography, and other
attributes as discussed between supplier and customer
As discussed between supplier and customer.
5-6. POST- ANNEAL BACK SURFACE INSPECTION CHARACTERISTICS
5-6.1 Contamination/Area
[ ]None; [ ]Other: (specify)___________ [ ]SEMI MF 523; [ ]JIS H 0614; [ ]Other: (specify)__________
5-6.2 Other Back Surface Defects
Support-related back surface defects as discussed between
supplier and customer
As discussed between supplier and customer.
5-7. OTHER POST-ANNEAL CHARACTERISTICS
5-7.1 Bulk Iron (Fe)
[ ]Not greater than [ ] 10
[ ]
atoms/cm
3
[ ]SEMI MF391; [ ]SEMI MF1535; [ ]Other:
(specify)______________
5-7.2 Depth of BMD Denuded Zone
[ ]more than [ ] m
As agreed between supplier and customer
SEMI M57-0705 © SEMI 2004, 2005 6
ITEM SPECIFICATION MEASUREMENT METHOD
5-7.3 BMD Density
Range [ ] 10
[ ]
to [ ] 10
[ ]
Unit
Unit: [ ]cm
2
; [ ]cm
3
Test Cycle: SEMI MF1239 [ ]A, [ ]B;
Other: (specify)________
5-7.4 Other Post-Anneal
Characteristics
Surface boron depletion, dissolved hydrogen in the case of
hydrogen annealed wafer, post-annealed oxygen, and silicon
nitride precipitates and defects in the case of nitrogen-doped
silicon may be discussed between supplier and customer.
As discussed between supplier and customer.
#1
If specified as polished, this term is meant to imply a surface condition and not a particular processing technique. If desired, a quantitative measure of surface finish may optionally be indicated by
specifying the rms microroughness over a specified spatial frequency (or wavelength) range. Because a standardized test method has not yet been developed for this metric, both values and test
procedures, including sampling plan and detrending procedures, shall be agreed upon between supplier and customer.
#2
Flatness Acronyms are defined in the Flatness Decision Tree in Appendix 1 of SEMI M1.
#3
In today’s technology, it may be possible to inspect for some of these items using automated surface scanning inspection systems (SSIS). Such systems should be calibrated according to SEMI M53
using polystyrene latex spheres deposited in accordance with SEMI M58. Some indication of the defects separable by such instruments is provided in SEMI M35; however, a standard test procedure has
yet to be developed. Application of automated inspection with the use of an SSIS must be agreed upon between supplier and customer.